2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)
Latest Publications

TOTAL DOCUMENTS

106

(FIVE YEARS 106)

H-INDEX

1

(FIVE YEARS 1)

Published By IEEE

9781728142623

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Research on NFS Test Method of An Embedded CPU

2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) ◽

10.1109/emccompo.2019.8919811 ◽

2019 ◽

Author(s):

Hongli Zhang ◽

Jianfei Wu ◽

Puhan Wu ◽

Yafei Lia ◽

Hong Li ◽

...

Keyword(s):

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The SI and EMI Analysis of Sub-Femto-Farad readout circuit for capacitive sensor

2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) ◽

10.1109/emccompo.2019.8919907 ◽

2019 ◽

Author(s):

Xinquan Lai ◽

Yuheng Wang ◽

Mingming Liu ◽

Lingfei Zhang

Keyword(s):

Capacitive Sensor ◽

Readout Circuit

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An Online Method for Load Impedance Extraction for Printed Lines based on Near Field Measurements

2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) ◽

10.1109/emccompo.2019.8919945 ◽

2019 ◽

Author(s):

Hui Xu ◽

Donglin Su

Keyword(s):

Field Measurements ◽

Load Impedance ◽

Impedance Extraction

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[Copyright notice]

2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) ◽

10.1109/emccompo.2019.8919821 ◽

2019 ◽

Keyword(s):

Copyright Notice

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NGD Circuit Design with Coupled Line EMI

2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) ◽

10.1109/emccompo.2019.8919812 ◽

2019 ◽

Author(s):

N. Li ◽

F. Wan ◽

B. Ravelo

Keyword(s):

Circuit Design ◽

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Immunity Evaluation of SRAM Chips for SOI and SI Technology

2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) ◽

10.1109/emccompo.2019.8919851 ◽

2019 ◽

Author(s):

Xujing Wu ◽

Mengjun Wang ◽

Jianfei Wu ◽

Hong Li ◽

Binhong Li ◽

...

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EMC COMPO 2019 Final Program

2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) ◽

10.1109/emccompo.2019.8919894 ◽

2019 ◽

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Potential Applicability of Single-Walled Carbon Nanotube Through-Silicon Vias for Differential Signal Transmission

2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) ◽

10.1109/emccompo.2019.8919672 ◽

2019 ◽

Author(s):

Qing-Hao Hu ◽

Wen-Sheng Zhao ◽

Gaofeng Wang ◽

Da-Wei Wang

Keyword(s):

Carbon Nanotube ◽

Signal Transmission ◽

Through Silicon Vias ◽

Single Walled Carbon Nanotube ◽

Differential Signal ◽

Single Walled Carbon ◽

Potential Applicability ◽

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Calculation of Number of Equivalent Magnetic Dipoles for the Source Reconstruction by using Artificial Neural Network

2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) ◽

10.1109/emccompo.2019.8919662 ◽

2019 ◽

Author(s):

Yu-Han Zhong ◽

Ze-Kai Hu ◽

Li Ding ◽

Xing-Chang Wei

Keyword(s):

Neural Network ◽

Artificial Neural Network ◽

Source Reconstruction ◽

Magnetic Dipoles ◽

Artificial Neural

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A high-precision thermal imaging approach based on Bayesian inference for EMC diagnosis

2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) ◽

10.1109/emccompo.2019.8919852 ◽

2019 ◽

Author(s):

Chu Ning ◽

Hou Yaochun ◽

Wu Dazhuan ◽

Zhu Sha ◽

Luo Dingxin

Keyword(s):

Bayesian Inference ◽

High Precision ◽

Thermal Imaging ◽

Imaging Approach

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