2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO)
Latest Publications

TOTAL DOCUMENTS

372

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H-INDEX

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Published By IEEE

9789532330908

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Embedded spectroscopic reflectometry metrology on FEOL silicon dioxide trench polishing equipment

2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO) ◽

10.23919/mipro.2017.7966614 ◽

2017 ◽

Author(s):

S. Bourzgui ◽

A. Roussy ◽

J. Blue ◽

G. Georges ◽

E. Faivre ◽

...

Keyword(s):

Silicon Dioxide ◽

Spectroscopic Reflectometry

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The criticality of sub-components utilized for next-generation high-volume manufacturing

2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO) ◽

10.23919/mipro.2017.7966610 ◽

2017 ◽

Author(s):

Ya-hong Neirynck ◽

Dalia Vernikovsky

Keyword(s):

High Volume ◽

Next Generation

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Amorphous silicon coatings for control of corrosion and metal ion contamination

2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO) ◽

10.23919/mipro.2017.7966606 ◽

2017 ◽

Author(s):

David A. Smith ◽

Min Yuan ◽

Jesse Bischof ◽

Luke Patterson ◽

James B. Mattzela

Keyword(s):

Amorphous Silicon ◽

Metal Ion

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TSV front end design, integration, and process development

2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO) ◽

10.23919/mipro.2017.7966603 ◽

2017 ◽

Author(s):

Mike Thomason ◽

Gordy Girvna

Keyword(s):

Process Development ◽

Front End ◽

Design Integration

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Investigation of defective bonding pad affected by the contamination of front opening unified pod (FOUP)

2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO) ◽

10.23919/mipro.2017.7966563 ◽

2017 ◽

Author(s):

Soon Seok Kwon ◽

Sung Min Hwang ◽

Hyoung Ryeun Kim ◽

Hee Chang Jang ◽

Jeong Hoon Hong ◽

...

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Imaging of NW placement for 10 nm and beyond

2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO) ◽

10.23919/mipro.2017.7966559 ◽

2017 ◽

Author(s):

Gregory Johnson ◽

Jochonia Nxumalo ◽

Chrisophter Mollela ◽

Christopher D'Aleo ◽

Andrew Dalton

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Characterization of thin carbonized photoresist layer and investigation of dry strip process through real-time monitored variable temperature control

2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO) ◽

10.23919/mipro.2017.7966554 ◽

2017 ◽

Author(s):

Je Hyeok Ryu ◽

Byoung Hoon Kim ◽

Sung Jin Yoon

Keyword(s):

Real Time ◽

Temperature Control ◽

Variable Temperature ◽

Photoresist Layer

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Bessel decomposition of temperature profiles in film deposition reactors

2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO) ◽

10.23919/mipro.2017.7966551 ◽

2017 ◽

Author(s):

Keung Hui ◽

Jason Mou

Keyword(s):

Film Deposition ◽

Temperature Profiles

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Al-Cu interconnect corrosion prevention in post metal etch and wet polymer clean wafers

2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO) ◽

10.23919/mipro.2017.7966547 ◽

2017 ◽

Author(s):

Wan Tatt Wai ◽

Ng Cheah Ling

Keyword(s):

Corrosion Prevention ◽

Cu Interconnect

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Strategies for reducing particle defects in ALD TiN and RFPVD Ti processes

2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO) ◽

10.23919/mipro.2017.7966544 ◽

2017 ◽

Author(s):

Aditya Kumar ◽

Bhavyen Patel ◽

Jean-Baptiste Laloe

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2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Embedded spectroscopic reflectometry metrology on FEOL silicon dioxide trench polishing equipment

The criticality of sub-components utilized for next-generation high-volume manufacturing

Amorphous silicon coatings for control of corrosion and metal ion contamination

TSV front end design, integration, and process development

Investigation of defective bonding pad affected by the contamination of front opening unified pod (FOUP)

Imaging of NW placement for 10 nm and beyond

Characterization of thin carbonized photoresist layer and investigation of dry strip process through real-time monitored variable temperature control

Bessel decomposition of temperature profiles in film deposition reactors

Al-Cu interconnect corrosion prevention in post metal etch and wet polymer clean wafers

Strategies for reducing particle defects in ALD TiN and RFPVD Ti processes

2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO)
Latest Publications