2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS)
Latest Publications

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(FIVE YEARS 0)

Published By IEEE

9781509061105

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Delay rational macromodels of long interconnects using Loewner Matrix

2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS) ◽

10.1109/epeps.2016.7835428 ◽

2016 ◽

Cited By ~ 1

Author(s):

Mohamed Sahouli ◽

Anestis Dounavis

Machine learning in physical design

2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS) ◽

10.1109/epeps.2016.7835438 ◽

2016 ◽

Cited By ~ 6

Author(s):

Bowen Li ◽

Paul D. Franzon

Keyword(s):

Machine Learning ◽

Physical Design

Loewner-based macromodeling with exact interpolation constraints

2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS) ◽

10.1109/epeps.2016.7835414 ◽

2016 ◽

Cited By ~ 2

Author(s):

Sanda Lefteriu ◽

Stefano Grivet-Talocia

Scalable and broadband modeling of coupled on-chip spiral inductors up to 110 GHz

2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS) ◽

10.1109/epeps.2016.7835410 ◽

2016 ◽

Author(s):

Lei Zheng ◽

Andrew R. Ferrara ◽

Andreas Weisshaar

Keyword(s):

Spiral Inductors ◽

On Chip

New detailed understanding of the mechanism of radiation in interconnect problems

2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS) ◽

10.1109/epeps.2016.7835454 ◽

2016 ◽

Author(s):

Ying S. Cao ◽

Li Jun Jiang ◽

Albert E. Ruehli ◽

Jun Fan ◽

James. L. Drewniak

Keyword(s):

Detailed Understanding

A method to assess the radiated susceptibility of printed circuit boards

2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS) ◽

10.1109/epeps.2016.7835431 ◽

2016 ◽

Author(s):

G. Kevin Zhu ◽

Werner Thiel ◽

J. Eric Bracken

Keyword(s):

Printed Circuit Boards ◽

Circuit Boards ◽

Printed Circuit

Performance modeling and optimization for on-chip interconnects in cross-bar ReRAM memory arrays

2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS) ◽

10.1109/epeps.2016.7835434 ◽

2016 ◽

Author(s):

Javaneh Mohseni ◽

Chenyun Pan ◽

Azad Naeemi

Keyword(s):

Performance Modeling ◽

Modeling And Optimization ◽

Memory Arrays ◽

On Chip

Loewner Matrix interpolation for noisy S-parameter data

2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS) ◽

10.1109/epeps.2016.7835426 ◽

2016 ◽

Cited By ~ 2

Author(s):

Muhammad Kabir ◽

Yi Qing Xiao ◽

Roni Khazaka

Keyword(s):

S Parameter ◽

Matrix Interpolation

The relationship between Galerkin and collocation methods in statistical transmission line analysis

2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS) ◽

10.1109/epeps.2016.7835412 ◽

2016 ◽

Cited By ~ 2

Author(s):

Paolo Manfredi ◽

Daniel De Zutter ◽

Dries Vande Ginste

Keyword(s):

Transmission Line ◽

Collocation Methods ◽

Galerkin And Collocation Methods ◽

The Relationship ◽

Line Analysis

Passivity enforcement using incomplete complex frequency hopping

2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS) ◽

10.1109/epeps.2016.7835413 ◽

2016 ◽

Cited By ~ 2

Author(s):

Yi Qing Xiao ◽

Muhammad Kabir ◽

Roni Khazaka

Keyword(s):

Frequency Hopping ◽

Complex Frequency ◽

Passivity Enforcement

2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Delay rational macromodels of long interconnects using Loewner Matrix

Machine learning in physical design

Loewner-based macromodeling with exact interpolation constraints

Scalable and broadband modeling of coupled on-chip spiral inductors up to 110 GHz

New detailed understanding of the mechanism of radiation in interconnect problems

A method to assess the radiated susceptibility of printed circuit boards

Performance modeling and optimization for on-chip interconnects in cross-bar ReRAM memory arrays

Loewner Matrix interpolation for noisy S-parameter data

The relationship between Galerkin and collocation methods in statistical transmission line analysis

Passivity enforcement using incomplete complex frequency hopping

2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS)
Latest Publications