2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME)
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9781467347600, 9781467347570
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Thermocouple attachment methods for PCB profiling during Vapour Phase Soldering

2012 ◽  
Author(s):  
Attila Geczy ◽  
Biborka Kvanduk ◽  
Balazs Illes ◽  
Zsolt Illyefalvi-Vitez
Keyword(s):  
Vapour Phase

Compact solution for mobile phono-cardiography

2012 ◽  
Author(s):  
F. Sandu ◽  
A. C. Stanca ◽  
A. I. Dumitru ◽  
C. Gerigan

Considerations regarding the radio design of GSM-R systems, inside railway tunnels

2012 ◽  
Author(s):  
Lacramioara Mihaela Nemtoi ◽  
Ilona Madalina Moise ◽  
Elena Alina Stanciu ◽  
Maria Claudia Surugiu

Real-time sensor acquisition interfacing using MatLAB

2012 ◽  
Author(s):  
Vlad Bande ◽  
Septimiu Pop ◽  
Ioan Ciascai ◽  
Dan Pitica
Keyword(s):  
Real Time
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