2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS)
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9781509000388, 9781509000401

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2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS) ◽

10.1109/epeps.2015.7347116 ◽

2015 ◽

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New broadband equalizer optimization technique for digital system designs

2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS) ◽

10.1109/epeps.2015.7347134 ◽

2015 ◽

Author(s):

Shaowu Huang ◽

Beomtaek Lee

Keyword(s):

Optimization Technique ◽

Digital System ◽

System Designs

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Evaluation of near-singular integrals for quadrilateral basis in integral equation solver

2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS) ◽

10.1109/epeps.2015.7347126 ◽

2015 ◽

Author(s):

Chong Luo ◽

Giacomo Bianconi ◽

Swagato Chakraborty

Keyword(s):

Integral Equation ◽

Singular Integrals

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IBIS-AMI modelling of high-speed memory interfaces

2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS) ◽

10.1109/epeps.2015.7347132 ◽

2015 ◽

Cited By ~ 2

Author(s):

John Yan ◽

Arash Zargaran-Yazd

Keyword(s):

High Speed

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Signal integrity for USB 3.1 Gen 2 front end challenging loss budget

2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS) ◽

10.1109/epeps.2015.7347140 ◽

2015 ◽

Cited By ~ 1

Author(s):

Mahmoud A. El Sabbagh

Keyword(s):

Signal Integrity ◽

Front End

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Novel de-embedding method with Look-Up Table for characterization of interconnects

2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS) ◽

10.1109/epeps.2015.7347135 ◽

2015 ◽

Author(s):

Shaowu Huang ◽

Beomtaek Lee

Keyword(s):

Embedding Method ◽

Look Up Table

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Challenges of high-speed channel design on GPU accelerated system

2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS) ◽

10.1109/epeps.2015.7347166 ◽

2015 ◽

Cited By ~ 1

Author(s):

Chun-Lin Liao ◽

Terence Rodrigues ◽

Bhyrav Mutnury

Keyword(s):

High Speed ◽

Channel Design

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An electromagnetic model for back-drilled vias

2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS) ◽

10.1109/epeps.2015.7347127 ◽

2015 ◽

Author(s):

Aosheng Rong ◽

Andreas C. Cangellaris ◽

Feng Ling

Keyword(s):

Electromagnetic Model

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Intelligent rapid investigation of S-parameters (IRIS)

2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS) ◽

10.1109/epeps.2015.7347130 ◽

2015 ◽

Author(s):

Nikita Ambasana ◽

Bhyrav Mutnury ◽

Dipanjan Gope

Keyword(s):

S Parameters

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Analysis and system optimization of high performance clocking for modern mobile platforms

2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS) ◽

10.1109/epeps.2015.7347165 ◽

2015 ◽

Cited By ~ 1

Author(s):

Xiaoning Qi ◽

Rohit Mittal ◽

Steven Ji ◽

Sudeep Puligundla

Keyword(s):

High Performance ◽

System Optimization ◽

Mobile Platforms

Download Full-text

2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS)
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Table of contents

New broadband equalizer optimization technique for digital system designs

Evaluation of near-singular integrals for quadrilateral basis in integral equation solver

IBIS-AMI modelling of high-speed memory interfaces

Signal integrity for USB 3.1 Gen 2 front end challenging loss budget

Novel de-embedding method with Look-Up Table for characterization of interconnects

Challenges of high-speed channel design on GPU accelerated system

An electromagnetic model for back-drilled vias

Intelligent rapid investigation of S-parameters (IRIS)

Analysis and system optimization of high performance clocking for modern mobile platforms

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2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Table of contents

New broadband equalizer optimization technique for digital system designs

Evaluation of near-singular integrals for quadrilateral basis in integral equation solver

IBIS-AMI modelling of high-speed memory interfaces

Signal integrity for USB 3.1 Gen 2 front end challenging loss budget

Novel de-embedding method with Look-Up Table for characterization of interconnects

Challenges of high-speed channel design on GPU accelerated system

An electromagnetic model for back-drilled vias

Intelligent rapid investigation of S-parameters (IRIS)

Analysis and system optimization of high performance clocking for modern mobile platforms

2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS)
Latest Publications