Handbook of 3D Integration
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Published By Wiley

9783527338559, 9783527697052
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Thermal Isolation and Cooling Technologies for Heterogeneous 3D‐ and 2.5D‐ICs

2019 ◽  
pp. 347-373
Author(s):  
Yang Zhang ◽  
Hanju Oh ◽  
Yue Zhang ◽  
Li Zheng ◽  
Gary S. May ◽  
...  
Keyword(s):  
Thermal Isolation

Physical Design Flow for 3D /CoWoS® Stacked IC s

2019 ◽  
pp. 81-114
Author(s):  
Yu‐Shiang Lin ◽  
Sandeep K. Goel ◽  
Jonathan Yuan ◽  
Tom Chen ◽  
Frank Lee
Keyword(s):  
Physical Design ◽  
Design Flow

3D Design Styles

2019 ◽  
pp. 1-19
Author(s):  
Paul D. Franzon
Keyword(s):  
3D Design

3D Design‐for‐Test Architecture

2019 ◽  
pp. 253-280
Author(s):  
Erik Jan Marinissen ◽  
Mario Konijnenburg ◽  
Jouke Verbree ◽  
Chun‐Chuan Chi ◽  
Sergej Deutsch ◽  
...  
Keyword(s):  
Design For Test ◽  
3D Design ◽  
Test Architecture

Multiphysics Challenges and Solutions for the Design of Heterogeneous 3D Integrated System

2019 ◽  
pp. 53-79 ◽  
Author(s):  
Alexander Steinhardt ◽  
Dimitrios Papaioannou ◽  
Andy Heinig ◽  
Peter Schneider
Keyword(s):  
Integrated System

Ultrafine Pitch 3D Stacked Integrated Circuits: Technology, Design Enablement, and Application

2019 ◽  
pp. 21-40
Author(s):  
Dragomir Milojevic ◽  
Prashant Agrawal ◽  
Praveen Raghavan ◽  
Geert Van der Plas ◽  
Francky Catthoor ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Technology Design ◽  
Stacked Integrated Circuits

IEEE Std P1838: 3D Test Access Standard Under Development

2019 ◽  
pp. 301-323
Author(s):  
Adam Cron ◽  
Erik Jan Marinissen ◽  
Sandeep K. Goel ◽  
Teresa McLaurin ◽  
Sandeep Bhatia
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