2017 International Conference on Electronics Packaging (ICEP)
Latest Publications

TOTAL DOCUMENTS

155
(FIVE YEARS 0)

H-INDEX

5
(FIVE YEARS 0)

Published By IEEE

9784990218836
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Trends in Fan-out wafer and panel level packaging

2017 ◽  
Author(s):  
Tanja Braun ◽  
Karl-Friedrich Becker ◽  
Markus Wohrmann ◽  
Michael Topper ◽  
Lars Bottcher ◽  
...  

Study on temperature dependence of viscosity of halogen-free dispensing solder paste

2017 ◽  
Author(s):  
Tetsuya Yamamoto ◽  
Yuchen Hsu ◽  
Toshihide Takahashi ◽  
Akiya Kimura ◽  
Daisuke Hiratsuka ◽  
...  
Keyword(s):  
Temperature Dependence ◽  
Solder Paste ◽  
Halogen Free

Encapsulation processes and materials for advanced package

2017 ◽  
Author(s):  
Joji Yukimaru ◽  
Yuki Ishikawa ◽  
Tomoya Takao ◽  
Kazuhiro Ikeda ◽  
Akira Nakao

Reducing technique of sidelobe in millimeter wave beam multiplexing system

2017 ◽  
Author(s):  
Shohei Ishikawa ◽  
Atsushi Honda ◽  
Toshihiro Shimura ◽  
Yoji Ohashi ◽  
Masahiko Shimizu
Keyword(s):  
Millimeter Wave ◽  
Wave Beam

Direct copper metallization on glass technology

2017 ◽  
Author(s):  
Shigeo Onitake ◽  
Kotoku Inoue ◽  
Masatoshi Takayama ◽  
Tsubasa Fujimura
Keyword(s):  
Copper Metallization ◽  
Glass Technology
Load More ...
Sign in / Sign up

Export Citation Format

Share Document