2008 58th Electronic Components and Technology Conference
Latest Publications

TOTAL DOCUMENTS

363

(FIVE YEARS 0)

H-INDEX

22

(FIVE YEARS 0)

Published By IEEE

9781424422302

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

A novel methodology (Low Temperature Laminated Organics) for 3D integration using multilayer organics

2008 58th Electronic Components and Technology Conference ◽

10.1109/ectc.2008.4549947 ◽

2008 ◽

Author(s):

G. White ◽

S. Dalmia ◽

L. Carastro ◽

C. Russell ◽

V. Sundaram ◽

...

Keyword(s):

Low Temperature ◽

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Generation of surface acoustic waves for general sensing applications

2008 58th Electronic Components and Technology Conference ◽

10.1109/ectc.2008.4550206 ◽

2008 ◽

Author(s):

Kyu Tak Son ◽

Hsu-hung Huang ◽

Chin C. Lee

Keyword(s):

Acoustic Waves ◽

Surface Acoustic Waves ◽

Sensing Applications

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120 Gb/s-level VCSEL array optical subassembly using passive alignment technique

2008 58th Electronic Components and Technology Conference ◽

10.1109/ectc.2008.4550193 ◽

2008 ◽

Author(s):

Sung Hwan Hwang ◽

Jung Woon Lim ◽

Byung Sup Rho

Keyword(s):

Alignment Technique ◽

Passive Alignment

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Prediction of drift in foil resistors

2008 58th Electronic Components and Technology Conference ◽

10.1109/ectc.2008.4550258 ◽

2008 ◽

Author(s):

Joseph Szwarc ◽

Roy Golombick ◽

Yuval Hernik

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Effect of thermal interface materials on manufacturing and reliability of Flip Chip PBGA and SiP packages

2008 58th Electronic Components and Technology Conference ◽

10.1109/ectc.2008.4550094 ◽

2008 ◽

Author(s):

Li Li ◽

Mohan Nagar ◽

Jie Xue

Keyword(s):

Flip Chip ◽

Thermal Interface Materials ◽

Thermal Interface ◽

Interface Materials

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Embedded capacitor technology: A real world example

2008 58th Electronic Components and Technology Conference ◽

10.1109/ectc.2008.4550244 ◽

2008 ◽

Author(s):

Norm Smith ◽

Jun Fan ◽

John Andresakis ◽

Yoshi Fukawa ◽

Mark Harvey ◽

...

Keyword(s):

Embedded Capacitor

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Process development and reliability evaluation for inline Package-on-Package (pop) assembly

2008 58th Electronic Components and Technology Conference ◽

10.1109/ectc.2008.4550259 ◽

2008 ◽

Author(s):

Jonas Sjoberg ◽

David A. Geiger ◽

Dongkai Shangguan

Keyword(s):

Process Development ◽

Reliability Evaluation

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Comparison and analysis of integrated passive device technologies for wireless radio frequency module

2008 58th Electronic Components and Technology Conference ◽

10.1109/ectc.2008.4550046 ◽

2008 ◽

Author(s):

Arun Chandra Kundu ◽

Mohamed Megahed ◽

Dominik Schmidt

Keyword(s):

Radio Frequency ◽

Passive Device ◽

Frequency Module ◽

Comparison And Analysis

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A self-aligning latch-up mechanism in out of plane silicon microelectrode array for neural prosthesis

2008 58th Electronic Components and Technology Conference ◽

10.1109/ectc.2008.4550195 ◽

2008 ◽

Author(s):

Sandeep Negi ◽

Rajmohan Bhandari ◽

Florian Solzbacher

Keyword(s):

Microelectrode Array ◽

Neural Prosthesis ◽

Out Of Plane ◽

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Effect of Al addition in Sn-Ag solder on the interfacial reactions with Cu and ENIG metallizations

2008 58th Electronic Components and Technology Conference ◽

10.1109/ectc.2008.4550017 ◽

2008 ◽

Author(s):

Young-Kun Jee ◽

Yang-hua Xia ◽

Jin Yu ◽

Hyun-Woo Kang ◽

Taek-Young Lee

Keyword(s):

Interfacial Reactions ◽

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