Thermal Isolation and Cooling Technologies for Heterogeneous 3D‐ and 2.5D‐ICs

2019 ◽  
pp. 347-373
Author(s):  
Yang Zhang ◽  
Hanju Oh ◽  
Yue Zhang ◽  
Li Zheng ◽  
Gary S. May ◽  
...  
Keyword(s):  
2009 ◽  
Vol 19 (3) ◽  
pp. 035013 ◽  
Author(s):  
Yinhua Lei ◽  
Wei Wang ◽  
Huaiqiang Yu ◽  
Yingcun Luo ◽  
Ting Li ◽  
...  

2002 ◽  
Vol 2 (5) ◽  
pp. 463-475 ◽  
Author(s):  
G. Kaltsas ◽  
A.A. Nassiopoulos ◽  
A.G. Nassiopoulou

1999 ◽  
Author(s):  
Kenneth S. Breuer ◽  
Robert L. Bayt ◽  
Anju Nayaar

Abstract The design, fabrication and testing of microfabricated thermal shear stress and temperature sensors are sensors is discussed. The devices are fabricated on a silicon substrate with a platinum sensor element 5 microns wide, 1000-Å thick and of varying length. The electrical leads are comprised of 5000-Å of gold deposited above the platinum sensor metal. The sensing area is isolated from the substrate by a thin membrane of silicon nitride covering a vacuum cavity. Test results are presented confirming the good thermal isolation of the sensor element from the substrate as well as the successful operation of the device.


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