Materials for Information Technology - Engineering Materials and Processes
Latest Publications

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Published By Springer-Verlag

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Challenges to Advanced Materials Characterization for ULSI Applications

Materials for Information Technology - Engineering Materials and Processes ◽

10.1007/1-84628-235-7_34 ◽

2006 ◽

pp. 421-435

Author(s):

A. C. Diebold

Keyword(s):

Materials Characterization ◽

Advanced Materials

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Electrically Conductive Adhesives as Solder Alternative: A Feasible Challenge

Materials for Information Technology - Engineering Materials and Processes ◽

10.1007/1-84628-235-7_30 ◽

2006 ◽

pp. 363-375 ◽

Cited By ~ 6

Author(s):

G. Luyckx ◽

G. Dreezen

Keyword(s):

Conductive Adhesives ◽

Electrically Conductive ◽

Electrically Conductive Adhesives

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Scaling of Ferroelectric-based Memory Concepts

Materials for Information Technology - Engineering Materials and Processes ◽

10.1007/1-84628-235-7_14 ◽

2006 ◽

pp. 149-161 ◽

Cited By ~ 1

Author(s):

R. Waser

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Synthesis and Characterization of Compounds Obtained by Crosslinking of Polymethylhydrosiloxane by Aromatic Rings

Materials for Information Technology - Engineering Materials and Processes ◽

10.1007/1-84628-235-7_25 ◽

2006 ◽

pp. 297-303

Author(s):

F. Sediri ◽

F. Touati ◽

N. Gharbi

Keyword(s):

Synthesis And Characterization ◽

Aromatic Rings

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Copper CVD for Conformal Ultrathin-film Deposition

Materials for Information Technology - Engineering Materials and Processes ◽

10.1007/1-84628-235-7_5 ◽

2006 ◽

pp. 51-59 ◽

Cited By ~ 1

Author(s):

M. Joulauda ◽

P. Doppelt

Keyword(s):

Ultrathin Film ◽

Film Deposition

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The Role of Au/Sn Solder in Packaging

Materials for Information Technology - Engineering Materials and Processes ◽

10.1007/1-84628-235-7_31 ◽

2006 ◽

pp. 377-390 ◽

Cited By ~ 5

Author(s):

H. Oppermann

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Stress Modeling for Copper Interconnect Structures

Materials for Information Technology - Engineering Materials and Processes ◽

10.1007/1-84628-235-7_22 ◽

2006 ◽

pp. 251-263 ◽

Cited By ~ 1

Author(s):

V. Sukharev

Keyword(s):

Stress Modeling ◽

Copper Interconnect

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Wafer-Level Three-Dimensional Hyper-Integration Technology Using Dielectric Adhesive Wafer Bonding

Materials for Information Technology - Engineering Materials and Processes ◽

10.1007/1-84628-235-7_33 ◽

2006 ◽

pp. 405-417 ◽

Cited By ~ 9

Author(s):

J. -Q. Lu ◽

T. S. Cale ◽

R. J. Gutmann

Keyword(s):

Wafer Bonding ◽

Three Dimensional ◽

Wafer Level ◽

Integration Technology

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Thin-film Engineering by Atomic-layer Deposition for Ultra-scaled and Novel Devices

Materials for Information Technology - Engineering Materials and Processes ◽

10.1007/1-84628-235-7_3 ◽

2006 ◽

pp. 31-38 ◽

Cited By ~ 1

Author(s):

G. Scarel ◽

M. Fanciulli

Keyword(s):

Thin Film ◽

Atomic Layer Deposition ◽

Atomic Layer ◽

Layer Deposition ◽

Novel Devices

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Advanced Material Characterization by TOFSIMS in Microelectronic

Materials for Information Technology - Engineering Materials and Processes ◽

10.1007/1-84628-235-7_35 ◽

2006 ◽

pp. 437-447

Author(s):

T. Conard ◽

W. Vandervorst

Keyword(s):

Material Characterization ◽

Advanced Material

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Materials for Information Technology - Engineering Materials and ProcessesLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By Springer-Verlag

Challenges to Advanced Materials Characterization for ULSI Applications

Electrically Conductive Adhesives as Solder Alternative: A Feasible Challenge

Scaling of Ferroelectric-based Memory Concepts

Synthesis and Characterization of Compounds Obtained by Crosslinking of Polymethylhydrosiloxane by Aromatic Rings

Copper CVD for Conformal Ultrathin-film Deposition

The Role of Au/Sn Solder in Packaging

Stress Modeling for Copper Interconnect Structures

Wafer-Level Three-Dimensional Hyper-Integration Technology Using Dielectric Adhesive Wafer Bonding

Thin-film Engineering by Atomic-layer Deposition for Ultra-scaled and Novel Devices

Advanced Material Characterization by TOFSIMS in Microelectronic

Materials for Information Technology - Engineering Materials and Processes
Latest Publications