Lead-Free Electronic Solders
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Published By Springer US

9780387484310
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Sn-whiskers: truths and myths

2007 ◽  
pp. 283-305 ◽  
Author(s):  
J. W. Osenbach ◽  
J. M. DeLucca ◽  
B. D. Potteiger ◽  
A. Amin ◽  
F. A. Baiocchi
Keyword(s):  
Sn Whiskers

scholarly journals Interfacial reaction issues for lead-free electronic solders

2007 ◽  
pp. 155-174 ◽  
Author(s):  
C. E. Ho ◽  
S. C. Yang ◽  
C. R. Kao
Keyword(s):  
Interfacial Reaction ◽  
Lead Free

Thermodynamics and phase diagrams of lead-free solder materials

2007 ◽  
pp. 3-17
Author(s):  
H. Ipser ◽  
H. Flandorfer ◽  
Ch. Luef ◽  
C. Schmetterer ◽  
U. Saeed
Keyword(s):  
Phase Diagrams ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

Stress analysis of spontaneous Sn whisker growth

2007 ◽  
pp. 269-281 ◽  
Author(s):  
K. N. Tu ◽  
Chih Chen ◽  
Albert T. Wu
Keyword(s):  
Stress Analysis ◽  
Whisker Growth ◽  
Sn Whisker

Life expectancies of Pb-free SAC solder interconnects in electronic hardware

2007 ◽  
pp. 229-236 ◽  
Author(s):  
Michael Osterman ◽  
Abhijit Dasgupta
Keyword(s):  
Solder Interconnects ◽  
Electronic Hardware ◽  
Sac Solder

Processing and material issues related to lead-free soldering

2007 ◽  
pp. 147-154 ◽  
Author(s):  
Laura J. Turbini
Keyword(s):  
Lead Free

Compression stress-strain and creep properties of the 52In-48Sn and 97In-3Ag low-temperature Pb-free solders

2007 ◽  
pp. 93-119 ◽  
Author(s):  
Paul T. Vianco ◽  
Jerome A. Rejent ◽  
Arlo F. Fossum ◽  
Michael K. Neilsen
Keyword(s):  
Low Temperature ◽  
Compression Stress ◽  
Stress Strain ◽  
Creep Properties

Electromigration issues in lead-free solder joints

2007 ◽  
pp. 259-268 ◽  
Author(s):  
Chih Chen ◽  
S. W. Liang
Keyword(s):  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder
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