2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007

Generating VHDL-AMS Models of Digital-to-Analogue Converters From MATLAB®/SIMULINK®

2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 ◽

10.1109/esime.2007.360029 ◽

2007 ◽

Cited By ~ 3

Author(s):

Alexandre Cesar Rodrigues da Silva ◽

Ian Grout ◽

Jeffrey Ryan ◽

Thomas O'Shea

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The chemical-mechanical relationship of the SiOC(H) dielectric film

2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 ◽

10.1109/esime.2007.360027 ◽

2007 ◽

Cited By ~ 3

Author(s):

Cadmus Yuan ◽

O. van der Sluis ◽

G. Q. Zhang ◽

L. J. Ernst ◽

W. D. van Driel ◽

...

Keyword(s):

Dielectric Film ◽

Relationship Of

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Finite Element Modelling (FEM) of Green Electronics in Aeronautical and Military Communication Systems (GEAMCOS)

2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 ◽

10.1109/esime.2007.359936 ◽

2007 ◽

Author(s):

A. Chaillot ◽

G. Massiot ◽

C. Munier ◽

I. Lombaert-Valot ◽

S. Bousquet ◽

...

Keyword(s):

Finite Element ◽

Finite Element Modelling ◽

Communication Systems ◽

Element Modelling ◽

Green Electronics

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Underexpanded Micro-nozzle Flow Simulation with Coupled Thermal-Fluid Modeling

2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 ◽

10.1109/esime.2007.360025 ◽

2007 ◽

Author(s):

Jose Hermida Quesada ◽

Jose A. Morinigo ◽

Francisco Caballero Requena

Keyword(s):

Flow Simulation ◽

Nozzle Flow ◽

Fluid Modeling ◽

Micro Nozzle

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Creep Analysis of a Lead-free Surface Mount Device

2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 ◽

10.1109/esime.2007.360013 ◽

2007 ◽

Author(s):

Pradeep Hegde ◽

David Whalley ◽

Vadim. V. Silberschmidt

Keyword(s):

Free Surface ◽

Lead Free ◽

Surface Mount ◽

Creep Analysis

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The Dependence of Composition, Cooling Rate and Size on the Solidification Behaviour of SnAgCu Solders

2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 ◽

10.1109/esime.2007.359953 ◽

2007 ◽

Cited By ~ 11

Author(s):

Maik Mueller ◽

Steffen Wiese ◽

Mike Roellig ◽

Klaus-Juergen Wolter

Keyword(s):

Cooling Rate ◽

Solidification Behaviour

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[PDF Not Yet Available In IEEE Xplore]

2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 ◽

10.1109/esime.2007.360036 ◽

2007 ◽

Download Full-text

Electromigration in Large Volume Solder Joints

2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 ◽

10.1109/esime.2007.359954 ◽

2007 ◽

Cited By ~ 1

Author(s):

Karsten Meier ◽

Mike Roellig ◽

Steffen Wiese ◽

Carsten Goette ◽

Ulrich Deml ◽

...

Keyword(s):

Large Volume ◽

Solder Joints

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The effect of board stiffness on the solder-joint reliability of HVQFN-packages

2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 ◽

10.1109/esime.2007.360021 ◽

2007 ◽

Cited By ~ 1

Author(s):

J. de Vries ◽

M. Jansen ◽

W. van Driel

Keyword(s):

Solder Joint ◽

Solder Joint Reliability ◽

Joint Reliability

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Multi-objective Parametric Approach to Numerical Optimization of Stacked Packages

2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 ◽

10.1109/esime.2007.359963 ◽

2007 ◽

Cited By ~ 1

Author(s):

Lukasz Dowhan ◽

Artur Wymyslowski ◽

Rainer Dudek

Keyword(s):

Numerical Optimization ◽

Parametric Approach ◽

Multi Objective

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2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Generating VHDL-AMS Models of Digital-to-Analogue Converters From MATLAB®/SIMULINK®

The chemical-mechanical relationship of the SiOC(H) dielectric film

Finite Element Modelling (FEM) of Green Electronics in Aeronautical and Military Communication Systems (GEAMCOS)

Underexpanded Micro-nozzle Flow Simulation with Coupled Thermal-Fluid Modeling

Creep Analysis of a Lead-free Surface Mount Device

The Dependence of Composition, Cooling Rate and Size on the Solidification Behaviour of SnAgCu Solders

[PDF Not Yet Available In IEEE Xplore]

Electromigration in Large Volume Solder Joints

The effect of board stiffness on the solder-joint reliability of HVQFN-packages

Multi-objective Parametric Approach to Numerical Optimization of Stacked Packages

Export Citation Format

2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Generating VHDL-AMS Models of Digital-to-Analogue Converters From MATLAB®/SIMULINK®

The chemical-mechanical relationship of the SiOC(H) dielectric film

Finite Element Modelling (FEM) of Green Electronics in Aeronautical and Military Communication Systems (GEAMCOS)

Underexpanded Micro-nozzle Flow Simulation with Coupled Thermal-Fluid Modeling

Creep Analysis of a Lead-free Surface Mount Device

The Dependence of Composition, Cooling Rate and Size on the Solidification Behaviour of SnAgCu Solders

[PDF Not Yet Available In IEEE Xplore]

Electromigration in Large Volume Solder Joints

The effect of board stiffness on the solder-joint reliability of HVQFN-packages

Multi-objective Parametric Approach to Numerical Optimization of Stacked Packages

2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007
Latest Publications