2008 58th Electronic Components and Technology Conference
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TOTAL DOCUMENTS

363
(FIVE YEARS 0)

H-INDEX

22
(FIVE YEARS 0)

Published By IEEE

9781424422302
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

scholarly journals 3D packaging architecture using paper as a dielectric medium

2008 ◽  
Author(s):  
Amin Rida ◽  
Li Yang ◽  
Napol Chaisilwattana ◽  
Scott Travis ◽  
Swapan Bhattacharya ◽  
...  
Keyword(s):  
Dielectric Medium ◽  
3D Packaging

Waferbond technologies and quality assessment

2008 ◽  
Author(s):  
Maik Wiemer ◽  
Jorg Fromel ◽  
Chenping Jia ◽  
Marco Haubold ◽  
Thomas Gessner
Keyword(s):  
Quality Assessment

The impact of process parameters on the fracture of device structures during chip joining on organic laminates

2008 ◽  
Author(s):  
Julien Sylvestre ◽  
Alexandre Blander ◽  
Valerie Oberson ◽  
Eric Perfecto ◽  
Kamalesh Srivastava
Keyword(s):  
Process Parameters ◽  
Device Structures ◽  
The Impact

Pluggable sockets for point-of-load converters in distributed power systems

2008 ◽  
Author(s):  
Phillip Henson ◽  
Josh Connell ◽  
R. Wayne Johnson ◽  
Mark Nelms ◽  
Prashant Joshi ◽  
...  
Keyword(s):  
Power Systems ◽  
Distributed Power ◽  
Distributed Power Systems

A hermetic chip to chip bonding at low temperature with Cu/In/Sn/Cu joint

2008 ◽  
Author(s):  
Liling Yan ◽  
Chengkuo Lee ◽  
Daquan Yu ◽  
Won Kyoung Choi ◽  
Aibin Yu ◽  
...  
Keyword(s):  
Low Temperature

Noise induced jitter in differential signaling

2008 ◽  
Author(s):  
Janani Chandrasekhar ◽  
Ege Engin ◽  
Madhavan Swaminathan ◽  
Kazuhide Uriu ◽  
Toru Yamada
Keyword(s):  
Differential Signaling

Effect of wafer back grinding on the mechanical behavior of multilayered low-k for 3D-stack packaging applications

2008 ◽  
Author(s):  
V. N. Sekhar ◽  
Lu Shen ◽  
Aditya Kumar ◽  
T. C. Chai ◽  
Wen Sheng Vincent Lee ◽  
...  
Keyword(s):  
Mechanical Behavior ◽  
Low K
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