20th International Workshop on Thermal Investigations of ICs and Systems
Latest Publications

TOTAL DOCUMENTS

65

(FIVE YEARS 0)

H-INDEX

5

(FIVE YEARS 0)

Published By IEEE

9781479954155

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Thermal characterization of a multi-heat source component with and without an external heat sink

20th International Workshop on Thermal Investigations of ICs and Systems ◽

10.1109/therminic.2014.6972492 ◽

2014 ◽

Author(s):

Wendy Luiten

Keyword(s):

Heat Source ◽

Heat Sink ◽

Thermal Characterization ◽

External Heat ◽

Source Component

Download Full-text

Parametric compact thermal models by moment matching for variable geometry

20th International Workshop on Thermal Investigations of ICs and Systems ◽

10.1109/therminic.2014.6972483 ◽

2014 ◽

Author(s):

Lorenzo Codecasa ◽

Vincenzo d'Alessandro ◽

Alessandro Magnani ◽

Niccolo Rinaldi

Keyword(s):

Variable Geometry ◽

Moment Matching ◽

Download Full-text

Green's function solution of hyperbolic heat equation suitable for thermal analysis of electronic nanostructures

20th International Workshop on Thermal Investigations of ICs and Systems ◽

10.1109/therminic.2014.6972508 ◽

2014 ◽

Author(s):

Marcin Janicki ◽

Mariusz Zubert ◽

Andrzej Napieralski

Keyword(s):

Thermal Analysis ◽

Heat Equation ◽

Green’S Function ◽

Green's Function ◽

Function Solution ◽

Hyperbolic Heat Equation

Download Full-text

Assessment of a heat spreading solution for hot spots cooling in compact packages

20th International Workshop on Thermal Investigations of ICs and Systems ◽

10.1109/therminic.2014.6972480 ◽

2014 ◽

Author(s):

R. Prieto ◽

G. Belly ◽

J. P. Colonna ◽

P. Coudrain ◽

F. de Crecy ◽

...

Keyword(s):

Hot Spots ◽

Download Full-text

Extracting model parameters from thermal transient measurements for thermal stress simulation

20th International Workshop on Thermal Investigations of ICs and Systems ◽

10.1109/therminic.2014.6972539 ◽

2014 ◽

Author(s):

Zoltan Sarkany ◽

Marta Rencz

Keyword(s):

Thermal Stress ◽

Model Parameters ◽

Thermal Transient ◽

Stress Simulation ◽

Transient Measurements

Download Full-text

Enhancement in CMOS chip performance through microfluidic cooling

20th International Workshop on Thermal Investigations of ICs and Systems ◽

10.1109/therminic.2014.6972541 ◽

2014 ◽

Author(s):

Zhimin Wan ◽

Wen Yueh ◽

Yogendra Joshi ◽

Saibal Mukhopadhyay

Keyword(s):

Download Full-text

Configurable heat generators for FPGAs

20th International Workshop on Thermal Investigations of ICs and Systems ◽

10.1109/therminic.2014.6972506 ◽

2014 ◽

Author(s):

Pawel Weber ◽

Maciej Zagrabski ◽

Przemyslaw Musz ◽

Krzysztof Kepa ◽

Maciej Nikodem ◽

...

Download Full-text

Thermal characterization of percolating thermal underfills: Bulk and cavity

20th International Workshop on Thermal Investigations of ICs and Systems ◽

10.1109/therminic.2014.6972493 ◽

2014 ◽

Author(s):

Brian R. Burg ◽

Manuel Koilly ◽

Kerry Yu ◽

Jonas Zurcher ◽

Gerd Schlottig ◽

...

Keyword(s):

Thermal Characterization

Download Full-text

Multi-channel and real-time monitoring system for junction temperature of light-emitting diodes

20th International Workshop on Thermal Investigations of ICs and Systems ◽

10.1109/therminic.2014.6972504 ◽

2014 ◽

Author(s):

Byungjin Ma ◽

Jemin Kim ◽

Sungsoon Choi ◽

Kwanhoon Lee

Keyword(s):

Real Time ◽

Monitoring System ◽

Light Emitting Diodes ◽

Junction Temperature ◽

Real Time Monitoring ◽

Download Full-text

Rational design of gold micro- and nanowires for high spatial and temporal resolution thermal investigations

20th International Workshop on Thermal Investigations of ICs and Systems ◽

10.1109/therminic.2014.6972523 ◽

2014 ◽

Author(s):

Olena Kraieva ◽

Carlos M. Quitero ◽

William Nicolazzi ◽

Gabor Molnar ◽

Christian Bergaud

Keyword(s):

Temporal Resolution ◽

Rational Design ◽

Thermal Investigations

Download Full-text