Evaluation of Surgical Complications in a University Hospital: A Novel Root Cause Analysis Classification

2021 ◽  
Vol 104 (4) ◽  
pp. 522-526

Objective: To analyze general surgery morbidity and mortality in King Chulalongkorn Memorial Hospital to identify the preventability and root causes of the complications using a novel root cause analysis (RCA) classification according to the period that the corrective action could have been introduced to prevent the complications. Materials and Methods: The authors retrospectively reviewed the morbidity and mortality between October 2012 and October 2016. The data collection included diagnostic groups, organ systems, severity, preventability, and RCA of the complications. Functional outcomes of the patients were also obtained such as full recovery, residual functional impairment, and death. Results: Six hundred seventy-six surgical complications occurred out of 19,440 surgeries performed (3.47%) during the study period. The most common organ system involved was gastrointestinal system (42.8%), followed by wound complications (18.9%). According to the Clavien-Dindo classification, the severity of the complications was 20.7% as grade 1, 18.9% as grade 2, 41.6% as grade 3, 3.7% as grade 4, and 15.1% as grade 5. The authors classified 27 complications as preventable (4.0%), 573 as potentially preventable (84.8%), and 76 as unpreventable (11.2%). RCA of the preventable and potentially preventable complications using the present RCA classification revealed that root causes were defect in the diagnoses (0.5%), defect in management decision making (5.0%), defect in preoperative management (6.1%), defect in intraoperative management (61.3%), and defect in postoperative management (27.0%). The most common defect in intraoperative management was inappropriate surgical approach or technique (58.7%). Most patients (80.2%) fully recovered from the complications, while 4.7% had residual functional impairment, and 15.1% died. Conclusion: The present study demonstrated that most complications in general surgery were preventable or potentially preventable. RCA showed that the most common root cause was the defect is intraoperative management, especially inappropriate surgical approach or technique. Keywords: Surgical complications; Root cause analysis; Morbidity and mortality conference

2015 ◽  
Vol 72 (6) ◽  
pp. e286-e293 ◽  
Author(s):  
Rajesh Ramanathan ◽  
Therese M. Duane ◽  
Brian J. Kaplan ◽  
Doris Farquhar ◽  
Vigneshwar Kasirajan ◽  
...  

2011 ◽  
pp. 78-86
Author(s):  
R. Kilian ◽  
J. Beck ◽  
H. Lang ◽  
V. Schneider ◽  
T. Schönherr ◽  
...  

2012 ◽  
Vol 132 (10) ◽  
pp. 1689-1697
Author(s):  
Yutaka Kudo ◽  
Tomohiro Morimura ◽  
Kiminori Sugauchi ◽  
Tetsuya Masuishi ◽  
Norihisa Komoda

Author(s):  
Dan Bodoh ◽  
Kent Erington ◽  
Kris Dickson ◽  
George Lange ◽  
Carey Wu ◽  
...  

Abstract Laser-assisted device alteration (LADA) is an established technique used to identify critical speed paths in integrated circuits. LADA can reveal the physical location of a speed path, but not the timing of the speed path. This paper describes the root cause analysis benefits of 1064nm time resolved LADA (TR-LADA) with a picosecond laser. It shows several examples of how picosecond TR-LADA has complemented the existing fault isolation toolset and has allowed for quicker resolution of design and manufacturing issues. The paper explains how TR-LADA increases the LADA localization resolution by eliminating the well interaction, provides the timing of the event detected by LADA, indicates the propagation direction of the critical signals detected by LADA, allows the analyst to infer the logic values of the critical signals, and separates multiple interactions occurring at the same site for better understanding of the critical signals.


Author(s):  
Zhigang Song ◽  
Jochonia Nxumalo ◽  
Manuel Villalobos ◽  
Sweta Pendyala

Abstract Pin leakage continues to be on the list of top yield detractors for microelectronics devices. It is simply manifested as elevated current with one pin or several pins during pin continuity test. Although many techniques are capable to globally localize the fault of pin leakage, root cause analysis and identification for it are still very challenging with today’s advanced failure analysis tools and techniques. It is because pin leakage can be caused by any type of defect, at any layer in the device and at any process step. This paper presents a case study to demonstrate how to combine multiple techniques to accurately identify the root cause of a pin leakage issue for a device manufactured using advanced technology node. The root cause was identified as under-etch issue during P+ implantation hard mask opening for ESD protection diode, causing P+ implantation missing, which was responsible for the nearly ohmic type pin leakage.


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