2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

Transient thermal simulation of high power LED and its challenges

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2017.7926221 ◽

2017 ◽

Cited By ~ 6

Author(s):

Sanchit Tandon ◽

E Liu ◽

Thomas Zahner ◽

Sebastian Besold ◽

Wolfgang Kalb ◽

...

Keyword(s):

High Power ◽

Thermal Simulation ◽

High Power Led ◽

Transient Thermal

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Design and simulation of a 2-bit distributed S-band MEMS phase shifter

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2017.7926263 ◽

2017 ◽

Cited By ~ 1

Author(s):

Noor Amalina Ramli ◽

Tughrul Arslan

Keyword(s):

Phase Shifter

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The onset of plastic flow in copper materials used for rigid and flexible PCB

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2017.7926240 ◽

2017 ◽

Cited By ~ 1

Author(s):

S. Wiese ◽

F. Kraemer ◽

J. Al Ahmar

Keyword(s):

Plastic Flow ◽

Materials Used ◽

Flexible Pcb

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Validation of different SAC305 material models calibrated on isothermal tests using in-situ TMF measurement of thermally induced shear load

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2017.7926260 ◽

2017 ◽

Author(s):

M. Kuczynska ◽

N. Schafet ◽

U. Becker ◽

R. Metasch ◽

M. Roellig ◽

...

Keyword(s):

Shear Load ◽

Material Models ◽

Thermally Induced

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Leveraging accelerated testing to assess the reliability of two-stage and multi-channel drivers

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2017.7926224 ◽

2017 ◽

Author(s):

J. Lynn Davis ◽

Curtis Perkins ◽

Aaron Smith ◽

Terry Clark ◽

Karmann Mills

Keyword(s):

Accelerated Testing ◽

Two Stage

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Luminescence mechanism analysis on high power tunable color temperature Chip-on-Board white LED modules

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2017.7926245 ◽

2017 ◽

Author(s):

Jiajie Fan ◽

Chaoyi Xie ◽

Cheng Qian ◽

Xuejun Fan ◽

Guoqi Zhang

Keyword(s):

High Power ◽

Color Temperature ◽

White Led ◽

Mechanism Analysis

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A PoF and statistics combined reliability prediction for LED arrays in lamps

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2017.7926264 ◽

2017 ◽

Cited By ~ 1

Author(s):

Bo Sun ◽

Xuejun Fan ◽

Jiajie Fan ◽

Cheng Qian ◽

G.Q. Zhang

Keyword(s):

Reliability Prediction ◽

Led Arrays

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Model order reduction as an integral part of e-mobility development process

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2017.7926301 ◽

2017 ◽

Author(s):

Thomas Iberer

Keyword(s):

Model Order Reduction ◽

Development Process ◽

Order Reduction ◽

Model Order

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Optimization of Through Crackstop via using finite element modeling

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2017.7926212 ◽

2017 ◽

Cited By ~ 2

Author(s):

Mohamed A. Rabie ◽

Nick Polomoff

Keyword(s):

Finite Element ◽

Finite Element Modeling ◽

Element Modeling

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The numerical analysis of heat transfer at nanoscale using full and reduced DPL models

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2017.7926261 ◽

2017 ◽

Cited By ~ 2

Author(s):

Tomasz Raszkowski ◽

Agnieszka Samson ◽

Mariusz Zubert ◽

Marcin Janicki ◽

Andrzej Napieralski

Keyword(s):

Heat Transfer ◽

Numerical Analysis

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2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Transient thermal simulation of high power LED and its challenges

Design and simulation of a 2-bit distributed S-band MEMS phase shifter

The onset of plastic flow in copper materials used for rigid and flexible PCB

Validation of different SAC305 material models calibrated on isothermal tests using in-situ TMF measurement of thermally induced shear load

Leveraging accelerated testing to assess the reliability of two-stage and multi-channel drivers

Luminescence mechanism analysis on high power tunable color temperature Chip-on-Board white LED modules

A PoF and statistics combined reliability prediction for LED arrays in lamps

Model order reduction as an integral part of e-mobility development process

Optimization of Through Crackstop via using finite element modeling

The numerical analysis of heat transfer at nanoscale using full and reduced DPL models

Export Citation Format

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Transient thermal simulation of high power LED and its challenges

Design and simulation of a 2-bit distributed S-band MEMS phase shifter

The onset of plastic flow in copper materials used for rigid and flexible PCB

Validation of different SAC305 material models calibrated on isothermal tests using in-situ TMF measurement of thermally induced shear load

Leveraging accelerated testing to assess the reliability of two-stage and multi-channel drivers

Luminescence mechanism analysis on high power tunable color temperature Chip-on-Board white LED modules

A PoF and statistics combined reliability prediction for LED arrays in lamps

Model order reduction as an integral part of e-mobility development process

Optimization of Through Crackstop via using finite element modeling

The numerical analysis of heat transfer at nanoscale using full and reduced DPL models

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Latest Publications