Abstract
In many industries, such as automotive, oil and gas, aerospace, medical technologies, electronic parts can often be exposed to high strain loads during shocks, vibrations and drop-impact conditions. Such electronic parts can often be subjected to extreme low and high temperatures ranging from -65oC to 200oC. Also, these electronic devices can be subjected to strain rates of 1 to 100 per second in the critical environment. Recently, many doped SAC solder alloys are being introduced in the electronic component e.g. SAC-Q, SAC-R, Innolot, etc. SAC-Q is made with addition of Bi in Sn-Ag-Cu are composition. Mechanical characteristic results and data for lead-free solder alloys are extremely important for optimizing electronic package reliability, at high temperature storage and elevated strain rates. Furthermore, the mechanical properties of solder alloys can be changed significantly due to a thermal aging, which is causing modification of microstructure. Data for the SAC-Q solder alloy with a high temp aging and testing at extreme low to high operating temperatures are not available.