Photovoltaic Power Plant Collection and Connection to HVDC Grid with High Voltage DC/DC Converter

Photovoltaic (PV) power plant collection and connection to a high voltage direct current (HVDC) grid has many advantages. Compared with the traditional AC collection and grid-connection scheme, it can reduce the power conversion links and improve the system efficiency. As one of the most important devices in the application of a PV HVDC collection and grid-connection system, a high voltage, large capacity, high step-up ratio DC/DC converter is the critical technology. A DC/DC converter scheme based on a boost full bridge isolated power module cascaded in input parallel output series (IPOS) structure is proposed to meet the technical requirements of PV power conversion with high voltage, large capacity, and high step-up ratio. The operation mode of the power module is analyzed, the soft switching method is proposed, and the constraint to realize the soft switching of the power module is deduced. Aiming to resolve the problem of multi-module voltage and current equalization in a cascaded DC/DC converter, a distributed module equalization control strategy is proposed to realize the reliable operation of a power module and converter. A 5 kV/80 kW standard power module is developed, the DC/DC converter experimental platform is built, and the proposed system scheme and control strategy are verified by experiments. Based on a 14-power module input parallel output series connection, a ±30 kV/1 MW PV DC/DC converter is developed, a ±30 kV PV HVDC collection and grid-connection demonstration system is established, and the experimental test is completed to realize the stable operation of the system.

Influence of Alloying Elements on the Mechanical Properties of Anodized Aluminum and on the Adhesion of Copper Metallization

The active development of the power electronics market and a constant increase in the prices of components require new materials and approaches, including a power module packaging technology. The use of aluminum instead of copper in the power module baseplate is an interesting and promising solution. The insulated metal baseplate is one of the most extensively developed technologies nowadays. The object of this study is an insulated metal substrate based on anodized aluminum. The main goal of the article is the comparison of copper topology adhesion to an anodized aluminum oxide layer formed on different aluminum alloys with aluminum content of at least 99.3 wt %. Peel test and pull-off adhesions showed a twofold difference for both aluminum alloys. The high ordered defect-free anodized alumina formed on alloys with copper content of 0.06 wt % had a mean pull-off adhesion of 27 N/mm2 and hardness of 489 HV. In the case of the alloy with copper content of around 0.15 wt %, it had hardness of 295 HV and a mean pull-off adhesion of 12 N/mm2. The results of our microstructure investigation showed that anodized alumina based on alloys with copper content of around 0.15 wt % is fragile due to spherical holes. Summing up the results, it can be concluded that not all initial impurities are critical for anodized alumina, but some, specifically copper, dramatically decreased the mechanical properties of anodized alumina.