Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92
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Published By IEEE Comput. Soc. Press

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Delay macromodels for point-to-point MCM interconnections

Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92 ◽

10.1109/mcmc.1992.201452 ◽

2003 ◽

Author(s):

A.I. Kayssi ◽

K.A. Sakallah

Keyword(s):

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Trends in processor and system design and the interaction with advanced packaging

Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92 ◽

10.1109/mcmc.1992.201431 ◽

2003 ◽

Author(s):

J.L. Hennessy

Keyword(s):

System Design ◽

Advanced Packaging

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IBM ES/9000 buried engineering change modeling for verification (MCM)

Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92 ◽

10.1109/mcmc.1992.201476 ◽

2003 ◽

Author(s):

C.R. Selinger ◽

C.K. Vakirtzis

Keyword(s):

Engineering Change

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Analysis of MCMs using asymptotic waveform evaluation (AWE)

Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92 ◽

10.1109/mcmc.1992.201444 ◽

2003 ◽

Author(s):

M.M. Alaybeyi ◽

J.E. Bracken ◽

J.Y. Lee ◽

V. Raghavan ◽

R.J. Trihy ◽

...

Keyword(s):

Waveform Evaluation ◽

Asymptotic Waveform Evaluation

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An integrated approach for electrical performance analysis of multichip modules

Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92 ◽

10.1109/mcmc.1992.201455 ◽

2003 ◽

Author(s):

J.C. Liao ◽

G.N. Choksi

Keyword(s):

Performance Analysis ◽

Integrated Approach ◽

Electrical Performance ◽

Multichip Modules

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Fully integrated silicon based optical motherboards

Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92 ◽

10.1109/mcmc.1992.201470 ◽

2003 ◽

Author(s):

D. Godfrey ◽

S. Bailey ◽

K. Cooper ◽

M. Nield ◽

J. Hill ◽

...

Keyword(s):

Fully Integrated ◽

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Pade approximation applied to transient simulation of lossy coupled transmission lines

Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92 ◽

10.1109/mcmc.1992.201445 ◽

2003 ◽

Author(s):

S. Lin ◽

E.S. Kuh

Keyword(s):

Transmission Lines ◽

Padé Approximation ◽

Transient Simulation ◽

Pade Approximation ◽

Coupled Transmission Lines

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Applications of multichip modules for high speed communications interfaces

Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92 ◽

10.1109/mcmc.1992.201435 ◽

2003 ◽

Author(s):

A. Kozak

Keyword(s):

Multichip Modules

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Yield modeling of MCM assembly with flip-chip thermocompression bondings

Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92 ◽

10.1109/mcmc.1992.201449 ◽

2003 ◽

Author(s):

S.-Y. Kang ◽

Y.C. Lee

Keyword(s):

Flip Chip ◽

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Characteristics of thin-film devices for a stack-type MCM

Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92 ◽

10.1109/mcmc.1992.201474 ◽

2003 ◽

Author(s):

S. Takahashi ◽

Y. Hayashi ◽

T. Kunio ◽

N. Endo

Keyword(s):

Thin Film ◽

Thin Film Devices

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