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Handbook of 3D Integration
Latest Publications
TOTAL DOCUMENTS
21
(FIVE YEARS 21)
H-INDEX
1
(FIVE YEARS 1)
Published By Wiley
9783527338559, 9783527697052
Latest Documents
Most Cited Documents
Contributed Authors
Related Sources
Related Keywords
Latest Documents
Most Cited Documents
Contributed Authors
Related Sources
Related Keywords
Physical Design Flow for 3D /CoWoS® Stacked IC s
Handbook of 3D Integration
◽
10.1002/9783527697052.ch5
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2019
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pp. 81-114
Author(s):
Yu‐Shiang Lin
◽
Sandeep K. Goel
◽
Jonathan Yuan
◽
Tom Chen
◽
Frank Lee
Keyword(s):
Physical Design
◽
Design Flow
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Design and CAD Solutions for Cooling and Power Delivery for Monolithic 3D‐ICs
Handbook of 3D Integration
◽
10.1002/9783527697052.ch6
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2019
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pp. 115-140
Author(s):
Sandeep Samal
◽
Sung K. Lim
Keyword(s):
Power Delivery
◽
3D Ics
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Thermal Isolation and Cooling Technologies for Heterogeneous 3D‐ and 2.5D‐ICs
Handbook of 3D Integration
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10.1002/9783527697052.ch16
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2019
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pp. 347-373
Author(s):
Yang Zhang
◽
Hanju Oh
◽
Yue Zhang
◽
Li Zheng
◽
Gary S. May
◽
...
Keyword(s):
Thermal Isolation
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3D Design Styles
Handbook of 3D Integration
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10.1002/9783527697052.ch1
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2019
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pp. 1-19
Author(s):
Paul D. Franzon
Keyword(s):
3D Design
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3D Design‐for‐Test Architecture
Handbook of 3D Integration
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10.1002/9783527697052.ch12
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2019
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pp. 253-280
Author(s):
Erik Jan Marinissen
◽
Mario Konijnenburg
◽
Jouke Verbree
◽
Chun‐Chuan Chi
◽
Sergej Deutsch
◽
...
Keyword(s):
Design For Test
◽
3D Design
◽
Test Architecture
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Multiphysics Challenges and Solutions for the Design of Heterogeneous 3D Integrated System
Handbook of 3D Integration
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10.1002/9783527697052.ch4
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2019
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pp. 53-79
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Cited By ~ 1
Author(s):
Alexander Steinhardt
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Dimitrios Papaioannou
◽
Andy Heinig
◽
Peter Schneider
Keyword(s):
Integrated System
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IEEE Std P1838: 3D Test Access Standard Under Development
Handbook of 3D Integration
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10.1002/9783527697052.ch14
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2019
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pp. 301-323
Author(s):
Adam Cron
◽
Erik Jan Marinissen
◽
Sandeep K. Goel
◽
Teresa McLaurin
◽
Sandeep Bhatia
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Power Delivery Network and Integrity in 3D ‐ IC Chips
Handbook of 3D Integration
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10.1002/9783527697052.ch3
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2019
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pp. 41-52
Author(s):
Makoto Nagata
Keyword(s):
Power Delivery
◽
3D Ic
◽
Power Delivery Network
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Delivery Network
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Ultrafine Pitch 3D Stacked Integrated Circuits: Technology, Design Enablement, and Application
Handbook of 3D Integration
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10.1002/9783527697052.ch2
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2019
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pp. 21-40
Author(s):
Dragomir Milojevic
◽
Prashant Agrawal
◽
Praveen Raghavan
◽
Geert Van der Plas
◽
Francky Catthoor
◽
...
Keyword(s):
Integrated Circuits
◽
Technology Design
◽
Stacked Integrated Circuits
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Electronic Design Automation for 3D
Handbook of 3D Integration
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10.1002/9783527697052.ch7
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2019
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pp. 141-147
Author(s):
Paul D. Franzon
Keyword(s):
Design Automation
◽
Electronic Design Automation
◽
Electronic Design
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