InterSociety Conference on Thermal Phenomena in Electronic Systems, I-THERM V
Latest Publications

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(FIVE YEARS 0)

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Published By IEEE

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Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Thermal investigation of an infrared reflow furnace with a convection fan

InterSociety Conference on Thermal Phenomena in Electronic Systems, I-THERM V ◽

10.1109/itherm.1996.534564 ◽

2002 ◽

Cited By ~ 9

Author(s):

M.R. Kim ◽

Y.K. Choi ◽

G.B. Lee ◽

I.Y. Chung ◽

J.D. Kim

Keyword(s):

Thermal Investigation

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Thermal characterization of stacked aluminum nitride multichip modules

InterSociety Conference on Thermal Phenomena in Electronic Systems, I-THERM V ◽

10.1109/itherm.1996.534581 ◽

2002 ◽

Cited By ~ 1

Author(s):

Y.-X. Tao ◽

R. Manickamdalli ◽

R. Jensen ◽

P. Devgan

Keyword(s):

Aluminum Nitride ◽

Thermal Characterization ◽

Multichip Modules

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Thermal analysis and design of plastic packages for GaAs RF IC power amplifiers

InterSociety Conference on Thermal Phenomena in Electronic Systems, I-THERM V ◽

10.1109/itherm.1996.534567 ◽

2002 ◽

Author(s):

Wen-Tang Chen ◽

An-Yu Kuo ◽

M. Rachlin ◽

A. Peake ◽

C.C. Lee ◽

...

Keyword(s):

Thermal Analysis ◽

Power Amplifiers ◽

Analysis And Design ◽

Plastic Packages ◽

Rf Ic

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Experimental and numerical study on natural convection from upward horizontal rectangular grooved fins

InterSociety Conference on Thermal Phenomena in Electronic Systems, I-THERM V ◽

10.1109/itherm.1996.534543 ◽

2002 ◽

Author(s):

Chang-Eop Kwak ◽

Tae-Ho Song

Keyword(s):

Natural Convection ◽

Numerical Study

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Fusing current of short aluminum bond wire

InterSociety Conference on Thermal Phenomena in Electronic Systems, I-THERM V ◽

10.1109/itherm.1996.534580 ◽

2002 ◽

Cited By ~ 1

Author(s):

S. Knecht ◽

B. Gonzalez ◽

K. Sieber

Keyword(s):

Bond Wire

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Development of prediction technique for cooling performance of finned heat sink in uniform flow

InterSociety Conference on Thermal Phenomena in Electronic Systems, I-THERM V ◽

10.1109/itherm.1996.534551 ◽

2002 ◽

Cited By ~ 6

Author(s):

Y. Sata ◽

H. Iwasaki ◽

M. Ishizuka

Keyword(s):

Heat Sink ◽

Uniform Flow ◽

Cooling Performance ◽

Prediction Technique

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Distribution of heat transfer coefficients from small surfaces cooled with submerged jets of fluorocarbon liquid determined by inverse analysis of heat conduction

InterSociety Conference on Thermal Phenomena in Electronic Systems, I-THERM V ◽

10.1109/itherm.1996.534572 ◽

2002 ◽

Author(s):

A. Nishihara ◽

S. Sasaki ◽

Y. Ohsone ◽

T. Nakajima

Keyword(s):

Heat Transfer ◽

Heat Conduction ◽

Inverse Analysis ◽

Transfer Coefficients ◽

Heat Transfer Coefficients ◽

Submerged Jets

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Thermal performance comparison of high pin count cavity-up enhanced plastic ball grid array (EPBGA) packages

InterSociety Conference on Thermal Phenomena in Electronic Systems, I-THERM V ◽

10.1109/itherm.1996.534555 ◽

2002 ◽

Cited By ~ 3

Author(s):

A. Mertol

Keyword(s):

Thermal Performance ◽

Ball Grid Array ◽

Performance Comparison ◽

Plastic Ball ◽

Plastic Ball Grid Array

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Moisture diffusion and heat transfer in plastic IC packages

InterSociety Conference on Thermal Phenomena in Electronic Systems, I-THERM V ◽

10.1109/itherm.1996.534546 ◽

2002 ◽

Cited By ~ 12

Author(s):

A.A.O. Tay ◽

T.Y. Lin

Keyword(s):

Heat Transfer ◽

Moisture Diffusion

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Effect of solder joint geometry on the predicted fatigue life of BGA solder joints

InterSociety Conference on Thermal Phenomena in Electronic Systems, I-THERM V ◽

10.1109/itherm.1996.534561 ◽

2002 ◽

Cited By ~ 3

Author(s):

I.R. Holub ◽

J.M. Pitarresi ◽

T.J. Singler

Keyword(s):

Fatigue Life ◽

Solder Joint ◽

Solder Joints ◽

Joint Geometry

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InterSociety Conference on Thermal Phenomena in Electronic Systems, I-THERM VLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Thermal investigation of an infrared reflow furnace with a convection fan

Thermal characterization of stacked aluminum nitride multichip modules

Thermal analysis and design of plastic packages for GaAs RF IC power amplifiers

Experimental and numerical study on natural convection from upward horizontal rectangular grooved fins

Fusing current of short aluminum bond wire

Development of prediction technique for cooling performance of finned heat sink in uniform flow

Distribution of heat transfer coefficients from small surfaces cooled with submerged jets of fluorocarbon liquid determined by inverse analysis of heat conduction

Thermal performance comparison of high pin count cavity-up enhanced plastic ball grid array (EPBGA) packages

Moisture diffusion and heat transfer in plastic IC packages

Effect of solder joint geometry on the predicted fatigue life of BGA solder joints

InterSociety Conference on Thermal Phenomena in Electronic Systems, I-THERM V
Latest Publications