2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013)
Latest Publications

TOTAL DOCUMENTS

180

(FIVE YEARS 0)

H-INDEX

6

(FIVE YEARS 0)

Published By IEEE

9781479928347, 9781479928323

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Size and geometry effects on microstructural evolution in Sn microbumps during isothermal aging

2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) ◽

10.1109/eptc.2013.6745764 ◽

2013 ◽

Author(s):

Hua Xiong ◽

Zhiheng Huang ◽

Paul Conway

Keyword(s):

Microstructural Evolution ◽

Isothermal Aging ◽

Geometry Effects ◽

Size And Geometry Effects

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A comparative analysis on physical and chemical plasma cleaning effects on surfaces

2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) ◽

10.1109/eptc.2013.6745737 ◽

2013 ◽

Author(s):

Wong Jun Hao ◽

Lim Yuan Ming

Keyword(s):

Comparative Analysis ◽

Plasma Cleaning ◽

Physical And Chemical

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Reliability study on through mold via (TMV) for 3D microelectronic packaging under thermal and moisture loadings

2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) ◽

10.1109/eptc.2013.6745775 ◽

2013 ◽

Author(s):

Zhaohui Chen ◽

Ser Choong Chong ◽

Boyu Zheng ◽

Boo Yang Jung ◽

Tai Chong Chai ◽

...

Keyword(s):

Microelectronic Packaging ◽

Reliability Study

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Investigation of dynamic and mechanical thermal behavior of isotropic conductive adhesives

2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) ◽

10.1109/eptc.2013.6745763 ◽

2013 ◽

Author(s):

R. Durairaj ◽

Chew Chee Sean ◽

Tan Chia Chiun ◽

Liew Jian Ping

Keyword(s):

Thermal Behavior ◽

Conductive Adhesives ◽

Isotropic Conductive Adhesives

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A mold flow model with method of cells to better understand IC packaging

2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) ◽

10.1109/eptc.2013.6745723 ◽

2013 ◽

Author(s):

B Y Low ◽

Serene Teh ◽

Pei-Fan Tong ◽

S F Zhao

Keyword(s):

Ic Packaging ◽

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Numerical simulation of the atomic migration and diffusion during current stressing in the Cu/Sn-58Bi/Cu solder joints

2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) ◽

10.1109/eptc.2013.6745761 ◽

2013 ◽

Author(s):

Hongwen He ◽

Liqiang Cao ◽

Wenqi Zhang ◽

Mikai Chen ◽

Haiyan Zhao

Keyword(s):

Numerical Simulation ◽

Solder Joints ◽

Current Stressing ◽

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Effects of metallic nanoparticle doped flux on interfacial intermetallic compounds between Sn-3.0Ag-0.5Cu and copper substrate

2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) ◽

10.1109/eptc.2013.6745676 ◽

2013 ◽

Author(s):

S. K. Ghosh ◽

A. S. M. A. Haseeb ◽

Amalina Afifi

Keyword(s):

Intermetallic Compounds ◽

Copper Substrate ◽

Metallic Nanoparticle ◽

Interfacial Intermetallic Compounds

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Effect of die attach material on heavy Cu wire bonding with Au coated Pd bond pad in automotive applications

2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) ◽

10.1109/eptc.2013.6745794 ◽

2013 ◽

Author(s):

B. Senthil Kumar ◽

Acuesta Albert ◽

Lim Lay Hong Geraldine

Keyword(s):

Wire Bonding ◽

Automotive Applications ◽

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Development of package level hybrid silicon heat sink for hotspots cooling

2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) ◽

10.1109/eptc.2013.6745819 ◽

2013 ◽

Author(s):

B. L. Lau ◽

Y. J. Lee ◽

Yong Han ◽

Y. C. Leong ◽

K. F. Choo ◽

...

Keyword(s):

Heat Sink ◽

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Low temperature bonding studies of Au-studs and AuSn-solder bumps on Au-surface using ultrasonic energy

2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) ◽

10.1109/eptc.2013.6745747 ◽

2013 ◽

Author(s):

Jie Li Aw ◽

Jong Bum Lee ◽

Norhanani Jaafar ◽

Mian Zhi Ding ◽

Li-Shiah Lim ◽

...

Keyword(s):

Low Temperature ◽

Ultrasonic Energy ◽

Solder Bumps ◽

Low Temperature Bonding

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