scholarly journals Growth Kinetics of Intermetallic Compounds on the Boundary between Au and In-48Sn Solder.

1998 ◽  
Vol 13 (1) ◽  
pp. 24-29
Author(s):  
Ikuo SHOHJI ◽  
Shinichi FUJIWARA ◽  
Shinya KIYONO ◽  
Kojiro F.KOBAYASHI
Keyword(s):  
Intermetallic Compounds ◽  
Growth Kinetics ◽  
Kinetics Of

Effects of Annealing, Thermomigration, and Electromigration on the Intermetallic Compounds Growth Kinetics of Cu/Sn-2.5Ag Microbump

2015 ◽  
Vol 15 (11) ◽  
pp. 8593-8600 ◽  
Author(s):  
Seung-Hyun Kim ◽  
Gyu-Tae Park ◽  
Jong-Jin Park ◽  
Young-Bae Park
Keyword(s):  
Intermetallic Compounds ◽  
Growth Kinetics ◽  
Kinetics Of

Growth kinetics of Al–Fe intermetallic compounds during annealing treatment of friction stir lap welds

2014 ◽  
Vol 90 ◽  
pp. 121-126 ◽  
Author(s):  
M. Movahedi ◽  
A.H. Kokabi ◽  
S.M. Seyed Reihani ◽  
H. Najafi ◽  
S.A. Farzadfar ◽  
...  
Keyword(s):  
Intermetallic Compounds ◽  
Growth Kinetics ◽  
Annealing Treatment ◽  
Friction Stir ◽  
Kinetics Of

Evolution behavior and growth kinetics of intermetallic compounds at Sn/Cu interface during multiple reflows

2018 ◽  
Vol 96 ◽  
pp. 1-12 ◽  
Author(s):  
H.R. Ma ◽  
A. Kunwar ◽  
S.Y. Shang ◽  
C.R. Jiang ◽  
Y.P. Wang ◽  
...  
Keyword(s):  
Intermetallic Compounds ◽  
Growth Kinetics ◽  
Evolution Behavior ◽  
Kinetics Of

Growth kinetics of intermetallic compounds in chip scale package solder joint

2001 ◽  
Vol 44 (2) ◽  
pp. 317-323 ◽  
Author(s):  
P.L Tu ◽  
Y.C Chan ◽  
K.C Hung ◽  
J.K.L Lai
Keyword(s):  
Solder Joint ◽  
Intermetallic Compounds ◽  
Growth Kinetics ◽  
Chip Scale Package ◽  
Kinetics Of
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