scholarly journals Influence of Basic Component of plating Bath. The Role of Electroless Copper Plating Bath Components.

1999 ◽  
Vol 50 (2) ◽  
pp. 129-134 ◽  
Author(s):  
Tomoyuki FUJINAMI
Keyword(s):  
Basic Component ◽  
Copper Plating ◽  
Electroless Copper Plating ◽  
Plating Bath ◽  
Electroless Copper

scholarly journals Indirect determination of pH in electroless copper plating bath by spectrophotometry.

1985 ◽  
Vol 36 (7) ◽  
pp. 289-290
Author(s):  
Shozo MIZUMOTO ◽  
Hidemi NAWAFUNE ◽  
Motoo KAWASAKI ◽  
Akemi KINOSHITA ◽  
Ken ARAKI
Keyword(s):  
Copper Plating ◽  
Electroless Copper Plating ◽  
Plating Bath ◽  
Indirect Determination ◽  
Electroless Copper

Role of additives in electroless copper plating using hypophosphite as reducing agent

2012 ◽  
Vol 206 (15) ◽  
pp. 3405-3409 ◽  
Author(s):  
Xueping Gan ◽  
Kechao Zhou ◽  
Wenbin Hu ◽  
Dou Zhang
Keyword(s):  
Reducing Agent ◽  
Copper Plating ◽  
Electroless Copper Plating ◽  
Electroless Copper

New electroless copper plating bath using sodium hypophosphite as reductant

2012 ◽  
Vol 28 (5) ◽  
pp. 377-381 ◽  
Author(s):  
X L Yuan ◽  
J Gao ◽  
Z F Yang ◽  
Z X Wang ◽  
Z L Wang
Keyword(s):  
Sodium Hypophosphite ◽  
Copper Plating ◽  
Electroless Copper Plating ◽  
Plating Bath ◽  
Electroless Copper

Electrochemical Kinetics Study of Electroless Copper Plating for Electronics Application

2004 ◽  
Vol 449-452 ◽  
pp. 393-396
Author(s):  
Dae Geun Kim ◽  
Jin Soo Bae ◽  
Jae Ho Lee ◽  
Yang Do Kim ◽  
Yoo Min Ahn
Keyword(s):  
Electrochemical Techniques ◽  
Deposition Process ◽  
Electrolyte Composition ◽  
Electrochemical Kinetics ◽  
Kinetics Study ◽  
Mixed Potential ◽  
Copper Plating ◽  
Electroless Copper Plating ◽  
Electroless Copper

Electroless copper plating was investigated for the electronics applications, such as a metallization for ULSI and MEMS etc. The role of electrolyte composition on the kinetics and mechanism of the electroless copper deposition process was described. Electrochemical techniques were employed for the investigations. The mixed potential and current were determined and then those were compared with experimental deposition rate. The kinetics is strongly influenced by the pretreatment and additive concentrations.

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