2012 International Conference on Emerging Electronics
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Published By IEEE

9781467331364, 9781467331357

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Room temperature desorption of Self Assembly Monolayer (SAM) passivated Cu for lowering the process temperature Cu-Cu bonding of 3-D ICs

2012 International Conference on Emerging Electronics ◽

10.1109/icemelec.2012.6636262 ◽

2012 ◽

Author(s):

Tamal Ghosh ◽

Ashudeb Dutta ◽

E. Lingareddy ◽

Ch. Subrahmanyam ◽

Shiv Govind Singh

Keyword(s):

Self Assembly ◽

Room Temperature ◽

Process Temperature ◽

Cu Bonding

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Power-efficiency trade-off in nanoscale thermoelectric energy conversion

2012 International Conference on Emerging Electronics ◽

10.1109/icemelec.2012.6636223 ◽

2012 ◽

Cited By ~ 1

Author(s):

Bhaskaran Muralidharan

Keyword(s):

Energy Conversion ◽

Power Efficiency ◽

Trade Off ◽

Thermoelectric Energy Conversion ◽

Thermoelectric Energy

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High-temperature effects on device performance of a junctionless transistor

2012 International Conference on Emerging Electronics ◽

10.1109/icemelec.2012.6636273 ◽

2012 ◽

Cited By ~ 4

Author(s):

Ratul Kumar Baruah ◽

Roy P. Paily

Keyword(s):

High Temperature ◽

Temperature Effects ◽

Device Performance ◽

Junctionless Transistor

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Assessing reliability of nano-scaled CMOS technologies one defect at a time

2012 International Conference on Emerging Electronics ◽

10.1109/icemelec.2012.6636222 ◽

2012 ◽

Cited By ~ 2

Author(s):

B. Kaczer ◽

T. Grasser ◽

J. Franco ◽

M. Toledano Luque ◽

P. Weckx ◽

...

Keyword(s):

Scaled Cmos

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Fabrication and characterization of the ZnO-based Memristor

2012 International Conference on Emerging Electronics ◽

10.1109/icemelec.2012.6636244 ◽

2012 ◽

Cited By ~ 10

Author(s):

Ashish Kumar ◽

Yaksh Rawal ◽

Maryam Shojaei Baghini

Keyword(s):

Fabrication And Characterization

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Electronic packaging challenges for emerging devices

2012 International Conference on Emerging Electronics ◽

10.1109/icemelec.2012.6636221 ◽

2012 ◽

Author(s):

Sandeep Sangameswaran ◽

Marc De Samber

Keyword(s):

Electronic Packaging

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[Front cover]

2012 International Conference on Emerging Electronics ◽

10.1109/icemelec.2012.6636279 ◽

2012 ◽

Keyword(s):

Front Cover

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Bifacial photodetector using CZTS absorber material

2012 International Conference on Emerging Electronics ◽

10.1109/icemelec.2012.6636255 ◽

2012 ◽

Cited By ~ 2

Author(s):

Prashant K. Sarswat ◽

Soumya Kar ◽

Michael L. Free

Keyword(s):

Absorber Material

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Green energy conversion & storage for solving India's energy problem through innovation in ultra large scale manufacturing and advanced research of solid state devices and systems

2012 International Conference on Emerging Electronics ◽

10.1109/icemelec.2012.6636220 ◽

2012 ◽

Cited By ~ 6

Author(s):

R. Singh ◽

G.F. Alapatt ◽

M. Abdelhamid

Keyword(s):

Solid State ◽

Energy Conversion ◽

Large Scale ◽

Green Energy ◽

Energy Problem ◽

Solid State Devices

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Frequency and temperature dependent dielectric properties of CuO-Polyvinyl alcohol polymer films

2012 International Conference on Emerging Electronics ◽

10.1109/icemelec.2012.6636259 ◽

2012 ◽

Cited By ~ 1

Author(s):

K.R Deepti ◽

B. Karthikeyan

Keyword(s):

Dielectric Properties ◽

Polyvinyl Alcohol ◽

Polymer Films ◽

Temperature Dependent

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2012 International Conference on Emerging ElectronicsLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Room temperature desorption of Self Assembly Monolayer (SAM) passivated Cu for lowering the process temperature Cu-Cu bonding of 3-D ICs

Power-efficiency trade-off in nanoscale thermoelectric energy conversion

High-temperature effects on device performance of a junctionless transistor

Assessing reliability of nano-scaled CMOS technologies one defect at a time

Fabrication and characterization of the ZnO-based Memristor

Electronic packaging challenges for emerging devices

[Front cover]

Bifacial photodetector using CZTS absorber material

Green energy conversion & storage for solving India's energy problem through innovation in ultra large scale manufacturing and advanced research of solid state devices and systems

Frequency and temperature dependent dielectric properties of CuO-Polyvinyl alcohol polymer films

2012 International Conference on Emerging Electronics
Latest Publications