Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications
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Published By Springer New York

9780387958675, 9780387958682

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CMP for Cu Processing

Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications ◽

10.1007/978-0-387-95868-2_23 ◽

2009 ◽

pp. 343-357

Author(s):

Manabu Tsujimura

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Electrodeposition

Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications ◽

10.1007/978-0-387-95868-2_4 ◽

2009 ◽

pp. 63-71 ◽

Cited By ~ 1

Author(s):

Madhav Datta

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Processes and Tools for Co Alloy Capping

Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications ◽

10.1007/978-0-387-95868-2_30 ◽

2009 ◽

pp. 445-457

Author(s):

Bill Lee ◽

Igor Ivanov

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Introduction to Electrochemical Process Integration for Cu Interconnects

Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications ◽

10.1007/978-0-387-95868-2_17 ◽

2009 ◽

pp. 257-261

Author(s):

Takayuki Ohba

Keyword(s):

Process Integration ◽

Electrochemical Process ◽

Cu Interconnects

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Low-κ Materials and Development Trends

Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications ◽

10.1007/978-0-387-95868-2_10 ◽

2009 ◽

pp. 145-151

Author(s):

Akira Hashimoto ◽

Ichiro Koiwa

Keyword(s):

Development Trends

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Damascene Concept and Process Steps

Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications ◽

10.1007/978-0-387-95868-2_18 ◽

2009 ◽

pp. 263-273 ◽

Cited By ~ 1

Author(s):

Nobuyoshi Kobayashi

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Low-k Dielectrics

Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications ◽

10.1007/978-0-387-95868-2_22 ◽

2009 ◽

pp. 325-342

Author(s):

Yoshihiro Hayashi

Keyword(s):

Low K

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Wafer-Level 3D Integration for ULSI Interconnects

Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications ◽

10.1007/978-0-387-95868-2_6 ◽

2009 ◽

pp. 79-90

Author(s):

Ronald J. Gutmann ◽

Jian-Qiang Lu

Keyword(s):

Wafer Level ◽

3D Integration

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Interconnects in ULSI Systems: Cu Interconnects Electrical Performance

Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications ◽

10.1007/978-0-387-95868-2_3 ◽

2009 ◽

pp. 39-62

Author(s):

Avinoam Kolodny

Keyword(s):

Electrical Performance ◽

Cu Interconnects

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Atomic Layer Deposition (ALD) Processes for ULSI Manufacturing

Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications ◽

10.1007/978-0-387-95868-2_14 ◽

2009 ◽

pp. 207-220

Author(s):

Schubert S. Chu

Keyword(s):

Atomic Layer Deposition ◽

Atomic Layer ◽

Layer Deposition

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Advanced Nanoscale ULSI Interconnects: Fundamentals and ApplicationsLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By Springer New York

CMP for Cu Processing

Electrodeposition

Processes and Tools for Co Alloy Capping

Introduction to Electrochemical Process Integration for Cu Interconnects

Low-κ Materials and Development Trends

Damascene Concept and Process Steps

Low-k Dielectrics

Wafer-Level 3D Integration for ULSI Interconnects

Interconnects in ULSI Systems: Cu Interconnects Electrical Performance

Atomic Layer Deposition (ALD) Processes for ULSI Manufacturing

Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications
Latest Publications