Effect of board and package attributes on solder joint reliability of FCBGA packages based on IPC9701 characterization

2008 ◽  
Author(s):  
Jagadeesh Radhakrishnan
Keyword(s):  
Solder Joint ◽  
Solder Joint Reliability ◽  
Joint Reliability

Solder Joint Reliability Assessment and Pad Size Studies of FO-WLP With Glass Substrate

2021 ◽  
Vol 21 (1) ◽  
pp. 96-101 ◽  
Author(s):  
P. H. Wang ◽  
Y. C. Lee ◽  
C. K. Lee ◽  
H. H. Chang ◽  
K. N. Chiang
Keyword(s):  
Solder Joint ◽  
Glass Substrate ◽  
Reliability Assessment ◽  
Solder Joint Reliability ◽  
Joint Reliability

Effect of PCB thickness on solder joint reliability of Quad Flat no-lead assembly under Power Cycling and Thermal Cycling

2017 ◽  
Author(s):  
Unique Rahangdale ◽  
Rahul Srinivas ◽  
S. Krishnamurthy ◽  
Pavan Rajmane ◽  
Abel Misrak ◽  
...  
Keyword(s):  
Solder Joint ◽  
Thermal Cycling ◽  
Solder Joint Reliability ◽  
Joint Reliability ◽  
Power Cycling

Experimental evaluation of SnAgCu solder joint reliability in 100-μm pitch flip-chip assemblies

2014 ◽  
Vol 54 (5) ◽  
pp. 939-944 ◽  
Author(s):  
Ye Tian ◽  
Xi Liu ◽  
Justin Chow ◽  
Yi Ping Wu ◽  
Suresh K. Sitaraman
Keyword(s):  
Solder Joint ◽  
Experimental Evaluation ◽  
Flip Chip ◽  
Solder Joint Reliability ◽  
Snagcu Solder ◽  
Joint Reliability

SOLDERABILITY - THE KEY TO SOLDER JOINT RELIABILITY

1966 ◽  
Author(s):  
ROBERT NORTH
Keyword(s):  
Solder Joint ◽  
Solder Joint Reliability ◽  
Joint Reliability

Effects of Voids and Their Interactions on SMT Solder Joint Reliability

1994 ◽  
Vol 6 (3) ◽  
pp. 21-32 ◽  
Author(s):  
S. Liu ◽  
Y.H. Mei
Keyword(s):  
Solder Joint ◽  
Solder Joint Reliability ◽  
Joint Reliability

Comprehensive board-level solder joint reliability modeling and testing of QFN and PowerQFN packages

2003 ◽  
Vol 43 (8) ◽  
pp. 1329-1338 ◽  
Author(s):  
Tong Yan Tee ◽  
Hun Shen Ng ◽  
Daniel Yap ◽  
Zhaowei Zhong
Keyword(s):  
Solder Joint ◽  
Solder Joint Reliability ◽  
Reliability Modeling ◽  
Joint Reliability ◽  
Board Level

Solder Joint Reliability under Electromigration and Thermal-Mechanical Load

2007 ◽  
Author(s):  
ShiNan Wang ◽  
Lihua Liang ◽  
Yong Liu ◽  
Scott Irving ◽  
Timwah Luk
Keyword(s):  
Solder Joint ◽  
Mechanical Load ◽  
Solder Joint Reliability ◽  
Joint Reliability
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