2021 14th International Congress Molded Interconnect Devices (MID)
Latest Publications

TOTAL DOCUMENTS

20

(FIVE YEARS 20)

H-INDEX

1

(FIVE YEARS 1)

Published By IEEE

9781728175096

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Sintering of conductive inks on plastic substrates by use of microwave furnaces being suitable for largescale production processes

2021 14th International Congress Molded Interconnect Devices (MID) ◽

10.1109/mid50463.2021.9361626 ◽

2021 ◽

Author(s):

Lutz Hartmann ◽

Jakob Sabban ◽

Felix Behrendt ◽

Tiberiu-Mihai Tatai ◽

Simone Neermann ◽

...

Keyword(s):

Conductive Inks ◽

Plastic Substrates ◽

Production Processes

Download Full-text

Evaluation of Mechanical Stress on Electronic Assemblies During Thermoforming and Injection Molding for Conformable Electronics

2021 14th International Congress Molded Interconnect Devices (MID) ◽

10.1109/mid50463.2021.9361624 ◽

2021 ◽

Author(s):

Julian Schirmer ◽

Marcus Reichenberger ◽

Annette Wimmer ◽

Herbert Reichel ◽

Simone Neermann ◽

...

Keyword(s):

Injection Molding ◽

Mechanical Stress ◽

Electronic Assemblies

Download Full-text

MID 2021 Cover Page

2021 14th International Congress Molded Interconnect Devices (MID) ◽

10.1109/mid50463.2021.9361611 ◽

2021 ◽

Download Full-text

MID 2021 Title Page

2021 14th International Congress Molded Interconnect Devices (MID) ◽

10.1109/mid50463.2021.9361619 ◽

2021 ◽

Keyword(s):

Download Full-text

Aerosol jet printed AgNW electrode and PEDOT:PSS layers for organic light-emitting diode devices fabrication

2021 14th International Congress Molded Interconnect Devices (MID) ◽

10.1109/mid50463.2021.9361616 ◽

2021 ◽

Author(s):

Mohd-Khairulamzari Hamjah ◽

Marc Steinberger ◽

Kai Cheong Tam ◽

Hans-Joachim Egelhaaf ◽

Christoph J. Brabec ◽

...

Keyword(s):

Light Emitting Diode ◽

Light Emitting ◽

Organic Light Emitting Diode ◽

Download Full-text

MID 2021 Congress Committee

2021 14th International Congress Molded Interconnect Devices (MID) ◽

10.1109/mid50463.2021.9361612 ◽

2021 ◽

Download Full-text

MID 2021 Preface

2021 14th International Congress Molded Interconnect Devices (MID) ◽

10.1109/mid50463.2021.9361615 ◽

2021 ◽

Download Full-text

Approach for a modular design methodology for an efficient development of 3D MID components

2021 14th International Congress Molded Interconnect Devices (MID) ◽

10.1109/mid50463.2021.9361622 ◽

2021 ◽

Author(s):

Thomas Mager ◽

Christoph Jurgenhake ◽

Roman Dumitrescu

Keyword(s):

Design Methodology ◽

Download Full-text

Printing of laser-generated conductive copper tracks on 3D components

2021 14th International Congress Molded Interconnect Devices (MID) ◽

10.1109/mid50463.2021.9361618 ◽

2021 ◽

Author(s):

Ejvind Olsen ◽

Ludger Overmeyer

Download Full-text

Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications

2021 14th International Congress Molded Interconnect Devices (MID) ◽

10.1109/mid50463.2021.9361628 ◽

2021 ◽

Author(s):

Florian Hemmelgarn ◽

Patrick Ehlert ◽

Thomas Mager ◽

Christoph Jurgenhake ◽

Roman Dumitrescu ◽

...

Keyword(s):

Additive Manufacturing ◽

Smart Sensor ◽

Sensor Systems ◽

Manufacturing Technologies

Download Full-text