Selected Topics in Electronics and Systems - High Performance Design Automation for Multi-Chip Modules and Packages
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Published By WORLD SCIENTIFIC

9789810223076, 9789812830852

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

EARLY FEASIBILITY AND COST ASSESSMENT FOR MULTICHIP MODULE TECHNOLOGIES

Selected Topics in Electronics and Systems - High Performance Design Automation for Multi-Chip Modules and Packages ◽

10.1142/9789812830852_0002 ◽

1996 ◽

pp. 25-42

Author(s):

ROBERT C. CARDEN ◽

CHUNG-KUAN CHENG

Keyword(s):

Multichip Module ◽

Cost Assessment

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AN OVERVIEW OF PLACEMENT AND ROUTING ALGORITHMS FOR MULTI-CHIP MODULES

Selected Topics in Electronics and Systems - High Performance Design Automation for Multi-Chip Modules and Packages ◽

10.1142/9789812830852_0001 ◽

1996 ◽

pp. 3-23 ◽

Cited By ~ 1

Author(s):

SUBHOMOY CHATTOPADHYAY ◽

DONALD W. BOULDIN ◽

PEYMAN H. DEHKORDI

Keyword(s):

Routing Algorithms ◽

Placement And Routing

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SIMULTANEOUS SWITCHING NOISE ANALYSIS OF A 16 MB × 9 DRAM SIMM MEMORY MODULE

Selected Topics in Electronics and Systems - High Performance Design Automation for Multi-Chip Modules and Packages ◽

10.1142/9789812830852_0013 ◽

1996 ◽

pp. 233-254

Author(s):

JONG-HOON PARK ◽

HONG-JUNE PARK ◽

BO-KYOUNG CHOI ◽

OH-HYUN KIM ◽

SI-DON CHOI

Keyword(s):

Noise Analysis ◽

Switching Noise ◽

Memory Module ◽

Simultaneous Switching Noise ◽

Simultaneous Switching

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BOARD LEVEL PARTITIONING FOR IMPROVED PARTIAL SCAN

Selected Topics in Electronics and Systems - High Performance Design Automation for Multi-Chip Modules and Packages ◽

10.1142/9789812830852_0009 ◽

1996 ◽

pp. 159-180

Author(s):

SPYROS TRAGOUDAS

Keyword(s):

Partial Scan ◽

Board Level

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INTERCONNECT DESIGN AND SYNTHESIS IN HIGH SPEED PRINTED CIRCUIT BOARDS AND MULTI-CHIP MODULES

Selected Topics in Electronics and Systems - High Performance Design Automation for Multi-Chip Modules and Packages ◽

10.1142/9789812830852_0008 ◽

1996 ◽

pp. 141-157

Author(s):

RAVENDER GOYAL

Keyword(s):

High Speed ◽

Printed Circuit Boards ◽

Circuit Boards ◽

Printed Circuit ◽

Design And Synthesis ◽

Interconnect Design

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AN OVERVIEW OF TECHNIQUES FOR PARTITIONING MULTICHIP MODULES

Selected Topics in Electronics and Systems - High Performance Design Automation for Multi-Chip Modules and Packages ◽

10.1142/9789812830852_0007 ◽

1996 ◽

pp. 125-139

Author(s):

S. RAMAN ◽

L. M. PATNAIK

Keyword(s):

Multichip Modules

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LAYER ASSIGNMENT FOR HIGH-SPEED MCM PACKAGING

Selected Topics in Electronics and Systems - High Performance Design Automation for Multi-Chip Modules and Packages ◽

10.1142/9789812830852_0004 ◽

1996 ◽

pp. 61-79 ◽

Cited By ~ 1

Author(s):

KAI-YUAN CHAO ◽

D. F. WONG

Keyword(s):

High Speed ◽

Layer Assignment

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OPTIMAL ALGORITHMS FOR SUBSTRATE TESTING IN MULTI-CHIP MODULES

Selected Topics in Electronics and Systems - High Performance Design Automation for Multi-Chip Modules and Packages ◽

10.1142/9789812830852_0010 ◽

1996 ◽

pp. 181-198 ◽

Cited By ~ 3

Author(s):

ANDREW B. KAHNG ◽

GABRIEL ROBINS ◽

ELIZABETH A. WALKUP

Keyword(s):

Optimal Algorithms

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FRONT MATTER

Selected Topics in Electronics and Systems - High Performance Design Automation for Multi-Chip Modules and Packages ◽

10.1142/9789812830852_fmatter ◽

1996 ◽

pp. i-x

Author(s):

Jun-Dong Cho ◽

Paul D. Franzon

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63-LAYER TCM WIRING WITH THREE-DIMENSIONAL CROSSTALK CONSTRAINTS

Selected Topics in Electronics and Systems - High Performance Design Automation for Multi-Chip Modules and Packages ◽

10.1142/9789812830852_0005 ◽

1996 ◽

pp. 81-92 ◽

Cited By ~ 1

Author(s):

HOWARD H. CHEN ◽

C. K. WONG

Keyword(s):

Three Dimensional

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Selected Topics in Electronics and Systems - High Performance Design Automation for Multi-Chip Modules and PackagesLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By WORLD SCIENTIFIC

EARLY FEASIBILITY AND COST ASSESSMENT FOR MULTICHIP MODULE TECHNOLOGIES

AN OVERVIEW OF PLACEMENT AND ROUTING ALGORITHMS FOR MULTI-CHIP MODULES

SIMULTANEOUS SWITCHING NOISE ANALYSIS OF A 16 MB × 9 DRAM SIMM MEMORY MODULE

BOARD LEVEL PARTITIONING FOR IMPROVED PARTIAL SCAN

INTERCONNECT DESIGN AND SYNTHESIS IN HIGH SPEED PRINTED CIRCUIT BOARDS AND MULTI-CHIP MODULES

AN OVERVIEW OF TECHNIQUES FOR PARTITIONING MULTICHIP MODULES

LAYER ASSIGNMENT FOR HIGH-SPEED MCM PACKAGING

OPTIMAL ALGORITHMS FOR SUBSTRATE TESTING IN MULTI-CHIP MODULES

FRONT MATTER

63-LAYER TCM WIRING WITH THREE-DIMENSIONAL CROSSTALK CONSTRAINTS

Selected Topics in Electronics and Systems - High Performance Design Automation for Multi-Chip Modules and Packages
Latest Publications