2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
Latest Publications

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Published By IEEE

9781538693032, 9781538651667

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Transient Simulation for High-Speed Channels with Recurrent Neural Network

2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ◽

10.1109/epeps.2018.8534232 ◽

2018 ◽

Cited By ~ 8

Author(s):

Thong Nguyen ◽

Tianjian Lu ◽

Ju Sun ◽

Quang Le ◽

Ken We ◽

...

Keyword(s):

Neural Network ◽

Recurrent Neural Network ◽

High Speed ◽

Transient Simulation

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Effects of Manufacturing Variations on Ultra-High-Speed Integrated Waveguide Memory Interconnects

2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ◽

10.1109/epeps.2018.8534271 ◽

2018 ◽

Author(s):

Brahim Bensalem ◽

James T. Aberle

Keyword(s):

High Speed ◽

Ultra High Speed

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Reinforcement Learning-Based Optimal on-Board Decoupling Capacitor Design Method

2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ◽

10.1109/epeps.2018.8534195 ◽

2018 ◽

Cited By ~ 4

Author(s):

Hyunwook Park ◽

Junyong Park ◽

Subin Kim ◽

Daehwan Lho ◽

Shinyoung Park ◽

...

Keyword(s):

Reinforcement Learning ◽

Design Method ◽

Decoupling Capacitor

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Jitter and Eye Estimation in SerDes Channels Using Modified Polynomial Chaos Surrogate Models

2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ◽

10.1109/epeps.2018.8534311 ◽

2018 ◽

Author(s):

Majid AhadiDolatsara ◽

Jose AleHejase ◽

Wiren DaleBecker ◽

Madhavan Swaminathan

Keyword(s):

Polynomial Chaos ◽

Surrogate Models

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Design and Analysis of Interposer-Level Integrated Voltage Regulator for Power Noise Suppression in High Bandwidth Memory I/O Interface

2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ◽

10.1109/epeps.2018.8534287 ◽

2018 ◽

Cited By ~ 1

Author(s):

Subin Kim ◽

Youngwoo Kim ◽

Kyungjun Cho ◽

Jinwook Song ◽

Shinyoung Park ◽

...

Keyword(s):

Noise Suppression ◽

Voltage Regulator ◽

High Bandwidth ◽

Power Noise

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Dual-Band Monopole Antenna Feeds for Substrate Integrated Waveguides

2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ◽

10.1109/epeps.2018.8534265 ◽

2018 ◽

Author(s):

Pavel Roy Paladhi ◽

Jose Hejase ◽

Junyan Tang ◽

Joshua Myers ◽

Sungjun Chun ◽

...

Keyword(s):

Monopole Antenna ◽

Dual Band ◽

Substrate Integrated Waveguides

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Broadband Antenna Probe for Microwave EMC Measurements

2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ◽

10.1109/epeps.2018.8534234 ◽

2018 ◽

Author(s):

William Kuhn ◽

Garrett Peterson ◽

Joshua Welch

Keyword(s):

Broadband Antenna

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A Fast Channel Simulation Framework Based on Hierarchical Waveform Representations

2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ◽

10.1109/epeps.2018.8534233 ◽

2018 ◽

Cited By ~ 1

Author(s):

C. Siviero ◽

I. S. Stievano ◽

S. Grivet-Talocia ◽

G. Signorini ◽

M. Telescu

Keyword(s):

Simulation Framework ◽

Channel Simulation

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Vertical and Horizontal Transitions of Substrate Integrated Waveguides Within a Multi-Layered PCB for High Speed Signaling Applications

2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ◽

10.1109/epeps.2018.8534285 ◽

2018 ◽

Cited By ~ 1

Author(s):

Joshua C. Myers ◽

Jose A. Hejase ◽

Junyan Tang ◽

Pavel R. Paladhi ◽

Wiren D. Becker ◽

...

Keyword(s):

High Speed ◽

Substrate Integrated Waveguides

Download Full-text

Thermal-Power Delivery Network Co-Analysis for Multi-Die Integration

2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ◽

10.1109/epeps.2018.8534267 ◽

2018 ◽

Author(s):

Md Obaidul Hossen ◽

Yang Zhang ◽

Muhannad S. Bakir

Keyword(s):

Thermal Power ◽

Power Delivery ◽

Power Delivery Network ◽

Delivery Network

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2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Transient Simulation for High-Speed Channels with Recurrent Neural Network

Effects of Manufacturing Variations on Ultra-High-Speed Integrated Waveguide Memory Interconnects

Reinforcement Learning-Based Optimal on-Board Decoupling Capacitor Design Method

Jitter and Eye Estimation in SerDes Channels Using Modified Polynomial Chaos Surrogate Models

Design and Analysis of Interposer-Level Integrated Voltage Regulator for Power Noise Suppression in High Bandwidth Memory I/O Interface

Dual-Band Monopole Antenna Feeds for Substrate Integrated Waveguides

Broadband Antenna Probe for Microwave EMC Measurements

A Fast Channel Simulation Framework Based on Hierarchical Waveform Representations

Vertical and Horizontal Transitions of Substrate Integrated Waveguides Within a Multi-Layered PCB for High Speed Signaling Applications

Thermal-Power Delivery Network Co-Analysis for Multi-Die Integration

2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
Latest Publications