Fabrication Process for On-Board Geometries Using a Polymer Composite-Based Selective Metallization for Next-Generation Electronics Packaging

Advancements in production techniques in PCB manufacturing industries are still required as compared to silicon-ICs fabrications. One of the concerned areas in PCBs fabrication is the use of conventional methodologies for metallization. Most of the manufacturers are still using the traditional Copper (Cu) laminates on the base substrate and patterning the structures using lithography processes. As a result, significant amounts of metallic parts are etched away during any mass production process, causing unnecessary disposables leading to pollution. In this work, a new approach for Cu metallization is demonstrated with considerable step-reducing pattern-transfer mechanism. In the fabrication steps, a seed layer of covalent bonded metallization (CBM) chemistry on top of a dielectric epoxy resin is polymerized using actinic radiation intensity of a 375 nm UV laser source. The proposed method is capable of patterning any desirable geometries using the above-mentioned surface modification followed by metallization. To metallize the patterns, a proprietary electroless bath has been used. The metallic layer grows only on the selective polymer-activated locations and thus is called selective metallization. The highlight of this production technique is its occurrence at a low temperature (20–45 °C). In this paper, FR-4 as a base substrate and polyurethane (PU) as epoxy resin were used to achieve various geometries, useful in electronics packaging. In addition, analysis of the process parameters and some challenges witnessed during the process development are also outlined. As a use case, a planar inductor is fabricated to demonstrate the application of the proposed technique.

Planar Body-Mounted Sensors for Electromagnetic Tracking

Electromagnetic tracking is a safe, reliable, and cost-effective method to track medical instruments in image-guided surgical navigation. However, patient motion and magnetic field distortions heavily impact the accuracy of tracked position and orientation. The use of redundant magnetic sensors can help to map and mitigate for patient movements and magnetic field distortions within the tracking region. We propose a planar inductive sensor design, printed on PCB and embedded into medical patches. The main advantage is the high repeatability and the cost benefit of using mass PCB manufacturing processes. The article presents new operative formulas for electromagnetic tracking of planar coils on the centimetre scale. The full magnetic analytical model is based on the mutual inductance between coils which can be approximated as being composed by straight conductive filaments. The full model is used to perform accurate system simulations and to assess the accuracy of faster simplified magnetic models, which are necessary to achieve real-time tracking in medical applications.

Tactile Sensors for Parallel Grippers: Design and Characterization

Tactile data perception is of paramount importance in today’s robotics applications. This paper describes the latest design of the tactile sensor developed in our laboratory. Both the hardware and firmware concepts are reported in detail in order to allow the research community the sensor reproduction, also according to their needs. The sensor is based on optoelectronic technology and the pad shape can be adapted to various robotics applications. A flat surface, as the one proposed in this paper, can be well exploited if the object sizes are smaller than the pad and/or the shape recognition is needed, while a domed pad can be used to manipulate bigger objects. Compared to the previous version, the novel tactile sensor has a larger sensing area and a more robust electronic, mechanical and software design that yields less noise and higher flexibility. The proposed design exploits standard PCB manufacturing processes and advanced but now commercial 3D printing processes for the realization of all components. A GitHub repository has been prepared with all files needed to allow the reproduction of the sensor for the interested reader. The whole sensor has been tested with a maximum load equal to 15N, by showing a sensitivity equal to 0.018V/N. Moreover, a complete and detailed characterization for the single taxel and the whole pad is reported to show the potentialities of the sensor also in terms of response time, repeatability, hysteresis and signal to noise ratio.

A Low-Cost and Efficient Microstrip-Fed Air-Substrate-Integrated Waveguide Slot Array

A microstrip-fed air-substrate-integrated waveguide (ASIW) slot array with high efficiency and low cost is presented. The design cuts out the substrate material within SIW, replaces the vias with metallic sidewalls, and uses a simple microstrip line-waveguide transition to feed the slot array. Radiating slots are cut on a 5-mil brass-plate, which covers the top of the substrate cutout to resemble a hollow waveguide structure. This implementation provides a simple and efficient antenna array solution for millimeter-wave (mm-wave) applications. Meanwhile, the fabrication is compatible with the standard printed circuit board (PCB) manufacturing process. To demonstrate the concept, a 4-element ASIW slot array working at the n257 band for 5G communications was designed using low-cost Rogers 4350B and FR4 substrate materials. Our simulation result shows 18% more efficiency than a conventional SIW slot array using the same substrate. The fabricated prototype shows |S11| < −15 dB over 27–29 GHz and a peak realized gain of 10.1 dBi at 28.6 GHz. The design procedure, prototyping process, and design analysis are discussed in the paper.

An Overview of 3D X-Ray Reconstruction Algorithms for PCB Inspection

Printed Circuit Boards (PCBs) play a critical role in everyday electronic systems, therefore the quality and assurance of the functionality for these systems is a topic of great interest to the government and industry. PCB manufacturing has been largely outsourced to cut manufacturing costs in comparison with the designing and testing of PCBs which still retains a large presence domestically. This offshoring of manufacturing has created a surge in the supply chain vulnerability for potential adversaries to garner access and attack a device via a malicious modification. Current hardware assurance and verification methods are based on electrical and optical tests. These tests are limited in the detection of malicious hardware modifications, otherwise known as Hardware Trojans. For PCB manufacturing there has been an increase in the use of automated X-ray inspection. These inspections can validate a PCB’s functionality during production. Such inspections mitigate process errors in real time but are unable to perform highresolution characterization on multi-layer fully assembled PCBs. In this paper, several X-ray reconstruction methods, ranging from proprietary to open-source, are compared. The high-fidelity, commercial NRecon software for SkyScan 2211 Multi-scale X-ray micro-Tomography system is compared to various methods from the ASTRA Toolbox. The latter is an open-source, transparent approach to reconstruction via analytical and iterative methods. The toolbox is based on C++ and MEX file functions with MATLAB and Python wrappers for analysis of PCB samples. In addition, the differences in required imaging parameters and the resultant artifacts generated by planar PCBs are compared to the imaging of cylindrical biological samples. Finally, recommendations are made for improving the ASTRA Toolbox reconstruction results and guidance is given on the appropriate scenarios for each algorithm in the context of hardware assurance for PCBs.