Harsh Environment Electronics
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Published By Wiley-VCH Verlag Gmbh & Co. Kgaa

9783527813964, 9783527344192
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Transient Liquid Phase Bonding

2019 ◽  
pp. 263-292
Author(s):  
Tariq Islam ◽  
Ahmed Sharif
Keyword(s):  
Liquid Phase ◽  
Transient Liquid Phase ◽  
Transient Liquid Phase Bonding

Bi-Based Interconnect Systems and Applications

2019 ◽  
pp. 191-209
Author(s):  
Manifa Noor ◽  
Ahmed Sharif
Keyword(s):  
Interconnect Systems

Gold-Based Interconnect Systems for High-Temperature and Harsh Environments

2019 ◽  
pp. 167-190
Author(s):  
Ayesha Akter ◽  
Ahmed Sharif ◽  
Rubayyat Mahbub
Keyword(s):  
High Temperature ◽  
Harsh Environments ◽  
Interconnect Systems

Development of Zn-Al-x Ni Lead-Free Solders for High-Temperature Applications

2019 ◽  
pp. 115-133
Author(s):  
Sanjoy Mallick ◽  
Md Sharear Kabir ◽  
Ahmed Sharif
Keyword(s):  
High Temperature ◽  
Lead Free ◽  
Lead Free Solders ◽  
Temperature Applications

Study of Zn-Mg-Ag High-Temperature Solder Alloys

2019 ◽  
pp. 135-146
Author(s):  
Roisul H. Galib ◽  
Md. Ashif Anwar ◽  
Ahmed Sharif
Keyword(s):  
High Temperature ◽  
Solder Alloys ◽  
High Temperature Solder

Role of Alloying Addition in Zn-Based Pb-Free Solders

2019 ◽  
pp. 67-90
Author(s):  
Khairul Islam ◽  
Ahmed Sharif
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