Halogen-free materials for PWB and advanced package substrate

2002 ◽  
Author(s):  
H. Murai ◽  
Y. Tadeda ◽  
N. Takano ◽  
K. Ikeda
Keyword(s):  
Halogen Free

THE X2BO and X2BS (X = HYDROGEN OR HALOGEN) FREE RADICALS

2014 ◽  
Author(s):  
Dennis Clouthier ◽  
Phillip Sheridan ◽  
Bing Jin ◽  
Robert Grimminger
Keyword(s):  
Free Radicals ◽  
Halogen Free

Conductive Filament Formation in Printed Circuit Boards – Effects of Reflow Conditions and Flame Retardants

2009 ◽  
Author(s):  
Bhanu Sood ◽  
Michael Pecht
Keyword(s):  
Flame Retardants ◽  
Printed Circuit Boards ◽  
Electrochemical Process ◽  
Lead Free ◽  
Circuit Boards ◽  
Filament Formation ◽  
Conductive Filament ◽  
Printed Circuit ◽  
Free Solder ◽  
Halogen Free

Abstract Failures in printed circuit boards account for a significant percentage of field returns in electronic products and systems. Conductive filament formation is an electrochemical process that requires the transport of a metal through or across a nonmetallic medium under the influence of an applied electric field. With the advent of lead-free initiatives, boards are being exposed to higher temperatures during lead-free solder processing. This can weaken the glass-fiber bonding, thus enhancing conductive filament formation. The effect of the inclusion of halogen-free flame retardants on conductive filament formation in printed circuit boards is also not completely understood. Previous studies, along with analysis and examinations conducted on printed circuit boards with failure sites that were due to conductive filament formation, have shown that the conductive path is typically formed along the delaminated fiber glass and epoxy resin interfaces. This paper is a result of a year-long study on the effects of reflow temperatures, halogen-free flame retardants, glass reinforcement weave style, and conductor spacing on times to failure due to conductive filament formation.

High performance inkjet-printed QLEDs with 18.3% EQE: improving interfacial contact by novel halogen-free binary solvent system

Nano Research ◽  
2021 ◽  
Author(s):  
Ming Chen ◽  
Liming Xie ◽  
Changting Wei ◽  
Yuan-Qiu-Qiang Yi ◽  
Xiaolian Chen ◽  
...  
Keyword(s):  
High Performance ◽  
Solvent System ◽  
Binary Solvent ◽  
Interfacial Contact ◽  
Halogen Free

Treating octasilanol [Si8O12][OH]8 with tetramethoxysilane and trimethoxyvinylsilane: a halogen-free synthetic route to alkoxysilyl-substituted double-four-ring siloxanes

2021 ◽  
Vol 50 (5) ◽  
pp. 1594-1598
Author(s):  
Takeshi Nozawa ◽  
Toshiaki Kobayashi ◽  
Tomohiro Matsumoto ◽  
Fujio Yagihashi ◽  
Kazuhiko Sato ◽  
...  
Keyword(s):  
Synthetic Route ◽  
Halogen Free

A halogen-free synthesis of methoxysilyl-substituted double-four-ring (D4R) siloxanes [Si8O12][OSiR(OMe)2] (R = OMe or vinyl) was accomplished.

From photosensitizers to light harvesters adapting the molecular structure in all-BODIPY assemblies

2021 ◽  
Author(s):  
Edurne Avellanal Zaballa ◽  
Alejandro Prieto ◽  
Carolina Diaz Norambuena ◽  
Jorge Bañuelos ◽  
Antonia R Agarrabeitia ◽  
...  
Keyword(s):  
Molecular Structure ◽  
Energy Transfer ◽  
Singlet Oxygen ◽  
Halogen Free

Herein we detail a protocol to design dyads and triads based solely on BODIPY dyes as halogen-free singlet oxygen photosensitizers or energy transfer molecular cassettes. The conducted photonic characterization reveals...

Significantly Boosting Efficiency of Polymer Solar Cells by Employing a Nontoxic Halogen-Free Additive

2021 ◽  
Vol 13 (9) ◽  
pp. 11117-11124 ◽  
Author(s):  
Xingpeng Liu ◽  
Ruijie Ma ◽  
Yufei Wang ◽  
Sanshan Du ◽  
Junfeng Tong ◽  
...  
Keyword(s):  
Solar Cells ◽  
Polymer Solar Cells ◽  
Halogen Free

Halogen-Free Mold Compound Development for Ultra-Thin Packages

2007 ◽  
Author(s):  
Fenny Liu ◽  
C. T Yao ◽  
Don Son Jiang ◽  
Yu Po Wang ◽  
C. S. Hsiao
Keyword(s):  
Halogen Free

scholarly journals Thermal Analysis of Heat Distribution in Busbars during Rated Current Flow in Low-Voltage Industrial Switchgear

Energies ◽  
2021 ◽  
Vol 14 (9) ◽  
pp. 2427
Author(s):  
Michał Szulborski ◽  
Sebastian Łapczyński ◽  
Łukasz Kolimas
Keyword(s):  
Structural Changes ◽  
Heat Dissipation ◽  
Current Flow ◽  
Low Voltage ◽  
Short Circuit ◽  
Short Circuit Current ◽  
Coupled Analysis ◽  
Precise Representation ◽  
Transient Thermal ◽  
Halogen Free

The manuscript presents advanced coupled analysis: Maxwell 3D, Transient Thermal and Fluent CFD, at the time of a rated current occurring on the main busbars in the low-voltage switchgear. The simulations were procured in order to aid the design process of such enclosures. The analysis presented the rated current flow in the switchgear busbars, which allowed determining their temperature values. The main assumption of the simulation was measurements of temperature rise during rated current conditions. Simulating such conditions is a valuable asset in order to design better solutions for energy distribution gear. The simulation model was a precise representation of the actual prototype of the switchgear. Simulations results were validated by experimental research. The heat dissipation in busbars and switchgear housing through air convection was presented. The temperature distribution for the insulators in the rail bridge made of fireproof material was considered: halogen-free polyester. The results obtained during the simulation allowed for a detailed analysis of switchgear design and proper conclusions in practical and theoretical aspects. That helped in introducing structural changes in the prepared prototype of the switchgear at the design and construction stages. Deep analysis of the simulation results allowed for the development concerning the final prototype of the switchgear, which could be subjected to the full type tests. Additionally, short-circuit current simulations were procured and presented.

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