2012 4th Electronic System-Integration Technology Conference
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9781467346443, 9781467346450, 9781467346436
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Cost comparison between 3D and 2.5D integration

2012 ◽  
Author(s):  
Dimitrios Velenis ◽  
Mikael Detalle ◽  
Yann Civale ◽  
Erik Jan Marinissen ◽  
Gerald Beyer ◽  
...  
Keyword(s):  
Cost Comparison

Reliability characterization of heavy wire bonding materials

2012 ◽  
Author(s):  
F. Naumann ◽  
J. Schischka ◽  
S. Koetter ◽  
E. Milke ◽  
M. Petzold
Keyword(s):  
Wire Bonding

Ageing behavior of printed flexible resistors by thermal, mechanical and electrical stresses

2012 ◽  
Author(s):  
Detlef Bonfert ◽  
Dieter Hemmetzberger ◽  
Gerhard Klink ◽  
Karlheinz Bock

scholarly journals An approach to produce a stack of photo definable polyimide based flat UTCPs

2012 ◽  
Author(s):  
S. Priyabadini ◽  
T. Sterken ◽  
L. Wang ◽  
K. Dhaenens ◽  
B. Vandecasteele ◽  
...  

Investigating capacitor lifetimes under thermal stress

2012 ◽  
Author(s):  
Jano Rajmond ◽  
Pitica Dan
Keyword(s):  
Thermal Stress

The influence on reactive voltage of large scale wind power connected to grid

2012 ◽  
Author(s):  
Lv Xiangyu ◽  
Dong Tian ◽  
Yuan Ye ◽  
Li Dexin ◽  
Han Xiaojuan
Keyword(s):  
Wind Power ◽  
Large Scale
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