Copper CVD for Conformal Ultrathin-film Deposition

2006 ◽  
pp. 51-59 ◽  
Author(s):  
M. Joulauda ◽  
P. Doppelt
Keyword(s):  
Ultrathin Film ◽  
Film Deposition

Perylene tetracarboxylic diimide ultrathin film deposition on Pt(100): a LEED, AES, REELS and STM study

2004 ◽  
Vol 548 (1-3) ◽  
pp. 129-137 ◽  
Author(s):  
O. Guillermet ◽  
A. Glachant ◽  
J.Y. Hoarau ◽  
J.C. Mossoyan ◽  
M. Mossoyan
Keyword(s):  
Ultrathin Film ◽  
Film Deposition

Ultrathin Film Deposition by Liquid CO2Free Meniscus CoatingUniformity and Morphology

Langmuir ◽  
2006 ◽  
Vol 22 (2) ◽  
pp. 642-657 ◽  
Author(s):  
Jaehoon Kim ◽  
Brian J. Novick ◽  
Joseph M. DeSimone ◽  
Ruben G. Carbonell
Keyword(s):  
Ultrathin Film ◽  
Film Deposition

Ultrathin film deposition of Ba1−xRbxBiO3by molecular beam epitaxy using distilled ozone

1993 ◽  
Vol 63 (19) ◽  
pp. 2694-2696
Author(s):  
M. Ogihara ◽  
T. Makita ◽  
H. Abe
Keyword(s):  
Molecular Beam Epitaxy ◽  
Molecular Beam ◽  
Ultrathin Film ◽  
Film Deposition

Ultrathin film deposition by pulsed laser ablation using crossed beams

1996 ◽  
Vol 96-98 ◽  
pp. 649-655 ◽  
Author(s):  
A.A. Gorbunov ◽  
W. Pompe ◽  
A. Sewing ◽  
S.V. Gaponov ◽  
A.D. Akhsakhalyan ◽  
...  
Keyword(s):  
Laser Ablation ◽  
Pulsed Laser ◽  
Pulsed Laser Ablation ◽  
Ultrathin Film ◽  
Film Deposition ◽  
Crossed Beams

scholarly journals Simple Non-Destructive Method of Ultrathin Film Material Properties and Generated Internal Stress Determination Using Microcantilevers Immersed in Air

Coatings ◽  
2019 ◽  
Vol 9 (8) ◽  
pp. 486 ◽  
Author(s):  
Ivo Stachiv ◽  
Lifeng Gan
Keyword(s):  
Internal Stress ◽  
Quality Factor ◽  
Ultrathin Films ◽  
Material Properties ◽  
Ultrathin Film ◽  
Film Deposition ◽  
Film Material ◽  
Quality Factors ◽  
Resonant Frequencies ◽  
Film Density

Recent progress in nanotechnology has enabled to design the advanced functional micro-/nanostructures utilizing the unique properties of ultrathin films. To ensure these structures can reach the expected functionality, it is necessary to know the density, generated internal stress and the material properties of prepared films. Since these films have thicknesses of several tens of nm, their material properties, including density, significantly deviate from the known bulk values. As such, determination of ultrathin film material properties requires usage of highly sophisticated devices that are often expensive, difficult to operate, and time consuming. Here, we demonstrate the extraordinary capability of a microcantilever commonly used in a conventional atomic force microscope to simultaneously measure multiple material properties and internal stress of ultrathin films. This procedure is based on detecting changes in the static deflection, flexural and torsional resonant frequencies, and the corresponding quality factors of the microcantilever vibrating in air before and after film deposition. In contrast to a microcantilever in vacuum, where the quality factor depends on the combination of multiple different mechanical energy losses, in air the quality factor is dominated just by known air damping, which can be precisely controlled by changing the air pressure. Easily accessible expressions required to calculate the ultrathin film density, the Poisson’s ratio, and the Young’s and shear moduli from measured changes in the microcantilever resonant frequencies, and quality factors are derived. We also show that the impact of uncertainties on determined material properties is only minor. The validity and potential of the present procedure in material testing is demonstrated by (i) extracting the Young’s modulus of atomic-layer-deposited TiO2 films coated on a SU-8 microcantilever from observed changes in frequency response and without requirement of knowing the film density, and (ii) comparing the shear modulus and density of Si3N4 films coated on the silicon microcantilever obtained numerically and by present method.

Ultrathin film deposition by pulsed laser ablation using crossed beams

1996 ◽  
pp. 649-655
Author(s):  
A.A. Gorbunov ◽  
W. Pompe ◽  
A. Sewing ◽  
S.V. Gaponov ◽  
A.D. Akhsakhalyan ◽  
...  
Keyword(s):  
Laser Ablation ◽  
Pulsed Laser ◽  
Pulsed Laser Ablation ◽  
Ultrathin Film ◽  
Film Deposition ◽  
Crossed Beams

scholarly journals Ultrathin film deposition for nanoelectronic device manucturing

2020 ◽  
Vol 781 ◽  
pp. 012021
Author(s):  
Y V Panfilov ◽  
I A Rodionov ◽  
I A Ryzhikov ◽  
A S Baburin ◽  
D O Moskalev ◽  
...  
Keyword(s):  
Ultrathin Film ◽  
Film Deposition ◽  
Nanoelectronic Device

Characterization of Sputtered Films using the Scanning Electron Microscope

1973 ◽  
Vol 31 ◽  
pp. 44-45
Author(s):  
R. F. Schneidmiller ◽  
W. F. Thrower ◽  
C. Ang
Keyword(s):  
Electron Microscope ◽  
Scanning Electron Microscope ◽  
Thin Film Deposition ◽  
Film Deposition ◽  
Sputtered Films ◽  
Plasma Sputtering ◽  
Microelectronic Devices ◽  
Control Film ◽  
Scanning Electron

Solid state materials in the form of thin films have found increasing structural and electronic applications. Among the multitude of thin film deposition techniques, the radio frequency induced plasma sputtering has gained considerable utilization in recent years through advances in equipment design and process improvement, as well as the discovery of the versatility of the process to control film properties. In our laboratory we have used the scanning electron microscope extensively in the direct and indirect characterization of sputtered films for correlation with their physical and electrical properties.Scanning electron microscopy is a powerful tool for the examination of surfaces of solids and for the failure analysis of structural components and microelectronic devices.

Observations on the growth of YBa2Cu3O7-δ thin films on MgO by pulsed-laser ablation

1991 ◽  
Vol 49 ◽  
pp. 1068-1069
Author(s):  
M. Grant Norton ◽  
C. Barry Carter
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Laser Ablation ◽  
Substrate Surface ◽  
Pulsed Laser ◽  
Pulsed Laser Ablation ◽  
Thin Film Deposition ◽  
Film Deposition ◽  
Laser Ablation Process ◽  
Deposition Parameters

Pulsed-laser ablation has been widely used to produce high-quality thin films of YBa2Cu3O7-δ on a range of substrate materials. The nonequilibrium nature of the process allows congruent deposition of oxides with complex stoichiometrics. In the high power density regime produced by the UV excimer lasers the ablated species includes a mixture of neutral atoms, molecules and ions. All these species play an important role in thin-film deposition. However, changes in the deposition parameters have been shown to affect the microstructure of thin YBa2Cu3O7-δ films. The formation of metastable configurations is possible because at the low substrate temperatures used, only shortrange rearrangement on the substrate surface can occur. The parameters associated directly with the laser ablation process, those determining the nature of the process, e g. thermal or nonthermal volatilization, have been classified as ‘primary parameters'. Other parameters may also affect the microstructure of the thin film. In this paper, the effects of these ‘secondary parameters' on the microstructure of YBa2Cu3O7-δ films will be discussed. Examples of 'secondary parameters' include the substrate temperature and the oxygen partial pressure during deposition.

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