Lead-Free Electronic Solders
Latest Publications

TOTAL DOCUMENTS

23

(FIVE YEARS 0)

H-INDEX

7

(FIVE YEARS 0)

Published By Springer US

9780387484310

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Thermodynamics and phase diagrams of lead-free solder materials

Lead-Free Electronic Solders ◽

10.1007/978-0-387-48433-4_1 ◽

2007 ◽

pp. 3-17

Author(s):

H. Ipser ◽

H. Flandorfer ◽

Ch. Luef ◽

C. Schmetterer ◽

U. Saeed

Keyword(s):

Phase Diagrams ◽

Lead Free ◽

Lead Free Solder ◽

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Sn-whiskers: truths and myths

Lead-Free Electronic Solders ◽

10.1007/978-0-387-48433-4_19 ◽

2007 ◽

pp. 283-305 ◽

Author(s):

J. W. Osenbach ◽

J. M. DeLucca ◽

B. D. Potteiger ◽

A. Amin ◽

F. A. Baiocchi

Keyword(s):

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Assessment of factors influencing thermomechanical fatigue behavior of Sn-based solder joints under severe service environments

Lead-Free Electronic Solders ◽

10.1007/978-0-387-48433-4_15 ◽

2007 ◽

pp. 237-246 ◽

Author(s):

K. N. Subramanian

Keyword(s):

Solder Joints ◽

Fatigue Behavior ◽

Thermomechanical Fatigue ◽

Factors Influencing ◽

Service Environments

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Interfacial reaction issues for lead-free electronic solders

Lead-Free Electronic Solders ◽

10.1007/978-0-387-48433-4_10 ◽

2007 ◽

pp. 155-174 ◽

Author(s):

C. E. Ho ◽

S. C. Yang ◽

C. R. Kao

Keyword(s):

Interfacial Reaction ◽

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Processing and material issues related to lead-free soldering

Lead-Free Electronic Solders ◽

10.1007/978-0-387-48433-4_9 ◽

2007 ◽

pp. 147-154 ◽

Author(s):

Laura J. Turbini

Keyword(s):

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The effects of suppressed beta tin nucleation on the microstructural evolution of lead-free solder joints

Lead-Free Electronic Solders ◽

10.1007/978-0-387-48433-4_3 ◽

2007 ◽

pp. 39-54 ◽

Author(s):

D. Swenson

Keyword(s):

Microstructural Evolution ◽

Solder Joints ◽

Lead Free ◽

Lead Free Solder ◽

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Stress analysis of spontaneous Sn whisker growth

Lead-Free Electronic Solders ◽

10.1007/978-0-387-48433-4_18 ◽

2007 ◽

pp. 269-281 ◽

Author(s):

K. N. Tu ◽

Chih Chen ◽

Albert T. Wu

Keyword(s):

Stress Analysis ◽

Whisker Growth ◽

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Life expectancies of Pb-free SAC solder interconnects in electronic hardware

Lead-Free Electronic Solders ◽

10.1007/978-0-387-48433-4_14 ◽

2007 ◽

pp. 229-236 ◽

Author(s):

Michael Osterman ◽

Abhijit Dasgupta

Keyword(s):

Solder Interconnects ◽

Electronic Hardware ◽

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Compression stress-strain and creep properties of the 52In-48Sn and 97In-3Ag low-temperature Pb-free solders

Lead-Free Electronic Solders ◽

10.1007/978-0-387-48433-4_6 ◽

2007 ◽

pp. 93-119 ◽

Author(s):

Paul T. Vianco ◽

Jerome A. Rejent ◽

Arlo F. Fossum ◽

Michael K. Neilsen

Keyword(s):

Low Temperature ◽

Compression Stress ◽

Stress Strain ◽

Creep Properties

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Electromigration issues in lead-free solder joints

Lead-Free Electronic Solders ◽

10.1007/978-0-387-48433-4_17 ◽

2007 ◽

pp. 259-268 ◽

Author(s):

Chih Chen ◽

S. W. Liang

Keyword(s):

Solder Joints ◽

Lead Free ◽

Lead Free Solder ◽

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