2007 International Conference on Electronic Materials and Packaging
Latest Publications

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Published By IEEE

9781424419098, 9781424419104

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Enabling recipe automation for non SECS/GEM semiconductor assembly machines.

2007 International Conference on Electronic Materials and Packaging ◽

10.1109/emap.2007.4510283 ◽

2007 ◽

Author(s):

Heong Chee Meng ◽

Amin Mohd Sani

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Thermal stability at the anisotropic conductive films (ACFs)/ organic solderability preservatives (OSPs) Interface

2007 International Conference on Electronic Materials and Packaging ◽

10.1109/emap.2007.4510309 ◽

2007 ◽

Author(s):

Il Kim ◽

Hyoung-Joon Kim ◽

Kyung-Wook Paik

Keyword(s):

Thermal Stability ◽

Conductive Films

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Development of lamination process for chip-in-substrates

2007 International Conference on Electronic Materials and Packaging ◽

10.1109/emap.2007.4510306 ◽

2007 ◽

Cited By ~ 1

Author(s):

Jong Woon Kim ◽

Hwa Sun Park ◽

Sang Chul Lee ◽

Yul Kyo Chung ◽

Seog Moon Choi ◽

...

Keyword(s):

Lamination Process

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A nondestructive evaluation system for detecting open failures of micro bump interconnections in 3D-stacked structures

2007 International Conference on Electronic Materials and Packaging ◽

10.1109/emap.2007.4510293 ◽

2007 ◽

Author(s):

Yuki Sato ◽

Hideo Miura

Keyword(s):

Nondestructive Evaluation ◽

Evaluation System

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Determination of LED die strength

2007 International Conference on Electronic Materials and Packaging ◽

10.1109/emap.2007.4510287 ◽

2007 ◽

Cited By ~ 2

Author(s):

C. H. Chen ◽

M. Y. Tsai ◽

J. Y. Tang ◽

W. L. Tsai ◽

T. J. Chen

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Process characterization of aluminum ribbon bond

2007 International Conference on Electronic Materials and Packaging ◽

10.1109/emap.2007.4510320 ◽

2007 ◽

Author(s):

F. Lim ◽

Low Wo ◽

C. Lee ◽

Bob Rizal

Keyword(s):

Process Characterization

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Warpage analysis of an LCD panel under thermo-mechanical and hygro-mechanical stress

2007 International Conference on Electronic Materials and Packaging ◽

10.1109/emap.2007.4510277 ◽

2007 ◽

Cited By ~ 2

Author(s):

Tomonori Mizutani ◽

Toru Ikeda ◽

Kiyoshi Miyake ◽

Noriyuki Miyazaki

Keyword(s):

Mechanical Stress

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Underfill flow performance assessment

2007 International Conference on Electronic Materials and Packaging ◽

10.1109/emap.2007.4510336 ◽

2007 ◽

Author(s):

YewChoon Chia ◽

K. S. Chian ◽

S. Yi

Keyword(s):

Performance Assessment ◽

Underfill Flow

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Experimental and numerical investigations of two inline PLCC packages horizontal mounted

2007 International Conference on Electronic Materials and Packaging ◽

10.1109/emap.2007.4510321 ◽

2007 ◽

Author(s):

Z. Mohd Ali ◽

S. Yusoff ◽

M. Z. Abdullah

Keyword(s):

Numerical Investigations

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Local distribution of residual strain in 3-D stacked flip chips measured by strain sensor chips with 2-μm long piezoresistive gauges

2007 International Conference on Electronic Materials and Packaging ◽

10.1109/emap.2007.4510297 ◽

2007 ◽

Author(s):

Takuya Sasaki ◽

Nobuki Ueta ◽

Hideo Miura

Keyword(s):

Residual Strain ◽

Strain Sensor ◽

Local Distribution ◽

Flip Chips

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2007 International Conference on Electronic Materials and PackagingLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Enabling recipe automation for non SECS/GEM semiconductor assembly machines.

Thermal stability at the anisotropic conductive films (ACFs)/ organic solderability preservatives (OSPs) Interface

Development of lamination process for chip-in-substrates

A nondestructive evaluation system for detecting open failures of micro bump interconnections in 3D-stacked structures

Determination of LED die strength

Process characterization of aluminum ribbon bond

Warpage analysis of an LCD panel under thermo-mechanical and hygro-mechanical stress

Underfill flow performance assessment

Experimental and numerical investigations of two inline PLCC packages horizontal mounted

Local distribution of residual strain in 3-D stacked flip chips measured by strain sensor chips with 2-μm long piezoresistive gauges

2007 International Conference on Electronic Materials and Packaging
Latest Publications