Development of Zn-Al-x Ni Lead-Free Solders for High-Temperature Applications

2019 ◽  
pp. 115-133
Author(s):  
Sanjoy Mallick ◽  
Md Sharear Kabir ◽  
Ahmed Sharif
Keyword(s):  
High Temperature ◽  
Lead Free ◽  
Lead Free Solders ◽  
Temperature Applications

Shear Strength and Dsc Analysis of High-Temperature Solders

2013 ◽  
Vol 58 (2) ◽  
pp. 529-533 ◽  
Author(s):  
R. Koleňák ◽  
M. Martinkovič ◽  
M. Koleňáková
Keyword(s):  
Shear Strength ◽  
High Temperature ◽  
Lead Free ◽  
Dsc Analysis ◽  
Ultrasonic Activation ◽  
Metallic Substrates ◽  
Cu Substrate ◽  
Lead Free Solders

The work is devoted to the study of shear strength of soldered joints fabricated by use of high-temperature solders of types Bi-11Ag, Au-20Sn, Sn-5Sb, Zn-4Al, Pb-5Sn, and Pb-10Sn. The shear strength was determined on metallic substrates made of Cu, Ni, and Ag. The strength of joints fabricated by use of flux and that of joints fabricated by use of ultrasonic activation without flux was compared. The obtained results have shown that in case of soldering by use of ultrasound (UT), higher shear strength of soldered joints was achieved with most solders. The highest shear strength by use of UT was achieved with an Au-20Sn joint fabricated on copper, namely up to 195 MPa. The lowest average values were achieved with Pb-based solders (Pb-5Sn and Pb-10Sn). The shear strength values of these solders used on Cu substrate varied from 24 to 27 MPa. DSC analysis was performed to determine the melting interval of lead-free solders.

scholarly journals Reliability of High Temperature and Vibration in Sn3.5Ag and Sn0.7Cu Lead-free Solders

2012 ◽  
Vol 19 (3) ◽  
pp. 31-36 ◽  
Author(s):  
Yong-Ho Ko ◽  
Taek-Soo Kim ◽  
Young-Kyu Lee ◽  
Sehoo Yoo ◽  
Chang-Woo Lee
Keyword(s):  
High Temperature ◽  
Lead Free ◽  
Lead Free Solders

scholarly journals Lead-free relaxor thin films with huge energy density and low loss for high temperature applications

Nano Energy ◽  
2020 ◽  
Vol 71 ◽  
pp. 104536 ◽  
Author(s):  
A. Kursumovic ◽  
W.-W. Li ◽  
S. Cho ◽  
P.J. Curran ◽  
D.H.L. Tjhe ◽  
...  
Keyword(s):  
Thin Films ◽  
High Temperature ◽  
Energy Density ◽  
Lead Free ◽  
Low Loss ◽  
Temperature Applications

Microstructure and Sn Crystal Orientation Evolution in Sn-3.5Ag Lead-Free Solders in High-Temperature Packaging Applications

2013 ◽  
Vol 43 (1) ◽  
pp. 57-68 ◽  
Author(s):  
Bite Zhou ◽  
Govindarajan Muralidharan ◽  
Kanth Kurumadalli ◽  
Chad M. Parish ◽  
Scott Leslie ◽  
...  
Keyword(s):  
High Temperature ◽  
Crystal Orientation ◽  
Lead Free ◽  
Sn Crystal Orientation ◽  
Lead Free Solders

Lead-Free Ceramics with High Energy Density and Reduced Losses for High Temperature Applications

2017 ◽  
Vol 19 (6) ◽  
pp. 1700019 ◽  
Author(s):  
Tatiana Correia ◽  
Mark Stewart ◽  
Angela Ellmore ◽  
Knuth Albertsen
Keyword(s):  
High Temperature ◽  
Energy Density ◽  
High Energy ◽  
High Energy Density ◽  
Lead Free ◽  
Lead Free Ceramics ◽  
Temperature Applications
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