Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI
Latest Publications

TOTAL DOCUMENTS

60

(FIVE YEARS 0)

H-INDEX

5

(FIVE YEARS 0)

Published By IEEE

0780376730

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Dual damascene trench depth control by Irm/spl trade/: a novel interferometric endpoint system

Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI ◽

10.1109/asmc.2003.1194466 ◽

2003 ◽

Author(s):

P. Mangiagalli ◽

T. Chevolleau ◽

N. Posseme ◽

C. Frum ◽

L. Sabnani ◽

...

Keyword(s):

Dual Damascene ◽

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Precision and accuracy of CD-SEM profile reconstruction for the 110 technology node

Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI ◽

10.1109/asmc.2003.1194467 ◽

2003 ◽

Author(s):

T. Marschner ◽

C. Stief

Keyword(s):

Technology Node ◽

Precision And Accuracy ◽

Profile Reconstruction

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Wafer backside inspection applications in lithography

Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI ◽

10.1109/asmc.2003.1194459 ◽

2003 ◽

Author(s):

K. Lederer ◽

M. Scholze ◽

U. Strohbach ◽

A. Wocko ◽

T. Reuter ◽

...

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Introduction of infrared spectroscopic ellipsometry in a semiconductor production environment

Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI ◽

10.1109/asmc.2003.1194501 ◽

2003 ◽

Author(s):

P. Weidner ◽

U. Mantz ◽

P.Y. Guittet ◽

R. Wienhold ◽

M. Rimane ◽

...

Keyword(s):

Spectroscopic Ellipsometry ◽

Production Environment ◽

Infrared Spectroscopic ◽

Semiconductor Production

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Laser shock cleaning of inorganic micro and nanoscale particles

Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI ◽

10.1109/asmc.2003.1194464 ◽

2003 ◽

Author(s):

A.A. Busnaina ◽

J.G. Park ◽

J.M. Lee ◽

S.Y. You

Keyword(s):

Laser Shock ◽

Nanoscale Particles

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Extending the HDP-CVD technology to the 90 nm node and beyond with an in-situ etch assisted (ISEA) HDP-CVD process

Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI ◽

10.1109/asmc.2003.1194480 ◽

2003 ◽

Author(s):

J. Radecker ◽

H. Weber

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Endura XP: enabling high 300 mm semiconductor productivity and reliability for manufacturing excellence

Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI ◽

10.1109/asmc.2003.1194491 ◽

2003 ◽

Author(s):

F. Tice ◽

C. Hagerty

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Reducing the overkills and retests in wafer testing process

Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI ◽

10.1109/asmc.2003.1194508 ◽

2003 ◽

Author(s):

S.C. Horng ◽

S.Y. Lin ◽

M.H. Cheng ◽

F.Y. Yang ◽

C.H. Liu ◽

...

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How UV selectable illumination inspection tool and methodologies can accelerate learning curve of advanced technologies

Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI ◽

10.1109/asmc.2003.1194496 ◽

2003 ◽

Author(s):

V. Turines ◽

C. Archambault ◽

B. Hinschberger ◽

E. Rouchouze ◽

S. Bos-Lorenzo ◽

...

Keyword(s):

Learning Curve ◽

Advanced Technologies

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The influence of processing conditions on data retention behavior in a deep submicron NVM process

Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI ◽

10.1109/asmc.2003.1194479 ◽

2003 ◽

Author(s):

M. Karnett ◽

S. Qian ◽

R. Solis ◽

X. Tao ◽

A. Black ◽

...

Keyword(s):

Deep Submicron ◽

Processing Conditions ◽

Retention Behavior ◽

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