Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562)

2002 ◽

Cited By ~ 13

Author(s):

H. Windlass ◽

P.M. Raj ◽

D. Balaraman ◽

S.K. Bhattacharya ◽

R.R. Tummala

Keyword(s):

Colloidal Processing ◽

Ceramic Nanocomposites

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Low-CTE materials for printed wiring boards

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) ◽

10.1109/isaom.2001.916571 ◽

2002 ◽

Cited By ~ 6

Author(s):

T.M. Krziwanek

Keyword(s):

Printed Wiring Boards

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Getters: micromolecular scavengers for packaging [MEMS]

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) ◽

10.1109/isaom.2001.916575 ◽

2002 ◽

Cited By ~ 1

Author(s):

M. Previti ◽

K. Gilleo

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Interconnection technique of ALIVH/sup (R)/ substrate

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) ◽

10.1109/isaom.2001.916543 ◽

2002 ◽

Cited By ~ 5

Author(s):

T. Suzuki ◽

S. Tomekawa ◽

T. Ogawa ◽

D. Andoh ◽

M. Tanahashi ◽

...

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Moisture absorption in no-flow underfill materials and its effect on interfacial adhesion to solder mask coated FR4 printed wiring board

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) ◽

10.1109/isaom.2001.916597 ◽

2002 ◽

Cited By ~ 4

Author(s):

T.P. Ferguson ◽

Jianmin Qu

Keyword(s):

Interfacial Adhesion ◽

Moisture Absorption ◽

Printed Wiring Board ◽

Solder Mask ◽

Wiring Board

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Effects of temperatures above the glass transition on properties of plastic encapsulant materials

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) ◽

10.1109/isaom.2001.916549 ◽

2002 ◽

Cited By ~ 4

Author(s):

R.K. Lowry ◽

K. Hanley ◽

R. Berriche

Keyword(s):

Glass Transition

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The advantage of thin film technique in the application of spiral inductors and couplers [MCM]

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) ◽

10.1109/isaom.2001.916607 ◽

2002 ◽

Author(s):

J. Wolf ◽

F.J. Schmuckle ◽

D. Petter ◽

T. Kasap ◽

W. Heinrich ◽

...

Keyword(s):

Thin Film ◽

Spiral Inductors ◽

Thin Film Technique

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Influence of titanate and zirconate coupling agents in epoxy underfill material

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) ◽

10.1109/isaom.2001.916594 ◽

2002 ◽

Author(s):

Shijian Luo ◽

T. Yamashita ◽

C.P. Wong

Keyword(s):

Coupling Agents ◽

Underfill Material

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Behavior of electronically conductive filled adhesive joints under cyclic loading. I. Experimental approach

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) ◽

10.1109/isaom.2001.916540 ◽

2002 ◽

Cited By ~ 1

Author(s):

R. Gomatam ◽

E. Sancaktar ◽

D. Boismier ◽

D. Schue ◽

I. Malik

Keyword(s):

Cyclic Loading ◽

Experimental Approach ◽

Adhesive Joints

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Wet etch stop resist evaluation for MCM-D packaging

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) ◽

10.1109/isaom.2001.916553 ◽

2002 ◽

Author(s):

T.A. DeMercurio ◽

D.C. McHerron

Keyword(s):

Etch Stop ◽

Wet Etch

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Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562)
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Colloidal processing of polymer ceramic nanocomposites for integral capacitors

Low-CTE materials for printed wiring boards

Getters: micromolecular scavengers for packaging [MEMS]

Interconnection technique of ALIVH/sup (R)/ substrate

Moisture absorption in no-flow underfill materials and its effect on interfacial adhesion to solder mask coated FR4 printed wiring board

Effects of temperatures above the glass transition on properties of plastic encapsulant materials

The advantage of thin film technique in the application of spiral inductors and couplers [MCM]

Influence of titanate and zirconate coupling agents in epoxy underfill material

Behavior of electronically conductive filled adhesive joints under cyclic loading. I. Experimental approach

Wet etch stop resist evaluation for MCM-D packaging

Export Citation Format

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Colloidal processing of polymer ceramic nanocomposites for integral capacitors

Low-CTE materials for printed wiring boards

Getters: micromolecular scavengers for packaging [MEMS]

Interconnection technique of ALIVH/sup (R)/ substrate

Moisture absorption in no-flow underfill materials and its effect on interfacial adhesion to solder mask coated FR4 printed wiring board

Effects of temperatures above the glass transition on properties of plastic encapsulant materials

The advantage of thin film technique in the application of spiral inductors and couplers [MCM]

Influence of titanate and zirconate coupling agents in epoxy underfill material

Behavior of electronically conductive filled adhesive joints under cyclic loading. I. Experimental approach

Wet etch stop resist evaluation for MCM-D packaging

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562)
Latest Publications