stacked integrated circuits Latest Research Papers

Thermal design and management of micro-pin fin heat sinks for energy-efficient three-dimensional stacked integrated circuits

International Journal of Heat and Mass Transfer ◽

10.1016/j.ijheatmasstransfer.2021.121192 ◽

2021 ◽

Vol 175 ◽

pp. 121192

Author(s):

Daewoong Jung ◽

Haeun Lee ◽

Daeyoung Kong ◽

Eunho Cho ◽

Ki Wook Jung ◽

...

Keyword(s):

Integrated Circuits ◽

Energy Efficient ◽

Three Dimensional ◽

Thermal Design ◽

Heat Sinks ◽

Pin Fin ◽

Stacked Integrated Circuits

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Thermal Simulation of 3-D Stacked Integrated Circuits with Layered Finite Element Method

2019 Photonics & Electromagnetics Research Symposium - Fall (PIERS - Fall) ◽

10.1109/piers-fall48861.2019.9021638 ◽

2019 ◽

Author(s):

Bo Li ◽

Min Tang ◽

Yuwen Zhi ◽

Huixian Yu

Keyword(s):

Finite Element Method ◽

Finite Element ◽

Integrated Circuits ◽

Thermal Simulation ◽

Element Method ◽

Stacked Integrated Circuits

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IEEE Standard for Test Access Architecture for Three-Dimensional Stacked Integrated Circuits

10.1109/ieeestd.2020.9036129 ◽

2019 ◽

Keyword(s):

Integrated Circuits ◽

Three Dimensional ◽

Ieee Standard ◽

Stacked Integrated Circuits

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Test Flow Selection for Stacked Integrated Circuits

Journal of Electronic Testing ◽

10.1007/s10836-019-05813-z ◽

2019 ◽

Vol 35 (4) ◽

pp. 425-440

Author(s):

Breeta SenGupta ◽

Dimitar Nikolov ◽

Assmitra Dash ◽

Erik Larsson

Keyword(s):

Integrated Circuits ◽

Test Flow ◽

Selection For ◽

Stacked Integrated Circuits

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3D-Stacked Integrated Circuits: How Fine Should System Partitioning Be?

2019 IEEE International Symposium on Circuits and Systems (ISCAS) ◽

10.1109/iscas.2019.8702533 ◽

2019 ◽

Author(s):

Quentin Delhaye ◽

Dragomir Milojevic ◽

Joel Goossens

Keyword(s):

Integrated Circuits ◽

System Partitioning ◽

Stacked Integrated Circuits

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Ultrafine Pitch 3D Stacked Integrated Circuits: Technology, Design Enablement, and Application

Handbook of 3D Integration ◽

10.1002/9783527697052.ch2 ◽

2019 ◽

pp. 21-40

Author(s):

Dragomir Milojevic ◽

Prashant Agrawal ◽

Praveen Raghavan ◽

Geert Van der Plas ◽

Francky Catthoor ◽

...

Keyword(s):

Integrated Circuits ◽

Technology Design ◽

Stacked Integrated Circuits

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Copper Rich Cu1-xNix Alloys (0.05 < x < 0.15) Electrodeposited from Acid Sulfate-Based Electrolyte with Benzotriazole Additive for Microbump Metallization for 3D Stacked Integrated Circuits

Journal of The Electrochemical Society ◽

10.1149/2.0721908jes ◽

2019 ◽

Vol 166 (8) ◽

pp. D315-D322

Author(s):

Karel P. S. Haesevoets ◽

Aleksandar Radisic ◽

Philippe M. Vereecken

Keyword(s):

Integrated Circuits ◽

Acid Sulfate ◽

Stacked Integrated Circuits

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Solutions to Multiple Probing Challenges for Test Access to Multi-Die Stacked Integrated Circuits

2018 IEEE International Test Conference (ITC) ◽

10.1109/test.2018.8624731 ◽

2018 ◽

Cited By ~ 3

Author(s):

Erik Jan Marinissen ◽

Ferenc Fodor ◽

Arnita Podpod ◽

Michele Stucchi ◽

Yu-Rong Jian ◽

...

Keyword(s):

Integrated Circuits ◽

Stacked Integrated Circuits

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Nano - Microscale Electrical Characterization of Copper Thru Silicon Vias in 3D Stacked Integrated Circuits

2018 Conference on Precision Electromagnetic Measurements (CPEM 2018) ◽

10.1109/cpem.2018.8501198 ◽

2018 ◽

Author(s):

Djamel Allal ◽

Alexandra Delvallee ◽

Jose Moran ◽

Mohammad Saif Khan ◽

Francoi S Piquemal

Keyword(s):

Integrated Circuits ◽

Electrical Characterization ◽

Silicon Vias ◽

Stacked Integrated Circuits

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An effective and efficient numerical method for thermal management in 3D stacked integrated circuits

Applied Thermal Engineering ◽

10.1016/j.applthermaleng.2017.04.080 ◽

2017 ◽

Vol 121 ◽

pp. 200-209 ◽

Cited By ~ 19

Author(s):

Chengdi Xiao ◽

Hu He ◽

Junhui Li ◽

Sen Cao ◽

Wenhui Zhu

Keyword(s):

Integrated Circuits ◽

Numerical Method ◽

Thermal Management ◽

Stacked Integrated Circuits

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stacked integrated circuits
Recently Published Documents

TOTAL DOCUMENTS

H-INDEX

Thermal design and management of micro-pin fin heat sinks for energy-efficient three-dimensional stacked integrated circuits

Thermal Simulation of 3-D Stacked Integrated Circuits with Layered Finite Element Method

IEEE Standard for Test Access Architecture for Three-Dimensional Stacked Integrated Circuits

Test Flow Selection for Stacked Integrated Circuits

3D-Stacked Integrated Circuits: How Fine Should System Partitioning Be?

Ultrafine Pitch 3D Stacked Integrated Circuits: Technology, Design Enablement, and Application

Copper Rich Cu1-xNix Alloys (0.05 < x < 0.15) Electrodeposited from Acid Sulfate-Based Electrolyte with Benzotriazole Additive for Microbump Metallization for 3D Stacked Integrated Circuits

Solutions to Multiple Probing Challenges for Test Access to Multi-Die Stacked Integrated Circuits

Nano - Microscale Electrical Characterization of Copper Thru Silicon Vias in 3D Stacked Integrated Circuits

An effective and efficient numerical method for thermal management in 3D stacked integrated circuits

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stacked integrated circuitsRecently Published Documents

TOTAL DOCUMENTS

H-INDEX

Thermal design and management of micro-pin fin heat sinks for energy-efficient three-dimensional stacked integrated circuits

Thermal Simulation of 3-D Stacked Integrated Circuits with Layered Finite Element Method

IEEE Standard for Test Access Architecture for Three-Dimensional Stacked Integrated Circuits

Test Flow Selection for Stacked Integrated Circuits

3D-Stacked Integrated Circuits: How Fine Should System Partitioning Be?

Ultrafine Pitch 3D Stacked Integrated Circuits: Technology, Design Enablement, and Application

Copper Rich Cu1-xNix Alloys (0.05 < x < 0.15) Electrodeposited from Acid Sulfate-Based Electrolyte with Benzotriazole Additive for Microbump Metallization for 3D Stacked Integrated Circuits

Solutions to Multiple Probing Challenges for Test Access to Multi-Die Stacked Integrated Circuits

Nano - Microscale Electrical Characterization of Copper Thru Silicon Vias in 3D Stacked Integrated Circuits

An effective and efficient numerical method for thermal management in 3D stacked integrated circuits

stacked integrated circuits
Recently Published Documents