Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507)
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(FIVE YEARS 0)

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Published By IMAPS - Int. Microelectron. & Packaging Soc

0930815599

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Coating and dicing of wafer applied underfills for low-cost flip chip processing

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507) ◽

10.1109/isapm.2000.869265 ◽

2005 ◽

Cited By ~ 2

Author(s):

S.C. Busch ◽

Jicun Lu ◽

B. Smith

Keyword(s):

Flip Chip ◽

Low Cost ◽

Chip Processing

Reliability investigations of FCOB assemblies with process-induced defects

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507) ◽

10.1109/isapm.2000.869242 ◽

2002 ◽

Cited By ~ 3

Author(s):

A. Schubert ◽

R. Dudek ◽

J. Kloeser ◽

B. Michel ◽

H. Reichl ◽

...

Keyword(s):

Induced Defects

Materials options for dielectrics in integrated capacitors

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507) ◽

10.1109/isapm.2000.869240 ◽

2002 ◽

Cited By ~ 14

Author(s):

R. Ulrich ◽

L. Schaper

Adhesion characterization of no flow underfill baselined with fast flow snap cure

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507) ◽

10.1109/isapm.2000.869246 ◽

2002 ◽

Author(s):

J. Lu ◽

B. Smith ◽

D.F. Baldwin

Keyword(s):

Fast Flow

Measurement of water evaporation rate for popcorning

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507) ◽

10.1109/isapm.2000.869256 ◽

2002 ◽

Cited By ~ 1

Author(s):

J.I.-T. Chong ◽

D.C.C. Lam ◽

P. Tong

Keyword(s):

Evaporation Rate ◽

Water Evaporation

Halogen-free materials for PWB and advanced package substrate

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507) ◽

10.1109/isapm.2000.869275 ◽

2002 ◽

Author(s):

H. Murai ◽

Y. Tadeda ◽

N. Takano ◽

K. Ikeda

Keyword(s):

Halogen Free

Novel single pass reflow encapsulant for flip chip application

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507) ◽

10.1109/isapm.2000.869250 ◽

2002 ◽

Cited By ~ 6

Author(s):

H. Wang ◽

T. Tomaso

Keyword(s):

Flip Chip ◽

Single Pass

Hygroscopic behavior and in-line thermo-mechanical treatment of polymeric material effects on PBGA warpage

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507) ◽

10.1109/isapm.2000.869279 ◽

2002 ◽

Cited By ~ 1

Author(s):

J.C.L. Wu ◽

M. Liang ◽

A. Le ◽

Zine Chen ◽

S. Wu ◽

...

Keyword(s):

Polymeric Material ◽

Mechanical Treatment ◽

Thermo Mechanical Treatment ◽

Hygroscopic Behavior

Qualification of the system electroless nickel bumps and PbSn5 for high temperature applications

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507) ◽

10.1109/isapm.2000.869251 ◽

2002 ◽

Author(s):

S. Anhock ◽

A. Ostmann ◽

R. Aschenbrenner ◽

H. Reichl

Keyword(s):

High Temperature ◽

Electroless Nickel ◽

Temperature Applications

Development of super fine pattern PWB MOSAIC

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507) ◽

10.1109/isapm.2000.869278 ◽

2002 ◽

Author(s):

N. Komatsu ◽

K. Shimizu ◽

H. Fujita ◽

Y. Arimitsu ◽

S. Kishimoto

Keyword(s):

Fine Pattern

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IMAPS - Int. Microelectron. & Packaging Soc

Coating and dicing of wafer applied underfills for low-cost flip chip processing

Reliability investigations of FCOB assemblies with process-induced defects

Materials options for dielectrics in integrated capacitors

Adhesion characterization of no flow underfill baselined with fast flow snap cure

Measurement of water evaporation rate for popcorning

Halogen-free materials for PWB and advanced package substrate

Novel single pass reflow encapsulant for flip chip application

Hygroscopic behavior and in-line thermo-mechanical treatment of polymeric material effects on PBGA warpage

Qualification of the system electroless nickel bumps and PbSn5 for high temperature applications

Development of super fine pattern PWB MOSAIC

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507)
Latest Publications