Micro-Nano Technology XVII–XVIII
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9789813232792, 9789813232808
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Effect of Solder Bump Size on Electro-Migration Failure in Flip Chip Package

2017 ◽  
Author(s):  
P. S. Liu ◽  
Y. H. Liu ◽  
L. L. Yang ◽  
G. M. Fan
Keyword(s):  
Flip Chip ◽  
Solder Bump

The Application of MEMS Supercapacitor in Secondary Electric Power Supply of Penetration Fuze

2017 ◽  
Author(s):  
Z. H. Shao ◽  
R. Li ◽  
J. Wang ◽  
X. C. Zi
Keyword(s):  
Electric Power ◽  
Power Supply ◽  
Electric Power Supply

The Preparation of PDA/Ag Composite and Ag NPs Array

2017 ◽  
Author(s):  
J. Li ◽  
L. Yan
Keyword(s):  
Ag Nps

Effect of Pretreatment on the Pitting Corrosion of the Anode Foils for the Aluminum Electrolytic Capacitor

2017 ◽  
Author(s):  
H. M. Zheng ◽  
B. G. Peng ◽  
J. W. Cui ◽  
Y. Wang ◽  
Y. Q. Qin ◽  
...  
Keyword(s):  
Pitting Corrosion ◽  
Electrolytic Capacitor ◽  
Aluminum Electrolytic Capacitor

Effect of Purity of Source Material on the Al Micro/Nanowire Fabrication by Stress Migration

2017 ◽  
Author(s):  
Y. B. Lu ◽  
C. H. Liu ◽  
J. M. Gu
Keyword(s):  
Source Material

Design and Characterization of Optical Interrogated Micromachined Accelerometer

2017 ◽  
Author(s):  
L. S. Feng ◽  
Y. Zhang ◽  
Z. L. Zhang

Silicon Based Integrated Passive Devices Combined with Interposer for Micro/Millimeter Wave Application

2017 ◽  
Author(s):  
M. Huang ◽  
J. Zhu ◽  
G. X. Shi ◽  
P. Soussan ◽  
B. Vereecke
Keyword(s):  
Millimeter Wave ◽  
Passive Devices ◽  
Silicon Based

Design and Characterization of Biaxial Optical Interrogated Micro Displacement Transducer

2017 ◽  
Author(s):  
L. S. Feng ◽  
D. N. Liu ◽  
X. Wang
Keyword(s):  
Displacement Transducer
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