2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013)
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9781479928347, 9781479928323
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Investigating the temperature effect of reliability on integration IC 3D packaging under drop test

2013 ◽  
Author(s):  
Hao-Chih Chen ◽  
Yi-Che Chiang ◽  
Tuan-Yu Hung ◽  
Kuo-Ning Chiang
Keyword(s):  
Temperature Effect ◽  
Drop Test ◽  
3D Packaging

Development of package level hybrid silicon heat sink for hotspots cooling

2013 ◽  
Author(s):  
B. L. Lau ◽  
Y. J. Lee ◽  
Yong Han ◽  
Y. C. Leong ◽  
K. F. Choo ◽  
...  
Keyword(s):  
Heat Sink ◽  
Hybrid Silicon

Low temperature bonding studies of Au-studs and AuSn-solder bumps on Au-surface using ultrasonic energy

2013 ◽  
Author(s):  
Jie Li Aw ◽  
Jong Bum Lee ◽  
Norhanani Jaafar ◽  
Mian Zhi Ding ◽  
Li-Shiah Lim ◽  
...  
Keyword(s):  
Low Temperature ◽  
Ultrasonic Energy ◽  
Solder Bumps ◽  
Low Temperature Bonding

Considerations and benefits of plasma etch based wafer dicing

2013 ◽  
Author(s):  
Richard Barnett ◽  
Oliver Ansell ◽  
Dave Thomas
Keyword(s):  
Plasma Etch

Effect of Cu seed layer aging on Cu filling failure in through Si vias (TSVs)

2013 ◽  
Author(s):  
Jae Woong Choi ◽  
Ong Lee Guan ◽  
Mao Yingjun ◽  
Xie Jielin ◽  
Chow Choi Lan ◽  
...  
Keyword(s):  
Seed Layer
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