Correlation of non-visual defects at post copper CMP to yield critical physical defects at next metallization layer

2015 ◽  
Author(s):  
M. Specht ◽  
H. Franke ◽  
O. Luxenhofer ◽  
K. Mai ◽  
W. Usry ◽  
...  
Keyword(s):  
Metallization Layer ◽  
Visual Defects ◽  
Physical Defects ◽  
Copper Cmp

Root Cause Analyses of Metal Bridging for Copper Damascene Process

2005 ◽  
Author(s):  
Z. G. Song ◽  
S. P. Neo ◽  
S. K. Loh ◽  
C. K. Oh
Keyword(s):  
Failure Mechanisms ◽  
Copper Corrosion ◽  
Microelectronic Device ◽  
Root Cause ◽  
Damascene Process ◽  
New Process ◽  
Copper Cmp

Abstract New process will introduce new failure mechanisms during microelectronic device manufacturing. Even if the same defect, its root causes can be different for different processes. For aluminum(Al)-tungsten(W) metallization, the root cause of metal bridging is quite simple and mostly it is blocked etch or under-etch. But, for copper damascene process, the root causes of metal bridging are complicated. This paper has discussed the various root causes of metal bridging for copper damascene process, such as those related to litho-etch issue, copper CMP issue, copper corrosion issue and so on.

A Database for Counterfeit Electronics and Automatic Defect Detection Based on Image Processing and Machine Learning

2016 ◽  
Author(s):  
Navid Asadizanjani ◽  
Sachin Gattigowda ◽  
Mark Tehranipoor ◽  
Domenic Forte ◽  
Nathan Dunn
Keyword(s):  
Machine Learning ◽  
Image Processing ◽  
Integrated Circuits ◽  
Web Application ◽  
The United States ◽  
Global Market ◽  
Online Database ◽  
Ongoing Effort ◽  
Time Period ◽  
Physical Defects

Abstract Counterfeiting is an increasing concern for businesses and governments as greater numbers of counterfeit integrated circuits (IC) infiltrate the global market. There is an ongoing effort in experimental and national labs inside the United States to detect and prevent such counterfeits in the most efficient time period. However, there is still a missing piece to automatically detect and properly keep record of detected counterfeit ICs. Here, we introduce a web application database that allows users to share previous examples of counterfeits through an online database and to obtain statistics regarding the prevalence of known defects. We also investigate automated techniques based on image processing and machine learning to detect different physical defects and to determine whether or not an IC is counterfeit.

Social Failure Modes in Technology and the Ethics of AI

2020 ◽  
pp. 441-461
Author(s):  
Jason Millar
Keyword(s):  
Engineering Design ◽  
Failure Modes ◽  
Design Practice ◽  
Detailed Understanding ◽  
Ethical Implications ◽  
The Social ◽  
Underlying Causes ◽  
Physical Defects ◽  
Definition Of

This chapter argues that, just as technological artefacts can break as a result of mechanical, electrical, or other physical defects not fully accounted for in their design, they can also break as a result of social defects not fully accounted for in their design. These failures resulting from social defects can be called social failures. The chapter then proposes a definition of social failure as well as a taxonomy of social failure modes—the underlying causes that lead to social failures. An explicit and detailed understanding of social failure modes, if properly applied in engineering design practice, could result in a fuller evaluation of the social and ethical implications of technology, either during the upstream design and engineering phases of a product, or after its release. Ideally, studying social failure modes will improve people’s ability to anticipate and reduce the rate or severity of undesirable social failures prior to releasing technology into the wild.

The Use of Metallography for Examination of Causes of Surface Defects on Visual Parts

2017 ◽  
Vol 270 ◽  
pp. 107-111
Author(s):  
Zuzana Andršová ◽  
Pavel Kejzlar
Keyword(s):  
Sample Preparation ◽  
Cross Section ◽  
Surface Defects ◽  
Chemical Properties ◽  
Physical And Chemical Properties ◽  
Visual Appearance ◽  
Visual Defects ◽  
Physical And Chemical ◽  
Microscopic Techniques ◽  
And Chemical Properties

Many of currently manufactured components intended for automotive, must not only meet the requirements on functionality, but also considerable demands on the visual appearance. Parts are subjected to thorough inspection and suppliers are forced to deal with causes of a very slight visual defects. When examining the defects, it is necessary to use a whole range of advanced analytical methods and procedures previously used only for identification of the physical and chemical properties and structure of the material. This paper deals with several examples which have been solved. It focuses especially on the use of demanding metallographic sample preparation from components with surface defects, examining the defects on the cross-section using mainly microscopic techniques and determining the causes of their generation. These results then serve as a basis for modification of the technology and thus they are the tool for significant reduction of amount of NOK parts.

The Psychologist-Educator Views the Relationship of Vision to Reading and Related Learning Disabilities

1981 ◽  
Vol 14 (10) ◽  
pp. 565-567 ◽  
Author(s):  
Jules C. Abrams
Keyword(s):  
Learning Disabilities ◽  
Visual Field ◽  
Visual Perception ◽  
Learning Disability ◽  
Visual Defects ◽  
Considerable Controversy ◽  
Visual Problems ◽  
Relationship Of ◽  
The Relationship

The role of visual problems in learning disability has been a source of considerable controversy for many years. One major issue in the continuing argument is the frequent confusion of labels and concepts in the visual field. It is important to view vision as a psychophysiologic mechanism and to differentiate it from a mechanistic orientation emphasizing the eyes. Most visual problems related to learning disability represent a breakdown in the ability of the eyes to function in an harmonious fashion, that is, some interference in binocular function. While visual defects should not be confused with defects in visual perception, the identification and treatment of visual problems is an important element in the diagnosis and remediation of learning disabilities.

VISUAL DEFECTS IN PRISONERS-OF-WAR FROM THE FAR EAST

The Lancet ◽  
1946 ◽  
Vol 248 (6414) ◽  
pp. 149-153 ◽  
Author(s):  
H.E. Hobbs ◽  
F.A. Forbes
Keyword(s):  
Far East ◽  
Prisoners Of War ◽  
The Far East ◽  
Visual Defects

scholarly journals Fundamental Mechanisms of Copper CMP – Passivation Kinetics of Copper in CMP Slurry Constituents

2009 ◽  
Vol 1157 ◽  
Author(s):  
Shantanu Tripathi ◽  
Fiona M. Doyle ◽  
David A. Dornfeld
Keyword(s):  
Electrochemical Impedance ◽  
Protective Film ◽  
Current Decay ◽  
Glycine Solution ◽  
Current Densities ◽  
Circuit Elements ◽  
Copper Cmp ◽  
Cu Cmp ◽  
Kinetics Of ◽  
Capacitive Charging

AbstractDuring copper CMP, abrasives and asperities interact with the copper at the nano-scale, partially removing protective films. The local Cu oxidation rate increases, then decays with time as the protective film reforms. In order to estimate the copper removal rate and other Cu-CMP output parameters with a mechanistic model, the passivation kinetics of Cu, i.e. the decay of the oxidation current with time after an abrasive/copper interaction, are needed. For the first time in studying Cu-CMP, microelectrodes were used to reduce interference from capacitive charging, IR drops and low diffusion limited currents, problems typical with traditional macroelectrodes. Electrochemical impedance spectroscopy (EIS) was used to obtain the equivalent circuit elements associated with different electrochemical phenomena (capacitive, kinetics, diffusion etc.) at different polarization potentials. These circuit elements were used to interpret potential-step chronoamperometry results in inhibiting and passivating solutions, notably to distinguish between capacitive charging and Faradaic currents.Chronoamperometry of Cu in acidic aqueous glycine solution containing the corrosion inhibitor benzotriazole (BTA) displayed a very consistent current decay behavior at all potentials, indicating that the rate of current decay was controlled by diffusion of BTA to the surface. In basic aqueous glycine solution, Cu (which undergoes passivation by a mechanism similar to that operating in weakly acidic hydrogen peroxide slurries) displayed similar chronoamperometric behavior for the first second or so at all anodic potentials. Thereafter, the current densities at active potentials settled to values around those expected from polarization curves, whereas the current densities at passive potentials continued to decline. Oxidized Cu species typically formed at ‘active’ potentials were found to cause significant current decay at active potentials and at passive potentials before more protective passive films form. This was established from galvanostatic experiments.

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