2021 14th International Congress Molded Interconnect Devices (MID)
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20
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9781728175096
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Sintering of conductive inks on plastic substrates by use of microwave furnaces being suitable for largescale production processes

2021 ◽  
Author(s):  
Lutz Hartmann ◽  
Jakob Sabban ◽  
Felix Behrendt ◽  
Tiberiu-Mihai Tatai ◽  
Simone Neermann ◽  
...  
Keyword(s):  
Conductive Inks ◽  
Plastic Substrates ◽  
Production Processes

Evaluation of Mechanical Stress on Electronic Assemblies During Thermoforming and Injection Molding for Conformable Electronics

2021 ◽  
Author(s):  
Julian Schirmer ◽  
Marcus Reichenberger ◽  
Annette Wimmer ◽  
Herbert Reichel ◽  
Simone Neermann ◽  
...  
Keyword(s):  
Injection Molding ◽  
Mechanical Stress ◽  
Electronic Assemblies

Aerosol jet printed AgNW electrode and PEDOT:PSS layers for organic light-emitting diode devices fabrication

2021 ◽  
Author(s):  
Mohd-Khairulamzari Hamjah ◽  
Marc Steinberger ◽  
Kai Cheong Tam ◽  
Hans-Joachim Egelhaaf ◽  
Christoph J. Brabec ◽  
...  
Keyword(s):  
Light Emitting Diode ◽  
Light Emitting ◽  
Organic Light Emitting Diode ◽  
Organic Light

Approach for a modular design methodology for an efficient development of 3D MID components

2021 ◽  
Author(s):  
Thomas Mager ◽  
Christoph Jurgenhake ◽  
Roman Dumitrescu
Keyword(s):  
Design Methodology ◽  
Modular Design

Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications

2021 ◽  
Author(s):  
Florian Hemmelgarn ◽  
Patrick Ehlert ◽  
Thomas Mager ◽  
Christoph Jurgenhake ◽  
Roman Dumitrescu ◽  
...  
Keyword(s):  
Additive Manufacturing ◽  
Smart Sensor ◽  
Sensor Systems ◽  
Manufacturing Technologies
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