Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI
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Introduction of infrared spectroscopic ellipsometry in a semiconductor production environment

Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI ◽

10.1109/asmc.2003.1194501 ◽

2003 ◽

Cited By ~ 1

Author(s):

P. Weidner ◽

U. Mantz ◽

P.Y. Guittet ◽

R. Wienhold ◽

M. Rimane ◽

...

Keyword(s):

Spectroscopic Ellipsometry ◽

Production Environment ◽

Infrared Spectroscopic ◽

Semiconductor Production

Precision and accuracy of CD-SEM profile reconstruction for the 110 technology node

Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI ◽

10.1109/asmc.2003.1194467 ◽

2003 ◽

Cited By ~ 2

Author(s):

T. Marschner ◽

C. Stief

Keyword(s):

Technology Node ◽

Precision And Accuracy ◽

Profile Reconstruction

Wafer backside inspection applications in lithography

Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI ◽

10.1109/asmc.2003.1194459 ◽

2003 ◽

Cited By ~ 2

Author(s):

K. Lederer ◽

M. Scholze ◽

U. Strohbach ◽

A. Wocko ◽

T. Reuter ◽

...

Dual damascene trench depth control by Irm/spl trade/: a novel interferometric endpoint system

Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI ◽

10.1109/asmc.2003.1194466 ◽

2003 ◽

Author(s):

P. Mangiagalli ◽

T. Chevolleau ◽

N. Posseme ◽

C. Frum ◽

L. Sabnani ◽

...

Keyword(s):

Dual Damascene ◽

Depth Control

Reducing the overkills and retests in wafer testing process

Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI ◽

10.1109/asmc.2003.1194508 ◽

2003 ◽

Cited By ~ 1

Author(s):

S.C. Horng ◽

S.Y. Lin ◽

M.H. Cheng ◽

F.Y. Yang ◽

C.H. Liu ◽

...

How UV selectable illumination inspection tool and methodologies can accelerate learning curve of advanced technologies

Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI ◽

10.1109/asmc.2003.1194496 ◽

2003 ◽

Author(s):

V. Turines ◽

C. Archambault ◽

B. Hinschberger ◽

E. Rouchouze ◽

S. Bos-Lorenzo ◽

...

Keyword(s):

Learning Curve ◽

Advanced Technologies

Laser shock cleaning of inorganic micro and nanoscale particles

Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI ◽

10.1109/asmc.2003.1194464 ◽

2003 ◽

Cited By ~ 1

Author(s):

A.A. Busnaina ◽

J.G. Park ◽

J.M. Lee ◽

S.Y. You

Keyword(s):

Laser Shock ◽

Nanoscale Particles

Extending the HDP-CVD technology to the 90 nm node and beyond with an in-situ etch assisted (ISEA) HDP-CVD process

Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI ◽

10.1109/asmc.2003.1194480 ◽

2003 ◽

Author(s):

J. Radecker ◽

H. Weber

Endura XP: enabling high 300 mm semiconductor productivity and reliability for manufacturing excellence

Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI ◽

10.1109/asmc.2003.1194491 ◽

2003 ◽

Author(s):

F. Tice ◽

C. Hagerty

The influence of processing conditions on data retention behavior in a deep submicron NVM process

Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI ◽

10.1109/asmc.2003.1194479 ◽

2003 ◽

Cited By ~ 1

Author(s):

M. Karnett ◽

S. Qian ◽

R. Solis ◽

X. Tao ◽

A. Black ◽

...

Keyword(s):

Deep Submicron ◽

Processing Conditions ◽

Retention Behavior ◽

Data Retention

Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMILatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Introduction of infrared spectroscopic ellipsometry in a semiconductor production environment

Precision and accuracy of CD-SEM profile reconstruction for the 110 technology node

Wafer backside inspection applications in lithography

Dual damascene trench depth control by Irm/spl trade/: a novel interferometric endpoint system

Reducing the overkills and retests in wafer testing process

How UV selectable illumination inspection tool and methodologies can accelerate learning curve of advanced technologies

Laser shock cleaning of inorganic micro and nanoscale particles

Extending the HDP-CVD technology to the 90 nm node and beyond with an in-situ etch assisted (ISEA) HDP-CVD process

Endura XP: enabling high 300 mm semiconductor productivity and reliability for manufacturing excellence

The influence of processing conditions on data retention behavior in a deep submicron NVM process

Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI
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