Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507)
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Published By IMAPS - Int. Microelectron. & Packaging Soc

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Coating and dicing of wafer applied underfills for low-cost flip chip processing

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507) ◽

10.1109/isapm.2000.869265 ◽

2005 ◽

Author(s):

S.C. Busch ◽

Jicun Lu ◽

B. Smith

Keyword(s):

Flip Chip ◽

Low Cost ◽

Chip Processing

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Reliability investigations of FCOB assemblies with process-induced defects

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507) ◽

10.1109/isapm.2000.869242 ◽

2002 ◽

Author(s):

A. Schubert ◽

R. Dudek ◽

J. Kloeser ◽

B. Michel ◽

H. Reichl ◽

...

Keyword(s):

Induced Defects

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Measurement of water evaporation rate for popcorning

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507) ◽

10.1109/isapm.2000.869256 ◽

2002 ◽

Author(s):

J.I.-T. Chong ◽

D.C.C. Lam ◽

P. Tong

Keyword(s):

Evaporation Rate ◽

Water Evaporation

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Halogen-free materials for PWB and advanced package substrate

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507) ◽

10.1109/isapm.2000.869275 ◽

2002 ◽

Author(s):

H. Murai ◽

Y. Tadeda ◽

N. Takano ◽

K. Ikeda

Keyword(s):

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Materials options for dielectrics in integrated capacitors

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507) ◽

10.1109/isapm.2000.869240 ◽

2002 ◽

Author(s):

R. Ulrich ◽

L. Schaper

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Adhesion characterization of no flow underfill baselined with fast flow snap cure

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507) ◽

10.1109/isapm.2000.869246 ◽

2002 ◽

Author(s):

J. Lu ◽

B. Smith ◽

D.F. Baldwin

Keyword(s):

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Novel single pass reflow encapsulant for flip chip application

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507) ◽

10.1109/isapm.2000.869250 ◽

2002 ◽

Author(s):

H. Wang ◽

T. Tomaso

Keyword(s):

Flip Chip ◽

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Hygroscopic behavior and in-line thermo-mechanical treatment of polymeric material effects on PBGA warpage

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507) ◽

10.1109/isapm.2000.869279 ◽

2002 ◽

Author(s):

J.C.L. Wu ◽

M. Liang ◽

A. Le ◽

Zine Chen ◽

S. Wu ◽

...

Keyword(s):

Polymeric Material ◽

Mechanical Treatment ◽

Thermo Mechanical Treatment ◽

Hygroscopic Behavior

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Qualification of the system electroless nickel bumps and PbSn5 for high temperature applications

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507) ◽

10.1109/isapm.2000.869251 ◽

2002 ◽

Author(s):

S. Anhock ◽

A. Ostmann ◽

R. Aschenbrenner ◽

H. Reichl

Keyword(s):

High Temperature ◽

Electroless Nickel ◽

Temperature Applications

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Investigation on effect of carbon black and polymer matrix on conductive polymer composites with positive temperature coefficient

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507) ◽

10.1109/isapm.2000.869296 ◽

2002 ◽

Author(s):

C.P. Wong ◽

S. Luo

Keyword(s):

Carbon Black ◽

Temperature Coefficient ◽

Polymer Composites ◽

Polymer Matrix ◽

Conductive Polymer ◽

Positive Temperature Coefficient ◽

Positive Temperature ◽

Conductive Polymer Composites

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