Twelfth Annual IEEE Semiconductor Thermal Measurement and Management Symposium Proceedings STHERM-96
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Thermal characterization of a 3-dimensional memory module

Twelfth Annual IEEE Semiconductor Thermal Measurement and Management Symposium Proceedings STHERM-96 ◽

10.1109/stherm.1996.545086 ◽

2002 ◽

Author(s):

Tae-Hyun Kim ◽

JoongHyun Baek ◽

S.H. Seol ◽

J.J. Kim ◽

Y.S. Kim ◽

...

Keyword(s):

Thermal Characterization ◽

Memory Module ◽

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Development of JEDEC standard thermal measurement test boards

Twelfth Annual IEEE Semiconductor Thermal Measurement and Management Symposium Proceedings STHERM-96 ◽

10.1109/stherm.1996.545108 ◽

2002 ◽

Author(s):

D. Edwards

Keyword(s):

Thermal Measurement

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Thermal reliability of power insulated gate bipolar transistor (IGBT) modules

Twelfth Annual IEEE Semiconductor Thermal Measurement and Management Symposium Proceedings STHERM-96 ◽

10.1109/stherm.1996.545103 ◽

2002 ◽

Author(s):

Wuchen Wu ◽

Guo Gao ◽

Limin Dong ◽

Zhengyuan Wang ◽

M. Held ◽

...

Keyword(s):

Bipolar Transistor ◽

Thermal Reliability ◽

Insulated Gate Bipolar Transistor ◽

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Thermal analysis of circuit boards and microelectronic components using an analytical solution to the heat conduction equation

Twelfth Annual IEEE Semiconductor Thermal Measurement and Management Symposium Proceedings STHERM-96 ◽

10.1109/stherm.1996.545104 ◽

2002 ◽

Author(s):

G.N. Ellison

Keyword(s):

Thermal Analysis ◽

Heat Conduction ◽

Analytical Solution ◽

Heat Conduction Equation ◽

Conduction Equation ◽

Circuit Boards ◽

Microelectronic Components

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1996 cumulative bibliography of articles on semiconductor thermal measurement, management and modeling

Twelfth Annual IEEE Semiconductor Thermal Measurement and Management Symposium Proceedings STHERM-96 ◽

10.1109/stherm.1996.545111 ◽

2002 ◽

Author(s):

B.S. Siegal

Keyword(s):

Thermal Measurement

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Experimental determination of thermal conductivity of printed wiring boards

Twelfth Annual IEEE Semiconductor Thermal Measurement and Management Symposium Proceedings STHERM-96 ◽

10.1109/stherm.1996.545107 ◽

2002 ◽

Author(s):

K. Azar ◽

J.E. Graebner

Keyword(s):

Thermal Conductivity ◽

Experimental Determination ◽

Printed Wiring Boards

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Design and optimization of pin fin heat sinks for low velocity applications

Twelfth Annual IEEE Semiconductor Thermal Measurement and Management Symposium Proceedings STHERM-96 ◽

10.1109/stherm.1996.545105 ◽

2002 ◽

Author(s):

H. Shaukatullah ◽

W.R. Storr ◽

B.J. Hansen ◽

M.A. Gaynes

Keyword(s):

Low Velocity ◽

Design And Optimization ◽

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Thermal evaluation of a PowerPC 620 multi-processor computer

Twelfth Annual IEEE Semiconductor Thermal Measurement and Management Symposium Proceedings STHERM-96 ◽

10.1109/stherm.1996.545095 ◽

2002 ◽

Author(s):

Henry Wong ◽

Tien-Yu Tom Lee

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Thermal evaluation of simulated finish and flatness conditions typical to MCM and MPU applications

Twelfth Annual IEEE Semiconductor Thermal Measurement and Management Symposium Proceedings STHERM-96 ◽

10.1109/stherm.1996.545091 ◽

2002 ◽

Author(s):

J.R. Mason

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Analysis of thermally-enhanced SOIC packages

Twelfth Annual IEEE Semiconductor Thermal Measurement and Management Symposium Proceedings STHERM-96 ◽

10.1109/stherm.1996.545085 ◽

2002 ◽

Author(s):

B.M. Guenin ◽

A. Chowdhury ◽

R. Groover ◽

E.J. Derian

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