2019 IEEE International Workshop on Integrated Power Packaging (IWIPP)
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9781538676103
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scholarly journals Evaluation of the PCB-embedding technology for a 3.3 kW converter

2019 ◽  
Author(s):  
Remy Caillaud ◽  
Johan Le Lesle ◽  
Cyril Buttay ◽  
Florent Morel ◽  
Roberto Mrad ◽  
...  

Development and evaluation of SiC inverter using Ni micro plating bonding power module

2019 ◽  
Author(s):  
Akihiro Kawagoe ◽  
Tomoya Itose ◽  
Akihiro Imakiire ◽  
Masahiro Kozako ◽  
Masayuki Hikita ◽  
...  
Keyword(s):  
Power Module
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