low temperature bonding
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Low-temperature bonding of surface-activated polyimide to Cu Foil in Pt-catalyzed formic acid atmosphere

2021 ◽  
Author(s):  
Ying Meng ◽  
Yang Xu ◽  
Runhua Gao ◽  
Xinhua Wang ◽  
Xiaojuan Chen ◽  
...  
Keyword(s):  
Low Temperature ◽  
Formic Acid ◽  
Low Temperature Bonding ◽  
Cu Foil ◽  
Pt Catalyzed

Anodic Bonding a Low Temperature Bonding Method for Processed MEMS and CMOS Wafers

2021 ◽  
Author(s):  
Roy Knechtel ◽  
Hannes Mehner ◽  
Theresa Berthold ◽  
Carl Van Buggenhout ◽  
Dirk Terryn
Keyword(s):  
Low Temperature ◽  
Anodic Bonding ◽  
Low Temperature Bonding ◽  
Bonding Method

Surface smoothing of Au plated films by template stripping towards low-temperature bonding for 3D integration

2021 ◽  
Author(s):  
Le Hac Huong Thu ◽  
Takashi Matsumae ◽  
Yuichi Kurashima ◽  
Hideki Takagi ◽  
Eiji Higurashi
Keyword(s):  
Low Temperature ◽  
Surface Smoothing ◽  
3D Integration ◽  
Template Stripping ◽  
Low Temperature Bonding

Low temperature bonding by sintering of Ag nanoparticle paste with the assistance of MOD

2021 ◽  
Author(s):  
Xun Liu ◽  
Yulei Yuan ◽  
Junjie Li ◽  
Li Liu ◽  
Rong Sun
Keyword(s):  
Low Temperature ◽  
Ag Nanoparticle ◽  
Low Temperature Bonding

Low-Temperature Bonding of High-Power Device Using Cu-Ag Composite Nanoparticle Paste

2021 ◽  
Author(s):  
Jiaxin Liu ◽  
Qing Wang ◽  
Yun Mou ◽  
Mingxiang Chen
Keyword(s):  
Low Temperature ◽  
High Power ◽  
Power Device ◽  
Composite Nanoparticle ◽  
Low Temperature Bonding

Plasma-enhanced Si-SiC low-temperature bonding based on graphene composite slurry interlayer

2021 ◽  
Vol 293 ◽  
pp. 129710
Author(s):  
Ximing Ye ◽  
Jiankun Wan ◽  
Xiang Yin ◽  
Wenhua Yang ◽  
Chao Xie ◽  
...  
Keyword(s):  
Low Temperature ◽  
Graphene Composite ◽  
Low Temperature Bonding ◽  
Composite Slurry

Low temperature bonding of Cu bump to WBG device using the surface activation method

2021 ◽  
Author(s):  
Tadatomo Suga ◽  
Kai Takeuchi ◽  
Seongbin Shin ◽  
Nora Martinez ◽  
Yoshinari Ikeda ◽  
...  
Keyword(s):  
Low Temperature ◽  
Activation Method ◽  
Surface Activation ◽  
Low Temperature Bonding

Low Temperature Bonding with Wafer Level Nanocrystalline Cu Film

2021 ◽  
Author(s):  
Wei-Lan Chiu ◽  
Chia-Wen Chiang ◽  
Hsiang-Hung Chang
Keyword(s):  
Low Temperature ◽  
Wafer Level ◽  
Cu Film ◽  
Low Temperature Bonding
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