2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems
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9781479936410, 9781479936434

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2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems ◽

10.1109/epeps.2014.7103644 ◽

2014 ◽

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High order Envelope Following method for parallel simulation of Power Converter circuits

2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems ◽

10.1109/epeps.2014.7103599 ◽

2014 ◽

Cited By ~ 3

Author(s):

Mina Farhan ◽

Emad Gad ◽

Michel Nakhla ◽

Ram Achar

Keyword(s):

Power Converter ◽

Parallel Simulation ◽

High Order

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Statistical modeling of metastability in ADC-based serial I/O receivers

2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems ◽

10.1109/epeps.2014.7103588 ◽

2014 ◽

Cited By ~ 3

Author(s):

Shengchang Cai ◽

Ayman Shafik ◽

Shiva Kiran ◽

Ehsan Zhian Tabasy ◽

Sebastian Hoyos ◽

...

Keyword(s):

Statistical Modeling

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Modeling and measurement of noise aware clocking in power supply noise analysis

2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems ◽

10.1109/epeps.2014.7103579 ◽

2014 ◽

Cited By ~ 2

Author(s):

Yaping Zhou ◽

Sunil Sudhakaran ◽

Aniket Naik ◽

Xin Chang ◽

Daniel Lin ◽

...

Keyword(s):

Power Supply ◽

Noise Analysis ◽

Power Supply Noise ◽

Supply Noise

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Advances in power integrity techniques

2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems ◽

10.1109/epeps.2014.7103577 ◽

2014 ◽

Author(s):

Tingdong Zhou ◽

Yaping Zhou

Keyword(s):

Power Integrity

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2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems ◽

10.1109/epeps.2014.7103576 ◽

2014 ◽

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Determination of complex permittivity for low- and high-loss materials at microwave frequencies

2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems ◽

10.1109/epeps.2014.7103638 ◽

2014 ◽

Author(s):

Siddharth K. Varadan ◽

Lisha Zhang ◽

George Pan ◽

Terry Alford

Keyword(s):

Complex Permittivity ◽

Microwave Frequencies ◽

High Loss

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Power delivery solutions in 3-D processor-DRAM systems in presence of hot spots

2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems ◽

10.1109/epeps.2014.7103635 ◽

2014 ◽

Author(s):

Masoud Zabihi ◽

Farzad Radfar ◽

Reza Sarvari

Keyword(s):

Hot Spots ◽

Power Delivery

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PCB layer reduction to save system BOM cost in an Intel Haswell-EP server platform

2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems ◽

10.1109/epeps.2014.7103630 ◽

2014 ◽

Cited By ~ 1

Author(s):

Ruonan Wang ◽

Hao Wang ◽

YL Li ◽

Jiangqi He ◽

Wei Xu ◽

...

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Fast convergence of MoM-based package-board extraction via incremental eigen-AGMRES method

2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems ◽

10.1109/epeps.2014.7103620 ◽

2014 ◽

Cited By ~ 1

Author(s):

Gourav Chatterjee ◽

Arkaprovo Das ◽

Dipanjan Gope

Keyword(s):

Fast Convergence

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2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Author index

High order Envelope Following method for parallel simulation of Power Converter circuits

Statistical modeling of metastability in ADC-based serial I/O receivers

Modeling and measurement of noise aware clocking in power supply noise analysis

Advances in power integrity techniques

Table of contents

Determination of complex permittivity for low- and high-loss materials at microwave frequencies

Power delivery solutions in 3-D processor-DRAM systems in presence of hot spots

PCB layer reduction to save system BOM cost in an Intel Haswell-EP server platform

Fast convergence of MoM-based package-board extraction via incremental eigen-AGMRES method

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2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and SystemsLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Author index

High order Envelope Following method for parallel simulation of Power Converter circuits

Statistical modeling of metastability in ADC-based serial I/O receivers

Modeling and measurement of noise aware clocking in power supply noise analysis

Advances in power integrity techniques

Table of contents

Determination of complex permittivity for low- and high-loss materials at microwave frequencies

Power delivery solutions in 3-D processor-DRAM systems in presence of hot spots

PCB layer reduction to save system BOM cost in an Intel Haswell-EP server platform

Fast convergence of MoM-based package-board extraction via incremental eigen-AGMRES method

2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems
Latest Publications