Structural Integrity and Reliability in Electronics
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18

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Published By Kluwer Academic Publishers

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Mechanical Testing (For Electronics Applications)

Structural Integrity and Reliability in Electronics ◽

10.1007/1-4020-2611-0_4 ◽

2006 ◽

pp. 51-68

Keyword(s):

Mechanical Testing

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Electronic Components and Their Construction

Structural Integrity and Reliability in Electronics ◽

10.1007/1-4020-2611-0_7 ◽

2006 ◽

pp. 119-148

Keyword(s):

Electronic Components

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Introduction to Life Prediction

Structural Integrity and Reliability in Electronics ◽

10.1007/1-4020-2611-0_12 ◽

2006 ◽

pp. 217-238

Keyword(s):

Life Prediction

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Case Study

Structural Integrity and Reliability in Electronics ◽

10.1007/1-4020-2611-0_18 ◽

2006 ◽

pp. 319-329

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Introduction to the Properties of Materials

Structural Integrity and Reliability in Electronics ◽

10.1007/1-4020-2611-0_2 ◽

2006 ◽

pp. 19-32

Keyword(s):

Properties Of Materials

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More Complex Mechanical Behaviour

Structural Integrity and Reliability in Electronics ◽

10.1007/1-4020-2611-0_3 ◽

2006 ◽

pp. 33-49

Keyword(s):

Mechanical Behaviour

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Thermal and Mechanical Simulation in Microelectronics

Structural Integrity and Reliability in Electronics ◽

10.1007/1-4020-2611-0_15 ◽

2006 ◽

pp. 275-286

Keyword(s):

Mechanical Simulation

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Life Prediction by Crack Propagation Approach

Structural Integrity and Reliability in Electronics ◽

10.1007/1-4020-2611-0_13 ◽

2006 ◽

pp. 239-255

Keyword(s):

Crack Propagation ◽

Life Prediction

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Printed Circuit Board Assembly Methods and Technologies

Structural Integrity and Reliability in Electronics ◽

10.1007/1-4020-2611-0_8 ◽

2006 ◽

pp. 149-165

Keyword(s):

Printed Circuit Board ◽

Circuit Board ◽

Printed Circuit Board Assembly ◽

Printed Circuit ◽

Circuit Board Assembly

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Making the Transition to a Reliable Lead-free Solder Process

Structural Integrity and Reliability in Electronics ◽

10.1007/1-4020-2611-0_11 ◽

2006 ◽

pp. 205-213

Keyword(s):

Lead Free ◽

Lead Free Solder ◽

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