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2012 4th Electronic System-Integration Technology Conference
Latest Publications
TOTAL DOCUMENTS
596
(FIVE YEARS 0)
H-INDEX
7
(FIVE YEARS 0)
Published By IEEE
9781467346443, 9781467346450, 9781467346436
Latest Documents
Most Cited Documents
Contributed Authors
Related Sources
Related Keywords
Latest Documents
Most Cited Documents
Contributed Authors
Related Sources
Related Keywords
Photonic sintering process of ink-jet printed conductive microstructures
2012 4th Electronic System-Integration Technology Conference
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10.1109/estc.2012.6542192
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2012
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Cited By ~ 1
Author(s):
Tomasz Falat
◽
Bartosz Platek
◽
Jan Felba
◽
Andrzej Moscicki
◽
Anita Smolarek
◽
...
Keyword(s):
Sintering Process
◽
Ink Jet
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Photonic Sintering
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Reinforced performance of lead-free Sn-8Zn-3Bi solder with doping of 0.03 wt.% C60 on Cu pads
2012 4th Electronic System-Integration Technology Conference
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10.1109/estc.2012.6542075
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2012
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Author(s):
Xiao Hu
◽
Pei Qin
◽
Y. C. Chan
Keyword(s):
Lead Free
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An approach to produce a stack of photo definable polyimide based flat UTCPs
2012 4th Electronic System-Integration Technology Conference
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10.1109/estc.2012.6542069
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2012
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Cited By ~ 3
Author(s):
S. Priyabadini
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T. Sterken
◽
L. Wang
◽
K. Dhaenens
◽
B. Vandecasteele
◽
...
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Investigating capacitor lifetimes under thermal stress
2012 4th Electronic System-Integration Technology Conference
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10.1109/estc.2012.6542199
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2012
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Author(s):
Jano Rajmond
◽
Pitica Dan
Keyword(s):
Thermal Stress
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The influence on reactive voltage of large scale wind power connected to grid
2012 4th Electronic System-Integration Technology Conference
◽
10.1109/estc.2012.6485926
◽
2012
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Author(s):
Lv Xiangyu
◽
Dong Tian
◽
Yuan Ye
◽
Li Dexin
◽
Han Xiaojuan
Keyword(s):
Wind Power
◽
Large Scale
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Integrated nano scale multilayer systems for reactive bonding in microsystems technology
2012 4th Electronic System-Integration Technology Conference
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10.1109/estc.2012.6542144
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2012
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Cited By ~ 2
Author(s):
J. Braeuer
◽
J. Besser
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M. Wiemer
◽
T. Gessner
Keyword(s):
Multilayer Systems
◽
Nano Scale
◽
Microsystems Technology
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Influence of liner-system and Cu-layer thickness on the grain structure of electroplated Cu
2012 4th Electronic System-Integration Technology Conference
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10.1109/estc.2012.6542072
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2012
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Cited By ~ 1
Author(s):
M. Mueller
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J. Kriz
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D. Meinhold
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T. Zerna
Keyword(s):
Layer Thickness
◽
Grain Structure
◽
Liner System
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Development of wearable medical system for dehydration detection
2012 4th Electronic System-Integration Technology Conference
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10.1109/estc.2012.6542216
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2012
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Cited By ~ 1
Author(s):
Jaromir Zak
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Dmitry Solovei
◽
Jiri Sedlacek
◽
Jaromir Hubalek
Keyword(s):
Medical System
◽
Wearable Medical
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Thermosonic-Adhesive flip-chip assembly
2012 4th Electronic System-Integration Technology Conference
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10.1109/estc.2012.6542161
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2012
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Cited By ~ 1
Author(s):
Guangbin Dou
◽
Andrew S. Holmes
Keyword(s):
Flip Chip
◽
Flip Chip Assembly
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Cost comparison between 3D and 2.5D integration
2012 4th Electronic System-Integration Technology Conference
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10.1109/estc.2012.6542130
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2012
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Cited By ~ 4
Author(s):
Dimitrios Velenis
◽
Mikael Detalle
◽
Yann Civale
◽
Erik Jan Marinissen
◽
Gerald Beyer
◽
...
Keyword(s):
Cost Comparison
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