scholarly journals Produktivitas Budidaya Udang Vaname (Litopenaeus vannamei) Tambak Intensif di PT. Hasil Nusantara Mandiri Kelurahan Sungai Bulan Kecamatan Singkawang Utara

2021 ◽  
Vol 1 (2) ◽  
pp. 53-63
Author(s):  
Suryadi ◽  
Dewi Merdekawati
Keyword(s):  
Litopenaeus Vannamei ◽  
Penaeus Monodon ◽  
Root Cause Analysis ◽  
Cause Analysis ◽  
Root Cause

Udang yang potensial untuk dibudidayakan dalam tambak adalah Udang Windu (Penaeus monodon) dan Udang Vaname (Litopenaeus vannamei). Adapun keunggulan dari udang vaname ini yaitu tahan dari penyakit, pertumbuhannya yang cepat dengan masa pemeliharaannya relatif singkat kisaran 100-110 hari, sintasan selama pemeliharaan tinggi dan nilai konversi pakan (FCR) rendah (1:1,3). Tujuan penelitian yaitu mengevaluasi kinerja budidaya udang vaname, mengidentifikasi masalah dan rekomendasi usulan intervensi pada budidaya udang vaname, menganalisis pendapatan berkaitan dengan produktivitas budidaya untuk menegtahui tingkat keuntungan. Penelitian dilaksanakan bulan Maret – Mei 2021 di PT. Hasil Nusantara Mandiri Kelurahan Sungai Bulan Kecamatan Singkawang Utara. Penelitian ini menggunakan teknik pendekatan deskriptif dengan mengamati indikator produktivitas, SR, FCR, dan kualitas air sebagai data pendukung, identifikasi masalah digunakan Root Cause Analysis dan Fishbone Analysis. Hasil menunjukan produktivitas yang di peroleh 24.233,48 kg yang mana terget perusahaan untuk 4 kolam yaitu 48.000 kg. Pendapatan atau keuntungan yaitu sebesar Rp. 106.199.842.

Root Cause analysis of SG tube ODSCC indications within the tube sheets of NPP biblis unit A

2011 ◽  
pp. 78-86
Author(s):  
R. Kilian ◽  
J. Beck ◽  
H. Lang ◽  
V. Schneider ◽  
T. Schönherr ◽  
...  
Keyword(s):  
Root Cause Analysis ◽  
Cause Analysis ◽  
Root Cause

Rule Construction and its Execution for Root Cause Analysis

2012 ◽  
Vol 132 (10) ◽  
pp. 1689-1697
Author(s):  
Yutaka Kudo ◽  
Tomohiro Morimura ◽  
Kiminori Sugauchi ◽  
Tetsuya Masuishi ◽  
Norihisa Komoda
Keyword(s):  
Root Cause Analysis ◽  
Cause Analysis ◽  
Root Cause

Root Cause Analysis Techniques Using Picosecond Time Resolved LADA

2014 ◽  
Author(s):  
Dan Bodoh ◽  
Kent Erington ◽  
Kris Dickson ◽  
George Lange ◽  
Carey Wu ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Picosecond Laser ◽  
Root Cause Analysis ◽  
Fault Isolation ◽  
Time Resolved ◽  
Cause Analysis ◽  
Root Cause ◽  
Design And Manufacturing ◽  
Multiple Interactions ◽  
Established Technique

Abstract Laser-assisted device alteration (LADA) is an established technique used to identify critical speed paths in integrated circuits. LADA can reveal the physical location of a speed path, but not the timing of the speed path. This paper describes the root cause analysis benefits of 1064nm time resolved LADA (TR-LADA) with a picosecond laser. It shows several examples of how picosecond TR-LADA has complemented the existing fault isolation toolset and has allowed for quicker resolution of design and manufacturing issues. The paper explains how TR-LADA increases the LADA localization resolution by eliminating the well interaction, provides the timing of the event detected by LADA, indicates the propagation direction of the critical signals detected by LADA, allows the analyst to infer the logic values of the critical signals, and separates multiple interactions occurring at the same site for better understanding of the critical signals.

Root Cause Analysis for Pin Leakage

2016 ◽  
Author(s):  
Zhigang Song ◽  
Jochonia Nxumalo ◽  
Manuel Villalobos ◽  
Sweta Pendyala
Keyword(s):  
Failure Analysis ◽  
Root Cause Analysis ◽  
Advanced Technology ◽  
Process Step ◽  
Cause Analysis ◽  
Hard Mask ◽  
Technology Node ◽  
Root Cause ◽  
Tools And Techniques

Abstract Pin leakage continues to be on the list of top yield detractors for microelectronics devices. It is simply manifested as elevated current with one pin or several pins during pin continuity test. Although many techniques are capable to globally localize the fault of pin leakage, root cause analysis and identification for it are still very challenging with today’s advanced failure analysis tools and techniques. It is because pin leakage can be caused by any type of defect, at any layer in the device and at any process step. This paper presents a case study to demonstrate how to combine multiple techniques to accurately identify the root cause of a pin leakage issue for a device manufactured using advanced technology node. The root cause was identified as under-etch issue during P+ implantation hard mask opening for ESD protection diode, causing P+ implantation missing, which was responsible for the nearly ohmic type pin leakage.

Root Cause Analysis for the ATIRCM/CMWS Program

2010 ◽  
Author(s):  
Harold S. Balaban ◽  
Paul M. Kodzwa ◽  
Andrew S. Rehwinkel ◽  
Gregory A. Davis ◽  
Patricia F. Bronson
Keyword(s):  
Root Cause Analysis ◽  
Cause Analysis ◽  
Root Cause
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