Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Latest Publications

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45

(FIVE YEARS 0)

H-INDEX

5

(FIVE YEARS 0)

Published By Springer US

9780387279749, 9780387329895

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

The Wirebonded Interconnect: A Mainstay for Electronics

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging ◽

10.1007/0-387-32989-7_23 ◽

2007 ◽

pp. B71-B120 ◽

Author(s):

Harry K. Charles

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How to Make a Device into a Product: Accelerated Life Testing (ALT), Its Role, Attributes, Challenges, Pitfalls, and Interaction with Qualification Tests

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging ◽

10.1007/0-387-32989-7_28 ◽

2007 ◽

pp. B203-B231 ◽

Author(s):

E. Suhir

Keyword(s):

Accelerated Life Testing ◽

Life Testing ◽

Accelerated Life

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Highly Compliant Bonding Material for Micro- and Opto-Electronic Applications

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging ◽

10.1007/0-387-32989-7_38 ◽

2007 ◽

pp. B473-B486 ◽

Author(s):

E. Suhir ◽

D. Ingman

Keyword(s):

Bonding Material

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Dynamic Physical Reliability in Application to Photonic Materials

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging ◽

10.1007/0-387-32989-7_17 ◽

2007 ◽

pp. A571-A594 ◽

Author(s):

Dov Ingman ◽

Tatiana Mirer ◽

Ephraim Suhir

Keyword(s):

Photonic Materials

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Lead-Free Solder Materials: Design For Reliability

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging ◽

10.1007/0-387-32989-7_12 ◽

2007 ◽

pp. A429-A458 ◽

Author(s):

John H. L. Pang

Keyword(s):

Materials Design ◽

Lead Free ◽

Lead Free Solder ◽

Design For Reliability ◽

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Electrically Conductive Adhesives

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging ◽

10.1007/0-387-32989-7_41 ◽

2007 ◽

pp. B571-B610 ◽

Author(s):

Johann Nicolics ◽

Martin Mündlein

Keyword(s):

Conductive Adhesives ◽

Electrically Conductive ◽

Electrically Conductive Adhesives

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Fundamentals of Reliability and Stress Testing

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging ◽

10.1007/0-387-32989-7_27 ◽

2007 ◽

pp. B177-B201

Author(s):

H. Anthony Chan

Keyword(s):

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Application of Moire Interferometry to Strain Analysis of PCB Deformations at Low Temperatures

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging ◽

10.1007/0-387-32989-7_13 ◽

2007 ◽

pp. A459-A473

Author(s):

Arkady Voloshin

Keyword(s):

Low Temperatures ◽

Strain Analysis ◽

Moiré Interferometry ◽

Moire Interferometry

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Thermo-Optic Effects in Polymer Bragg Gratings

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging ◽

10.1007/0-387-32989-7_2 ◽

2007 ◽

pp. A65-A110 ◽

Author(s):

Avram Bar-Cohen ◽

Bongtae Han ◽

Kyoung Joon Kim

Keyword(s):

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Mechanical Behavior of Flip Chip Packages under Thermal Loading

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging ◽

10.1007/0-387-32989-7_44 ◽

2007 ◽

pp. B651-B676

Author(s):

Enboa Wu ◽

Shoulung Chen ◽

C. Z. Tsai ◽

Nicholas Kao

Keyword(s):

Mechanical Behavior ◽

Flip Chip ◽

Thermal Loading

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