The 17th Annual SEMI/IEEE ASMC 2006 Conference
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91

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Application of Back-side Alignment of Thick Layers for the Manufacturing of Advanced Power Devices

The 17th Annual SEMI/IEEE ASMC 2006 Conference ◽

10.1109/asmc.2006.1638732 ◽

2006 ◽

Author(s):

Jung Kil Lee ◽

R. Chisholm ◽

M. van der Heijden ◽

K. Best ◽

P. ten Berge

Keyword(s):

Back Side ◽

Power Devices ◽

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Corporate Partnerships Establish an Asynchronous Learning Initiative with the University of the Philippines, College of Engineering

The 17th Annual SEMI/IEEE ASMC 2006 Conference ◽

10.1109/asmc.2006.1638784 ◽

2006 ◽

Author(s):

M.C. Saquilayan ◽

J. Tulao ◽

M.T. Benitez ◽

T. Hall ◽

R.P. Jensen ◽

...

Keyword(s):

The Philippines ◽

Asynchronous Learning ◽

College Of Engineering ◽

The University ◽

Corporate Partnerships

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Semi-quantitative Analysis Techniques for AMC Monitoring

The 17th Annual SEMI/IEEE ASMC 2006 Conference ◽

10.1109/asmc.2006.1638788 ◽

2006 ◽

Author(s):

Mei Leng Kwan ◽

C. Muller ◽

See Boon Tan ◽

R. Thomas

Keyword(s):

Quantitative Analysis ◽

Analysis Techniques

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A Best Known Method for Forming a Multi-Fab Cost Reduction Infrastructure and Applying Innovative Cost Reduction Techniques in Diffusion.

The 17th Annual SEMI/IEEE ASMC 2006 Conference ◽

10.1109/asmc.2006.1638791 ◽

2006 ◽

Author(s):

H. Hershkovitz ◽

M. Batra

Keyword(s):

Cost Reduction ◽

Reduction Techniques

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Simulation Study of Robust Dispatching Algorithm for Mixed VLSl Manufacturing

The 17th Annual SEMI/IEEE ASMC 2006 Conference ◽

10.1109/asmc.2006.1638754 ◽

2006 ◽

Author(s):

K. Saito

Keyword(s):

Simulation Study ◽

Dispatching Algorithm

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Infusion processing for advanced transistor manufacturing

The 17th Annual SEMI/IEEE ASMC 2006 Conference ◽

10.1109/asmc.2006.1638746 ◽

2006 ◽

Author(s):

W. Skinner ◽

M. Gwinn ◽

J. Hautala ◽

T. Kuroi

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Incorporating SIMS Structures in Product Wafers in Order to Perform SIMS and other Material Analysis and Achieve Wafer Level Information about the Front-End Processing

The 17th Annual SEMI/IEEE ASMC 2006 Conference ◽

10.1109/asmc.2006.1638717 ◽

2006 ◽

Author(s):

T. Budri ◽

L. Krott ◽

N. Patel ◽

A. Smith ◽

B. Gurcan ◽

...

Keyword(s):

Wafer Level ◽

Material Analysis ◽

Front End ◽

Level Information

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Deep Trench Top Collar Oxide Etching for DRAM Manufacturing

The 17th Annual SEMI/IEEE ASMC 2006 Conference ◽

10.1109/asmc.2006.1638761 ◽

2006 ◽

Author(s):

Guowen Zheng ◽

G. Skinner

Keyword(s):

Deep Trench ◽

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Methods for Fast Yield Learning in A DRAM Wafer Fab using a Remote Packaging and Test Site.

The 17th Annual SEMI/IEEE ASMC 2006 Conference ◽

10.1109/asmc.2006.1638748 ◽

2006 ◽

Author(s):

R. Trahan ◽

W. Hill ◽

R. Chapman ◽

A. Bicho ◽

N. Gumaer ◽

...

Keyword(s):

Test Site ◽

Wafer Fab ◽

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Cycle Time Approximations for the G/G/m Queue Subject to Server Failures and Cycle Time Offsets with Applications

The 17th Annual SEMI/IEEE ASMC 2006 Conference ◽

10.1109/asmc.2006.1638777 ◽

2006 ◽

Author(s):

J.R. Morrison ◽

D.P. Martin

Keyword(s):

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