Solder Joint Reliability Prediction for Multiple Environments
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11

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1

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Published By Springer US

9780387793931, 9780387793948

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Development of Fatigue Life Equations Under Low-Cycle Thermal and Power Cycling

Solder Joint Reliability Prediction for Multiple Environments ◽

10.1007/978-0-387-79394-8_6 ◽

2008 ◽

pp. 1-10

Keyword(s):

Fatigue Life ◽

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Unified Finite Element Modeling for Prediction of Solder Joint Fatigue

Solder Joint Reliability Prediction for Multiple Environments ◽

10.1007/978-0-387-79394-8_4 ◽

2008 ◽

pp. 1-17

Keyword(s):

Finite Element ◽

Solder Joint ◽

Finite Element Modeling ◽

Element Modeling ◽

Solder Joint Fatigue

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Solder Joint Reliability Assessment for Desktop and Space Applications

Solder Joint Reliability Prediction for Multiple Environments ◽

10.1007/978-0-387-79394-8_11 ◽

2008 ◽

pp. 1-12

Keyword(s):

Solder Joint ◽

Reliability Assessment ◽

Space Applications ◽

Solder Joint Reliability ◽

Joint Reliability

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Validation of Unified FEM for Thermal Cycling and Power

Solder Joint Reliability Prediction for Multiple Environments ◽

10.1007/978-0-387-79394-8_5 ◽

2008 ◽

pp. 1-19

Keyword(s):

Thermal Cycling

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Literature Review

Solder Joint Reliability Prediction for Multiple Environments ◽

10.1007/978-0-387-79394-8_3 ◽

2008 ◽

pp. 1-25 ◽

Keyword(s):

Literature Review

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Universal Predictive Fatigue Life Equation and the Effect of Design Parameters

Solder Joint Reliability Prediction for Multiple Environments ◽

10.1007/978-0-387-79394-8_8 ◽

2008 ◽

pp. 1-22

Keyword(s):

Fatigue Life ◽

Design Parameters

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Introduction

Solder Joint Reliability Prediction for Multiple Environments ◽

10.1007/978-0-387-79394-8_1 ◽

2008 ◽

pp. 1-6

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Validation of Unified FEM and Development of Fatigue-life Equations for Vibration

Solder Joint Reliability Prediction for Multiple Environments ◽

10.1007/978-0-387-79394-8_7 ◽

2008 ◽

pp. 1-22

Keyword(s):

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Background

Solder Joint Reliability Prediction for Multiple Environments ◽

10.1007/978-0-387-79394-8_2 ◽

2008 ◽

pp. 1-32

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Acceleration Factor to Relate Thermal Cycles to Power Cycles for CBGA Packages

Solder Joint Reliability Prediction for Multiple Environments ◽

10.1007/978-0-387-79394-8_9 ◽

2008 ◽

pp. 1-13 ◽

Keyword(s):

Acceleration Factor ◽

Thermal Cycles ◽

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